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224 W.-Y. Loh<br />

Regression coefficient for Mask<br />

Regression coefficients for Pad<br />

0.5 1.0 1.5 2.0 2.5<br />

0.0 0.5<br />

Solder thick<br />

Solder thick<br />

Mask B6<br />

Mask B3<br />

Mask A3<br />

Solder thin<br />

Opening small<br />

Pad D6<br />

Pad D7<br />

Pad L4<br />

Solder thin<br />

Opening small<br />

Pad L6<br />

Pad L7<br />

Pad L8<br />

Pad L9<br />

Pad W4<br />

Pad W9<br />

Fig 13. Plots of regression coefficients for Mask and Pad from Table 5.<br />

Solder thin<br />

Opening not small<br />

Solder thin<br />

Opening not small<br />

four-factor and higher interactions are negligible. On the other hand, the graphs in<br />

Figure 13 suggest that there may exist some weak three-factor interactions, such<br />

as between Solder, Opening, and Pad. Figure 14, which compares the fits of this<br />

model with those of the Chambers-Hastie model, shows that the former fits slightly<br />

better.<br />

6. Logistic regression<br />

The same ideas can be applied to fit logistic regression models when the response<br />

variable is a sample proportion. For example, Table 6 shows data reported in Collett<br />

[9, p. 127] on the number of seeds germinating, out of 100, at two germination<br />

temperatures. The seeds had been stored at three moisture levels and three storage<br />

temperatures. Thus the experiment is a 2×3×3 design.<br />

Treating all the factors as nominal, Collett [9, p. 128] finds that a linear logistic

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