Performance Verification Test Record - LeCroy

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TIP RETAINING CLIP REMOVAL WaveLink Series Differential Probe (13-25 GHz) Remove the Retaining Clip from the board by pulling on the tab of the adhesive pad. The clip can now be removed easily without leaving any adhesive residue and can be used in another application using a new adhesive pad. Figure 5-6. Removing the Retaining Clip Platform/Cable Assembly Mounting Kit Platform/Cable Assembly Mounting Kit (PK600ST-4) can be used to support to the Platform/Cable Assembly and relieve stress on interconnect leads when the test points are located close to the edge of the board under test. The PK600ST-4 includes one Board Edge Clip and four Adhesive Backed Platform/Cable Assembly Clamps explained in the following sections. WL-HBW-OM-E RevC 42
PLATFORM/CABLE ASSEMBLY BOARD EDGE CLIP The Platform/Cable Assembly Location Clip can be used to give support to the probe and Interconnect Lead when the test points are located close to the edge of the board under test. It's also useful for holding the probe assembly while soldering the solder-in interconnect lead to your device under test. Slide the probe cable into the clamp opening and move the probe so that the probe’s strain relief is located in the opening. Close the clamp. Figure 5-7. Slide the Probe into the Board Edge Clip 43 WL-HBW-OM-E RevC
Page 1 and 2: Operator’s Manual WaveLink Series
Page 3 and 4: LeCroy Corporation 700 Chestnut Rid
Page 5 and 6: Accessory Overview ................
Page 7 and 8: Introduction LeCroy’s WaveLink 13
Page 9 and 10: Platform/Cable Assembly, Amplifier
Page 11 and 12: Figure 3-2. WL-2.92MM The Platform/
Page 13 and 14: Since a pure distributed amplifier
Page 15 and 16: Amplifier Modules (includes solder-
Page 17 and 18: Two replacement resistive tips are
Page 19 and 20: This simplifies the purchase of cor
Page 21 and 22: Handling the Probe The WaveLink ser
Page 23 and 24: Connecting an Amplifier Module to a
Page 25 and 26: � If utilizing the probe with an
Page 27 and 28: Tip Select Make the appropriate sel
Page 29 and 30: Solder-In Interconnect Lead The Sol
Page 31 and 32: 2. Now, bend the tips in toward the
Page 33 and 34: Various attachments and extenders a
Page 35 and 36: AutoColor ID and Power Control Indi
Page 37 and 38: EZ Probe Positioner The EZ Probe Po
Page 39 and 40: Dxx0-PT-XYZ-POSITIONER This positio
Page 41: MOVING AND POSITIONING Always apply
Page 45 and 46: Probe Deskew Fixture The Probe Desk
Page 47 and 48: Replacing Damping Resistors on the
Page 49 and 50: 4. Verify the following dimensions
Page 51 and 52: Occasionally check the overall resi
Page 53 and 54: PLEASE NOTE THE FOLLOWING: � Tips
Page 55 and 56: Service Strategy Defective probes o
Page 57 and 58: Description and Initial Product Cod
Page 59 and 60: Description and Initial Product Cod
Page 61 and 62: Service Option Product Code Three-Y
Page 63 and 64: 3. Turn on the channel correspondin
Page 65 and 66: 14. Verify the screen shows a squar
Page 67 and 68: If the probe package includes probe
Page 69 and 70: Description Minimum Requirements Te
Page 71 and 72: 8. After a warm-up time of at least
Page 73 and 74: connected channel has the correct B
Page 75 and 76: � Unplug the BNC to Banana Plug A
Page 77 and 78: 3. Connect the SI Probe tip to the
Page 79 and 80: You can also find contact informati
Page 81 and 82: Safety Requirements CAUTION Avoid p
Page 83 and 84: These circuits represent the aggreg
Page 85 and 86: Figure 9-3. Typical probe input imp
Page 87 and 88: Probe Impedance - LeCroy Dxx05 Prob
Page 89 and 90: Exceeding the common mode range can
Page 91 and 92: Offset Offset for D1305, D1605, D20
Page 93 and 94:
Attenuation Accuracy Step Descripti
Page 95 and 96:
O operating environment, 81 Operati
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Performance Verification Test Record - LeCroy

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