Johnstech International - BiTS Workshop

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Decision drivers & common issues<strong>BiTS</strong> 2000PerformanceCostTo meet product requirement (freq, inductance, power, capacitance &resistance)ESD considerations; lower voltage is more sensitive to ESD (discuss insecond part of presentation)Pogo pin life span and quality Life span varies for different test specs, environment, temperatureand contamination (solder flakes, flux and solder mask)Pogo indentationmarkFig 7.Ball damageFig 8.Pin damageJCJCTanTanFebFeb20002000Fig 9. Inner pad damagedIntel ITTO Penang 9by pogo pin
<strong>BiTS</strong> 2000ESD ConsiderationsIntroduction:As the CPU voltage is going down therefore it becomes more sensitive to ESD ESD event is the transfer of electrostatic charges between bodies of surfacesthat are at different electrostatic potential. 2 ways of static charge generation on material : Triboelectric charging Induction The type of charge generated is a function of the relative positions of thematerial on the triboelectric series (Fermi-level) Can remain for extended periods of time, removed only by air ionization or agrounded path. ESD events are insidious and could be deadly to DUT but we cannotfeel it unless it is > 3500 V ESD can create latent failures that potentially cannot be screened out, butshow up as field failures.JCJCTanTanFebFeb20002000Intel ITTO Penang 10
Page 3 and 4: Presentations“Evaluation Of Test
Page 5 and 6: Agenda• Background• Requirement
Page 7 and 8: Requirement• 100% “Plug-n-Play
Page 9 and 10: Evaluation criteria (non-electrical
Page 11 and 12: Evaluation criteria (electrical)con
Page 13 and 14: Signal characteristicsAt 250 MHzOri
Page 15 and 16: JitteringAt 250 MHzOriginal socketS
Page 17 and 18: Signal distortionAt 250 MHzOriginal
Page 19 and 20: Parasitic component measurementSelf
Page 21 and 22: Parasitic component measurementSelf
Page 23 and 24: Evaluation criteria (reliability)
Page 25 and 26: Conclusionscont’d ….• This ri
Page 27 and 28: The Goal of SemiconductorManufactur
Page 29 and 30: Test System Issues forPoor OEE▼ T
Page 31 and 32: Reliability▼ Loose alignment syst
Page 33 and 34: Reliability▼ Wide alignment patte
Page 35 and 36: Short Rigid ContactExampleReliabili
Page 37 and 38: Repeatability▼ If the device lead
Page 39 and 40: Repeatability▼ The elastomeric el
Page 41 and 42: Resolution▼ Generic contactors al
Page 43 and 44: Resolution▼ Correction is develop
Page 45 and 46: Conclusion▼ Semiconductor manufac
Page 47 and 48: Agenda:BiTS 2000 Presentation objec
Page 49 and 50: Introduction:BiTS 2000Types of Test
Page 51 and 52: BiTS 2000Example of tool to predict
Page 53: Life span of pogo pin is determined
Page 57 and 58: How ESD is build up on TestContacto
Page 59 and 60: BiTS 2000Alternate methods to reduc
Page 61: BiTS 2000Summary: Selection of cont

Johnstech International - BiTS Workshop

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