Johnstech International - BiTS Workshop

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<strong>BiTS</strong> 2000Method 2: Increase Dissipation (limited data) Apply dissipative material with low resistivity or metal as testcontactor body. Localize embedded discharge path to neutralize the charges. Enhanced discharge with induction coil Apply a conductive material layerHigh electricfield discharge-- + +- + +-Fig 14. Localize embedded dischargepathFig 15. Inductive coil dischargepathFrom Keith/KuekJCJCTanTanFebFeb20002000Intel ITTO Penang 15
<strong>BiTS</strong> 2000Summary: Selection of contactor material and contact technology play a vital role inperformance requirements and cost of test contactor design. ESD also hasto be taken into consideration during design, and it has become one of themajor threat as the trend of CPU design is moving towards low voltage.Conclusion:Designer needs to balance between performance requirements and cost. Thefuture test contactor requires high performance, re-usable, long life span, lowcost and low in ESD.JCJCTanTanFebFeb20002000Intel ITTO Penang 16
Page 3 and 4:
Presentations“Evaluation Of Test
Page 5 and 6:
Agenda• Background• Requirement
Page 7 and 8:
Requirement• 100% “Plug-n-Play
Page 9 and 10: Evaluation criteria (non-electrical
Page 11 and 12: Evaluation criteria (electrical)con
Page 13 and 14: Signal characteristicsAt 250 MHzOri
Page 15 and 16: JitteringAt 250 MHzOriginal socketS
Page 17 and 18: Signal distortionAt 250 MHzOriginal
Page 19 and 20: Parasitic component measurementSelf
Page 21 and 22: Parasitic component measurementSelf
Page 23 and 24: Evaluation criteria (reliability)
Page 25 and 26: Conclusionscont’d ….• This ri
Page 27 and 28: The Goal of SemiconductorManufactur
Page 29 and 30: Test System Issues forPoor OEE▼ T
Page 31 and 32: Reliability▼ Loose alignment syst
Page 33 and 34: Reliability▼ Wide alignment patte
Page 35 and 36: Short Rigid ContactExampleReliabili
Page 37 and 38: Repeatability▼ If the device lead
Page 39 and 40: Repeatability▼ The elastomeric el
Page 41 and 42: Resolution▼ Generic contactors al
Page 43 and 44: Resolution▼ Correction is develop
Page 45 and 46: Conclusion▼ Semiconductor manufac
Page 47 and 48: Agenda:BiTS 2000 Presentation objec
Page 49 and 50: Introduction:BiTS 2000Types of Test
Page 51 and 52: BiTS 2000Example of tool to predict
Page 53 and 54: Life span of pogo pin is determined
Page 55 and 56: BiTS 2000ESD ConsiderationsIntroduc
Page 57 and 58: How ESD is build up on TestContacto
Page 59: BiTS 2000Alternate methods to reduc
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Johnstech International - BiTS Workshop

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