Kelvin Contactors - BiTS Workshop

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®Electrical ParametersShunt Capacitance (G-S-G)Self Inductance30 femto Farad70 pico HenryRise Time (Same as Test System) 32 psDelay 1.5 ps9
Page 1 and 2: Burn-in & TestSocket WorkshopIEEEMa
Page 3 and 4: Burn-in & Test SocketWorkshopTechni
Page 5 and 6: Leadless Packages3/28/022
Page 7 and 8: Kelvin ContactorsKelvin contactors
Page 11 and 12: Kelvin Contactors for Leadless Devi
Page 13 and 14: Contactor Design - Technology(mm)Pa
Page 15 and 16: Contactor Design - Features3/28/021
Page 17 and 18: Contactor Design - Socket Arrangeme
Page 19 and 20: Contactor Design - Device Positioni
Page 21 and 22: Design Evaluation - Contact Springs
Page 23 and 24: Design Evaluation - Contact Resista
Page 25 and 26: Evaluation Results - Temperature Ac
Page 27 and 28: Design Evaluation - SummaryMechanic
Page 29 and 30: ®Problem DefinitionElectronic Capa
Page 31 and 32: ®Core TechnologyAfter Several Year
Page 33 and 34: ®®Our Name6
Page 35: ®Rise TimeTDT thru1.21.00.80.60.40
Page 39 and 40: ®Formulation DependentMaterial Pro
Page 41 and 42: ®Formulation DependentMaterial Pro
Page 43 and 44: ®PariPoser ® Components16
Page 45 and 46: ®10 GHz Test Socket18
Page 47 and 48: ®10 GHz Translation Socket20
Page 49 and 50: ®Summary Benefits of the PariPoser
Page 51 and 52: ELECTRO-CHEMICALCLEANING PROCESSMar
Page 53 and 54: TOPICS TO BE ADDRESSEDRemoval of Ti
Page 55 and 56: TIN LEAD DEPOSITSGold PlatingSolder
Page 57 and 58: ELECTRO-CHEMICAL CLEANINGPROCESSMet
Page 59 and 60: FIGURE 1Diagram of typical plating
Page 61 and 62: CollectionPlateELECTROCHEMICAL TRAN
Page 63 and 64: MID-PROCESS CONTACTCONDITIONSolderR
Page 65 and 66: BASE METAL DETECTIONA special solut
Page 67 and 68: LEAD FREE SOLDERLead Free Solder ca

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