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Annex I - VERTIC

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▼M2<br />

1. Coating Process (1) (*) 2. Substrate 3. Resultant Coating<br />

B. Thermal-Evaporation<br />

Physical Vapour<br />

Deposition (TE-PVD)<br />

B.1. Physical Vapour<br />

Deposition (PVD):<br />

Electron-Beam (EB-<br />

PVD)<br />

Cemented tungsten carbide<br />

(16), Silicon carbide (18)<br />

Molybdenum and<br />

Molybdenum alloys<br />

Beryllium and Beryllium<br />

alloys<br />

Sensor window materials<br />

(9)<br />

Carbides<br />

Tungsten<br />

Mixtures thereof (4)<br />

Dielectric layers (15)<br />

Dielectric layers (15)<br />

Dielectric layers (15)<br />

Diamond<br />

Diamond-like carbon (17)<br />

Dielectric layers (15)<br />

Diamond<br />

Diamond-like carbon (17)<br />

‘Superalloys’ Alloyed silicides<br />

Alloyed aluminides (2)<br />

MCrAlX (5)<br />

Modified zirconia (12)<br />

Silicides<br />

Aluminides<br />

Mixtures thereof (4)<br />

Ceramics (19) and Low-<br />

expansion glasses (14)<br />

Dielectric layers (15)<br />

Corrosion resistant steel (7) MCrAlX (5)<br />

Modified zirconia (12)<br />

Mixtures thereof (4)<br />

Carbon-carbon, Ceramic<br />

and Metal ‘matrix’ ‘composites’<br />

Cemented tungsten carbide<br />

(16), Silicon carbide (18)<br />

Molybdenum and<br />

Molybdenum alloys<br />

Beryllium and Beryllium<br />

alloys<br />

Sensor window materials<br />

(9)<br />

2009R0428 — EN — 15.06.2012 — 002.001 — 139<br />

Silicides<br />

Carbides<br />

Refractory metals<br />

Mixtures thereof (4)<br />

Dielectric layers (15)<br />

Boron nitride<br />

Carbides<br />

Tungsten<br />

Mixtures thereof (4)<br />

Dielectric layers (15)<br />

Dielectric layers (15)<br />

Dielectric layers (15)<br />

Borides<br />

Beryllium<br />

Dielectric layers (15)

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