Johnstech International - BiTS Workshop

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<strong>BiTS</strong> 2000Methods to minimize ESD Some of the preventive actions are: Installation of ionizer in handler Changing device handling components materials to ESD safe material Changing device pick up rubber suction cup inside handler todissipative material Grounding of moving parts to eliminate build up of tribo-charge Use of similar material for contacted parts Alternate methods to reduce ESDJCJCTanTanFebFeb20002000Intel ITTO Penang 13
<strong>BiTS</strong> 2000Alternate methods to reduce ESD in TCMethod 1: To Reduce Tribo-charges (limited data) Utilize contact material with close or similar “Fermi Energy Level”. Match contact surfaces with similar material, technology constraint. Difficulties - hard to find suitable materials that are similar Fermiand yet maintain good thermal, mechanical & electricalcharacteristics.PackagePackageClose MaterialTest contactorCoatedSurfaceTest ContactorFig 13.Coat contact surfacesFigJCJC 12.TanTan ContactFebFeb20002000 parts withwith similar materialIntel ITTO Penang 14similar materialFrom Keith / Kuek
Page 3 and 4:
Presentations“Evaluation Of Test
Page 5 and 6:
Agenda• Background• Requirement
Page 7 and 8: Requirement• 100% “Plug-n-Play
Page 9 and 10: Evaluation criteria (non-electrical
Page 11 and 12: Evaluation criteria (electrical)con
Page 13 and 14: Signal characteristicsAt 250 MHzOri
Page 15 and 16: JitteringAt 250 MHzOriginal socketS
Page 17 and 18: Signal distortionAt 250 MHzOriginal
Page 19 and 20: Parasitic component measurementSelf
Page 21 and 22: Parasitic component measurementSelf
Page 23 and 24: Evaluation criteria (reliability)
Page 25 and 26: Conclusionscont’d ….• This ri
Page 27 and 28: The Goal of SemiconductorManufactur
Page 29 and 30: Test System Issues forPoor OEE▼ T
Page 31 and 32: Reliability▼ Loose alignment syst
Page 33 and 34: Reliability▼ Wide alignment patte
Page 35 and 36: Short Rigid ContactExampleReliabili
Page 37 and 38: Repeatability▼ If the device lead
Page 39 and 40: Repeatability▼ The elastomeric el
Page 41 and 42: Resolution▼ Generic contactors al
Page 43 and 44: Resolution▼ Correction is develop
Page 45 and 46: Conclusion▼ Semiconductor manufac
Page 47 and 48: Agenda:BiTS 2000 Presentation objec
Page 49 and 50: Introduction:BiTS 2000Types of Test
Page 51 and 52: BiTS 2000Example of tool to predict
Page 53 and 54: Life span of pogo pin is determined
Page 55 and 56: BiTS 2000ESD ConsiderationsIntroduc
Page 57: How ESD is build up on TestContacto
Page 61: BiTS 2000Summary: Selection of cont
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Johnstech International - BiTS Workshop

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