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Trends in Lithography - JePPIX

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80 nm Dense L<strong>in</strong>es - Dipole<br />

F - 0.2 F - 0.1 F 0.0 F + 0.1 F + 0.2<br />

F - 0.25<br />

F - 0.3<br />

CD (nm)<br />

95<br />

90<br />

85<br />

80<br />

75<br />

70<br />

65<br />

60<br />

55<br />

50<br />

-0.60 -0.40 -0.20 0.00 0.20 0.40 0.60<br />

focus<br />

B<strong>in</strong>ary Mask Pitch = 160 nm<br />

NA = 0.75, σ = 0.88/0.64, Dipole<br />

Illum<strong>in</strong>ation<br />

Public<br />

Resist thickness = 210nm<br />

21.9<br />

22.2<br />

22.5<br />

22.8<br />

23.1<br />

23.4<br />

23.7<br />

24.0<br />

24.3<br />

24.6<br />

24.9<br />

25.2<br />

25.5<br />

25.8<br />

26.1<br />

F + 0.25<br />

F + 0.3

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