Annex I - VERTIC

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▼M2 ACRONYMS AND ABBREVIATIONS USED IN THIS ANNEX An acronym or abbreviation, when used as a defined term, will be found in ‘Definitions of Terms used in this <strong>Annex</strong>’. Acronym or abbreviation Meaning ABEC Annular Bearing Engineers Committee AGMA American Gear Manufacturers’ Association AHRS attitude and heading reference systems AISI American Iron and Steel Institute ALU arithmetic logic unit ANSI American National Standards Institute ASTM the American Society for Testing and Materials ATC air traffic control AVLIS atomic vapour laser isotope separation CAD computer-aided-design CAS Chemical Abstracts Service CCITT International Telegraph and Telephone Consultative Committee CDU control and display unit CEP circular error probable CNTD controlled nucleation thermal deposition CRISLA chemical reaction by isotope selective laser activation. CVD chemical vapour deposition CW chemical warfare CW (for lasers) continuous wave DME distance measuring equipment DS directionally solidified EB-PVD electron beam physical vapour deposition EBU European Broadcasting Union ECM electro-chemical machining ECR electron cyclotron resonance EDM electrical discharge machines EEPROMS electrically erasable programmable read only memory EIA Electronic Industries Association EMC electromagnetic compatibility ETSI European Telecommunications Standards Institute FFT Fast Fourier Transform 2009R0428 — EN — 15.06.2012 — 002.001 — 24
▼M2 Acronym or abbreviation Meaning GLONASS global navigation satellite system GPS global positioning system HBT hetero-bipolar transistors HDDR high density digital recording HEMT high electron mobility transistors ICAO International Civil Aviation Organisation IEC International Electro-technical Commission IEEE Institute of Electrical and Electronic Engineers IFOV instantaneous-field-of-view ILS instrument landing system IRIG inter-range instrumentation group ISA international standard atmosphere ISAR inverse synthetic aperture radar ISO International Organisation for Standardisation ITU International Telecommunication Union JIS Japanese Industrial Standard JT Joule-Thomson LIDAR light detection and ranging LRU line replaceable unit MAC message authentication code Mach ratio of speed of an object to speed of sound (after Ernst Mach) MLIS molecular laser isotopic separation MLS microwave landing systems MOCVD metal organic chemical vapour deposition MRI magnetic resonance imaging MTBF mean-time-between-failures Mtops million theoretical operations per second MTTF mean-time-to-failure NBC Nuclear, Biological and Chemical NDT non-destructive test PAR precision approach radar PIN personal identification number ppm parts per million PSD power spectral density 2009R0428 — EN — 15.06.2012 — 002.001 — 25
Page 1 and 2: This document is meant purely as a
Page 3 and 4: ▼B (7) Common lists of dual-use i
Page 5 and 6: ▼B (19) Each Member State should
Page 7 and 8: ▼B CHAPTER II SCOPE Article 3 1.
Page 9 and 10: ▼B Article 6 1. The transit of no
Page 11 and 12: ▼B (c) not be used if the exporte
Page 13 and 14: ▼B (d) considerations about inten
Page 15 and 16: ▼B 3. Without prejudice to any po
Page 17 and 18: ▼B (b) the quantity of the dual-u
Page 19 and 20: ▼B ▼M1 ▼B ▼M1 2. The Chair
Page 21 and 22: ▼M2 ANNEX I List referred to in A
Page 23: ▼M2 Controls on ‘technology’
Page 27 and 28: ▼M2 DEFINITIONS OF TERMS USED IN
Page 29 and 30: ▼M2 ‘Civil aircraft’ (1 3 4 7
Page 31 and 32: ▼M2 ‘Dynamic signal analysers
Page 33 and 34: ▼M2 ‘Fusible’ (1) means capab
Page 35 and 36: ▼M2 ‘Local area network’ (4 5
Page 37 and 38: ▼M2 ‘Natural uranium’ (0) mea
Page 39 and 40: ▼M2 ‘Radar frequency agility’
Page 41 and 42: ▼M2 ‘Signal processing’ (3 4
Page 43 and 44: ▼M2 ‘Time constant’ (6) is th
Page 45 and 46: ▼M2 CATEGORY 0 NUCLEAR MATERIALS,
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Page 57 and 58: ▼M2 0C Materials 0C001 ‘Natural
Page 59 and 60: ▼M2 0D Software 0D001 ‘Software
Page 61 and 62: ▼M2 CATEGORY 1 SPECIAL MATERIALS
Page 63 and 64: ▼M2 1A002 Note 2: (continued) b.
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Page 67 and 68: ▼M2 1A202 Composite structures, o
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▼M2 1C001 a. Note 1: (continued)
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▼M2 1C002 b. (continued) 2. Niobi
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▼M2 1C003 c. 3. (continued) b. An
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▼M2 1C006 d. (continued) 3. In a
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▼M2 1C008 (continued) b. Thermopl
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▼M2 1C010 (continued) e. Fully or
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▼M2 1C012 a. Note: (continued) b.
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▼M2 1C111 a. 3. d. (continued) Te
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▼M2 1C111 c. 6. (continued) k. Di
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▼M2 1C210 a. (continued) 2. A ‘
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▼M2 1C235 Tritium, tritium compou
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▼M2 1C350 (continued) 36. Methyl
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▼M2 1C351 a. (continued) 29. Rift
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▼M2 1C352 a. (continued) 2. Avian
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▼M2 1C354 (continued) c. Fungi, w
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▼M2 1C450 b. (continued) Note 2:
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▼M2 1E Technology 1E001 ‘Techno
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▼M2 CATEGORY 2 MATERIALS PROCESSI
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▼M2 2A225 a. 2. (continued) h. Yt
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▼M2 2B 5. (continued) f. If any a
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▼M2 2B001 c. Note: (continued) b.
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▼M2 2B005 Equipment specially des
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▼M2 2B006 b. 1. (continued) c. Me
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▼M2 2B104 ‘Isostatic presses’
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▼M2 2B120 (continued) c. Having a
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▼M2 2B204 a. (continued) 2. A cha
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▼M2 2B226 Controlled atmosphere (
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▼M2 2B350 a. (continued) 2. Fluor
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▼M2 2B350 f. (continued) 2. Nicke
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▼M2 2B351 Toxic gas monitoring sy
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▼M2 2C Materials None. 2009R0428
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▼M2 1. Coating Process (1) (*) 2.
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▼M2 1. Coating Process (1) (*) 2.
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▼M2 3. The term ‘noble metal mo
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▼M2 Specific TE-PVD processes are
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▼M2 CATEGORY 3 ELECTRONICS 2009R0
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▼M2 3A001 a. (continued) 2. ‘Mi
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▼M2 3A001 a. 5. (continued) Techn
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▼M2 3A001 b. 1. Note 1: (continue
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▼M2 3A001 b. (continued) 4. Micro
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▼M2 3A001 b. 10. (continued) b. A
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▼M2 3A001 e. 1. (continued) 3. Fo
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▼M2 3A001 h. (continued) 3. Conti
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▼M2 3A002 a. (continued) 6. Digit
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▼M2 3A002 g. (continued) 3. Non-
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▼M2 3A225 Frequency changers or g
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▼M2 3A232 (continued) b. Arrangem
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▼M2 3B001 e. (continued) 2. Desig
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▼M2 3C Materials 3C001 Hetero-epi
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▼M2 CATEGORY 4 COMPUTERS 2009R042
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▼M2 4A003 Note 1: (continued) —
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▼M2 4B Test, Inspection and Produ
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▼M2 4D Software Note: The control
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▼M2 TECHNICAL NOTE ON ‘ADJUSTED
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▼M2 CATEGORY 5 TELECOMMUNICATIONS
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▼M2 5A001 b. 1. (continued) d. Us
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▼M2 5A001 f. (continued) 3. Explo
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▼M2 5C1 Materials None 2009R0428
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▼M2 5E1 Technology 5E001 ‘Techn
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▼M2 5E001 d. (continued) 6. Rated
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▼M2 c. When necessary, details of
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▼M2 5A002 Note: a. 1. (continued)
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▼M2 5B2 Test, Inspection and Prod
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▼M2 5D2 Software 5D002 ‘Softwar
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▼M2 CATEGORY 6 SENSORS AND LASERS
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▼M2 6A001 a. 1. a. 2. (continued)
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▼M2 6A001 a. 1. e. (continued) 3.
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▼M2 6A001 a. 2. (continued) e. Bo
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▼M2 6A002 a. 2. a. (continued) 2.
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▼M2 6A002 a. 3. Note: c. (continu
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▼M2 6A002 a. 3. g. (continued) 3.
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▼M2 6A003 a. (continued) 2. Mecha
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▼M2 6A004 d. 3. (continued) c. An
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▼M2 6A005 a. 5. (continued) b. Mu
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▼M2 6A005 b. 6. (continued) b.
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▼M2 6A005 (continued) d. Other
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▼M2 6A005 d. 1. e. 2. (continued)
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▼M2 6A005 f. (continued) 1. Dynam
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▼M2 6A007 Gravity meters (gravime
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▼M2 6A008 j. (continued) Note 3:
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▼M2 6A108 (continued) Technical N
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▼M2 6A225 Velocity interferometer
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▼M2 6C Materials 6C002 Optical se
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▼M2 6D Software 6D001 ‘Software
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▼M2 7A Systems, Equipment and Com
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▼M2 7A003 (continued) c. Inertial
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▼M2 7A101 (continued) Note: 7A101
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▼M2 7A105 b. (continued) 3. Being
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▼M2 7B102 Reflectometers speciall
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▼M2 7E102 ‘Technology’ for pr
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▼M2 8A Systems, Equipment and Com
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▼M2 8A002 Marine systems, equipme
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▼M2 8A002 i. 1. (continued) b. Ta
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▼M2 8A002 (continued) o. Propelle
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▼M2 8B Test, Inspection and Produ
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▼M2 CATEGORY 9 AEROSPACE AND PROP
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▼M2 9A005 Liquid rocket propulsio
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▼M2 9A010 (continued) c. Structur
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▼M2 9A106 d. (continued) Note: Th
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▼M2 9A350 Spraying or fogging sys
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▼M2 9B007 Equipment specially des
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▼M2 9C Materials 9C108 ‘Insulat
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▼M2 9D103 ‘Software’ speciall
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▼M2 9E003 a. 5. (continued) Techn
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▼M2 9E003 f. 2. (continued) c. Va
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▼M1 ▼B ▼M1 ▼B ANNEX IIa UNI
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▼M1 ANNEX IIb UNION GENERAL EXPOR
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▼M1 ANNEX IIc UNION GENERAL EXPOR
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▼M1 (2) the exporter is aware tha
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▼M1 Part 2 - Destinations This au
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▼M1 ANNEX IIe UNION GENERAL EXPOR
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▼M1 ANNEX IIf UNION GENERAL EXPOR
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▼M1 4. N,N-Dialkyl [methyl, ethyl
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▼M1 ANNEX IIg (List referred to i
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▼B 2009R0428 — EN — 15.06.201
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▼B ANNEX IIIb (model for brokerin
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▼B ANNEX IV (List referred to in
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▼B 6A001.a.2.e. Bottom or bay cab
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▼B 9A106.c. Systems or components
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▼B — 0C002: this item is not in
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▼B 6A203 Cameras and components,
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▼B ANNEX VI Correlation Table Reg
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Annex I - VERTIC

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