The Importance of Nanotechnology and Nanometrology for Space ...
The Importance of Nanotechnology and Nanometrology for Space ...
The Importance of Nanotechnology and Nanometrology for Space ...
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<strong>The</strong> <strong>Importance</strong> <strong>of</strong> <strong>Nanotechnology</strong> <strong>and</strong> <strong>Nanometrology</strong><br />
<strong>for</strong> <strong>Space</strong> Instrumentation.<br />
MIT<br />
Mark L. Schattenburg<br />
Massachusetts Institute <strong>of</strong> Technology<br />
<strong>Space</strong> <strong>Nanotechnology</strong> Laboratory<br />
Center <strong>for</strong> <strong>Space</strong> Research<br />
<strong>Space</strong> Nano-technology Workshop<br />
Tsukuba <strong>Space</strong> Center<br />
National <strong>Space</strong> Development Agency <strong>of</strong> Japan<br />
Tsukuba, Japan<br />
November 27, 2001<br />
<br />
Massachusetts Institute <strong>of</strong> Technology
MIT<br />
MOTIVATION<br />
Goal <strong>of</strong> our laboratory: improve per<strong>for</strong>mance <strong>of</strong> astrophysics instrumentation.<br />
• Weak signals from space motivate ultra-sensitive instruments.<br />
High launch costs motivate highest per<strong>for</strong>mance with lowest possible mass.<br />
• Many useful phenomena occur when structure size <strong>and</strong> placement accuracy is below<br />
the wavelength <strong>of</strong> light, into the nanometer regime.<br />
• Nanostructures need special considerations to survive stress <strong>of</strong> space (launch vibration,<br />
heat/cold) <strong>and</strong> not be destroyed or lose dimensional accuracy. (Use size hierarchy <strong>and</strong><br />
kinematic mounting.)<br />
• Extreme need <strong>for</strong> high quality <strong>and</strong> manufacturability. <strong>Nanometrology</strong> is key to success<br />
<strong>for</strong> process control (interferometry, SEM <strong>and</strong> AFM).<br />
• Our lab has developed novel nanostructure technologies applied to nine NASA<br />
missions <strong>and</strong> others under development. Three missions are described:<br />
Ch<strong>and</strong>ra x-ray telescope.<br />
IMAGE mission neutral atom camera.<br />
Constellation X x-ray telescope mission development.<br />
<br />
Massachusetts Institute <strong>of</strong> Technology
MLS-01-03-14.02<br />
NASA Ch<strong>and</strong>ra Observatory X-ray Telescope<br />
Per<strong>for</strong>ms high-resolution x-ray imaging <strong>and</strong> spectroscopy in the<br />
energy range <strong>of</strong> 0.1-10 keV (wavelengths from 0.1 to 10 nanometers).<br />
Subrahmanyan<br />
Ch<strong>and</strong>rasekhar<br />
(1910-1995)<br />
Nobel Prize, 1983
CXC<br />
Ch<strong>and</strong>ra X-Ray Observatory<br />
Crab Nebula
cc_GrazingIncidence.ai<br />
θ c<br />
Principles <strong>of</strong> X-ray Optics at Grazing Incidence<br />
Refractive index <strong>for</strong> x-ray radiation:<br />
n(<br />
ω) = 1−<br />
δ ( ω)<br />
+ iβ<br />
( ω)<br />
where δ , β ∼<br />
Critical angle <strong>for</strong> total external reflection <strong>of</strong> x-rays:<br />
n = 1−<br />
δ + iβ<br />
θ<br />
Critical Ray<br />
Grazing Incidence Radiation <strong>and</strong><br />
Total External Reflection<br />
θ = 2δ<br />
c<br />
Totally<br />
Reflected<br />
Rays<br />
Reflectivity<br />
~10 -2<br />
1<br />
0.8<br />
0.6<br />
0.4<br />
0.2<br />
C<br />
A<br />
B<br />
D E<br />
0.5 1 1.5 2 2.5 3<br />
θ / θ c<br />
10 -4<br />
A : β / δ = 0<br />
B : β / δ = 10<br />
C : β / δ = 10<br />
D : β / δ = 1<br />
E : β / δ = 3<br />
−2<br />
−1
MLS-2001-05-23.01.eps<br />
X-rays<br />
Ch<strong>and</strong>ra Observatory Grazing Incidence Optics<br />
(Wolter Type I)<br />
Nested<br />
Hyperboloids<br />
Nested<br />
Paraboloids<br />
1.1 Meter Diameter<br />
Doubly-<br />
Reflected<br />
X-rays<br />
10 Meters<br />
Focal<br />
Plane
Ch<strong>and</strong>ra-Mirror.eps<br />
Ch<strong>and</strong>ra X-ray Telescope Mirror Assembly<br />
Raytheon Optical Systems & Eastman Kodak Corp.
HETGS<br />
NASA Ch<strong>and</strong>ra Observatory X-ray Telescope<br />
High Energy Transmission Grating Spectrometer (HETGS)<br />
Aspect Camera<br />
Stray Light Shade<br />
High Resolution<br />
Mirror Assembly<br />
(HRMA)<br />
Sunshade<br />
Door<br />
Thrusters (4)<br />
(105 lb)<br />
Low Gain<br />
Antenna (2)<br />
<strong>Space</strong>craft<br />
Module<br />
Transmission<br />
Gratings (2)<br />
Optical<br />
Bench<br />
Ch<strong>and</strong>ra Telescope<br />
X-rays<br />
X-ray<br />
mirrors<br />
P H<br />
Grating<br />
(in use)<br />
Solar Array (2)<br />
CCD Imaging<br />
Spectrometer<br />
(ACIS)<br />
High Resolution<br />
Camera (HRC)<br />
Integrated Science<br />
Instrument Module<br />
(ISIM)<br />
Grating<br />
(stowed)<br />
CCD1 CCD2 CCD3 CCD4 CCD5 CCD6<br />
HETGS Instrument<br />
X-ray CCD<br />
Detector array<br />
θ<br />
Zero-order beams<br />
Diffracted beams<br />
Rowl<strong>and</strong> Torus Transmission Grating Geometry <strong>and</strong> CCD Readout Array
MLS-2001-05-11.01eps<br />
NASA Ch<strong>and</strong>ra X-ray Observatory<br />
High Energy Transmission Grating Spectrometer (HETGS)<br />
HETGS instrument.<br />
1.1 meter<br />
Invar grating frame.<br />
3 cm<br />
Scanning electron micrograph <strong>of</strong> gold grating.<br />
100 nm<br />
550 nm
MLS-1994-02-16.eps<br />
Bacterium<br />
130 nm<br />
Advanced<br />
Commercial Chip<br />
(MOS Transistor)<br />
λ~500 nm<br />
Visible Light<br />
21,000X Magnification<br />
Human<br />
Chromosome Human Hair<br />
(~50 µm diam.)<br />
100 nm<br />
Ch<strong>and</strong>ra X-ray<br />
Transmission Grating
MLS-2001-05-24.01.eps<br />
0.6 µm<br />
1.0 µm<br />
Pi-Phase-Shifting Transmission Grating Design<br />
100 nm<br />
polyimide<br />
gold<br />
grating<br />
polyimide<br />
membrane<br />
Transmission Grating Design<br />
adhesive<br />
Invar<br />
frame<br />
5 nm Chrome<br />
20 nm Gold<br />
x rays<br />
φ i<br />
φ bar - φ space ~π<br />
gold<br />
bars<br />
Bars shift phase x-rays by ~π<br />
zero order ~0<br />
first order maximized
Capella-2.eps<br />
Ch<strong>and</strong>ra Observatory X-ray Spectrum <strong>of</strong> Binary Star Capella<br />
Counts/Bin<br />
100<br />
50<br />
0<br />
0.5<br />
Raw x-ray spectra.<br />
1.0<br />
λ/∆λ=<br />
1000<br />
1.5<br />
X-ray Wavelength (nanometers)<br />
2.0
E0102-72.eps<br />
Ch<strong>and</strong>ra X-ray Spectrum<br />
Small Magellanic Cloud Supernova Remant E0102-72<br />
Direct X-ray Image (CCD Camera)<br />
longer wavelengths <br />
shorter wavelengths<br />
X-ray Image Dispersed by Transmission Gratings<br />
Zero<br />
Order
MLS-99-05-26.03<br />
mirror<br />
variable<br />
attenuator<br />
beamsplitter<br />
p = λ<br />
2 sinθ<br />
Interference Lithography<br />
beamsplitter<br />
spatial filters<br />
2θ<br />
Pockels cell<br />
substrate<br />
laser beam<br />
λ = 351.1 nm<br />
phase error<br />
sensor<br />
mirror
MLS-94-05-13.01<br />
15 nm<br />
Ta 2 O 5<br />
0.5-1.0 µm<br />
ARC<br />
5 nm chromium<br />
20 nm gold<br />
200 nm<br />
resist<br />
0.5-1.0 µm<br />
polyimide µ<br />
d<br />
silicon wafer<br />
silicon<br />
(a) Prepare substrate.<br />
polyimide<br />
Membrane-Supported Transmission Grating<br />
Fabrication Process - Macro View<br />
(b) Pattern gold grating.<br />
gold<br />
grating<br />
(c) Acid spin-etch wafer<br />
backside.<br />
adhesive<br />
(d) Bond to Invar frame.<br />
(e) Cut away.<br />
silicon<br />
Invar<br />
frame
MLS-94-05-13.02<br />
resist<br />
ARC<br />
polyimide<br />
silicon<br />
ARC<br />
polyimide<br />
silicon<br />
(b) Pattern by IL<br />
<strong>and</strong> develop.<br />
Membrane-Supported Transmission Grating<br />
Fabrication Process - Micro View<br />
(a) Prepare<br />
substrate.<br />
interlayer<br />
plating<br />
base<br />
ARC<br />
polyimide<br />
silicon<br />
(c) Etch interlayer in<br />
CF 4 RIE plasma.<br />
polyimide<br />
silicon<br />
(d) Etch ARC in O 2<br />
RIE plasma.<br />
plated gold<br />
polyimide<br />
silicon<br />
(e) Gold electroplate.<br />
plated<br />
gold<br />
polyimide<br />
silicon<br />
(f) Strip interlayer<br />
<strong>and</strong> ARC.<br />
polyimide<br />
epoxy<br />
Invar<br />
(g) Acid spin-etch<br />
substrate.<br />
Align <strong>and</strong> bond<br />
to frames.
MLS-2001-05-25.02.eps<br />
Reflectivity from Resist/IL Boundary<br />
0.5<br />
0.4<br />
0.3<br />
0.2<br />
0.1<br />
0<br />
Gold Transmission Grating Fabrication Process<br />
Benefit <strong>of</strong> anti-reflection coating (ARC).<br />
Resist<br />
ARC<br />
Silicon<br />
Ta 2 O 5<br />
200 nm period<br />
λ = 351.1. nm<br />
TE polarization<br />
0 200 400 600 800<br />
ARC Thickness (nm)<br />
Grating after oxygen plasma RIE <strong>of</strong> ARC.<br />
100 nm<br />
600 nm<br />
Grating after interference lithography.<br />
100 nm<br />
Grating after gold plating <strong>and</strong> resist stripping.<br />
100 nm<br />
resist<br />
ARC<br />
Ta 2 O 5
IMAGE.eps<br />
NASA Imager <strong>for</strong> Magnetopause-to-Aurora<br />
Global Exploration Mission (IMAGE)<br />
Medium Energy<br />
Neutral Atom Detector (MENA)
Magnetosphere-2.eps<br />
Earth’s <strong>Space</strong> Environment: <strong>The</strong> Magnetosphere<br />
<strong>Space</strong> Weather
Charge-Exchange-2<br />
TRAPPED<br />
A magnetically trapped ion captures<br />
an electron from a neutral<br />
hydrogen atom...<br />
Charge Exchange<br />
FREE<br />
...creating an energetic neutral atom<br />
(ENA) that is no longer trapped.
MENA-Concept-2.eps<br />
D 1<br />
START Foil<br />
2.6 nm Carbon<br />
STOP<br />
MENA Neutral Atom Camera<br />
Measurement Concept<br />
Collimator HWHM:<br />
±55º imaging plane<br />
±2º spin plane<br />
UV<br />
Nan<strong>of</strong>ilters<br />
Ionized Atom<br />
X 1<br />
α<br />
Ground<br />
Grid<br />
Primary MENA<br />
Accelerating<br />
Grid<br />
START Electrons<br />
tan(α) = X 2 - X 1<br />
L<br />
tan(δα) = cos(α)<br />
L<br />
X 2<br />
D 2<br />
MCP Stack<br />
Position<br />
Sensive<br />
Anode<br />
START Position (D 1 )<br />
+<br />
STOP Position (D 2 )<br />
Polar<br />
Angle<br />
Time <strong>of</strong> Flight<br />
+ Species<br />
Pulse Height<br />
Time <strong>of</strong> Flight<br />
+ Energy<br />
Species
Filter.eps<br />
UV<br />
+<br />
Atoms<br />
Nan<strong>of</strong>ilter<br />
Grating<br />
Atoms<br />
Detector<br />
Nan<strong>of</strong>ilter UV-Blocking Transmission Gratings<br />
Electron micrograph <strong>of</strong> gold nan<strong>of</strong>ilter.<br />
45 nm<br />
UV Transmission Coefficient<br />
10 -1<br />
10 -3<br />
10 -5<br />
λ=121.6 nm<br />
(Hydrogen Lyman Alpha)<br />
10 -9<br />
10 -7<br />
30 nm gap width<br />
40 nm gap width<br />
50 nm gap width<br />
60 nm gap width<br />
0 100 200 300 400 500 600 700 800<br />
Thickness (nm)<br />
Electron micrograph <strong>of</strong> lines be<strong>for</strong>e electroplating.<br />
45 nm<br />
Resist<br />
IL<br />
ARC<br />
PB
MLS-98-05-06<br />
(a) Wafer Preparation<br />
resist<br />
ARC<br />
SiN<br />
silicon<br />
plated nickel<br />
gold grating<br />
SiN<br />
silicon<br />
(f) Mounting<br />
plating<br />
base<br />
(Cr/Au)<br />
adhesive<br />
Mesh-Supported Grating Fabrication Process<br />
Interlayer<br />
(Ta 2 O 5 )<br />
(c) Pattern Support Grid<br />
metal frame<br />
(d) Wafer Etch<br />
gold <strong>and</strong> nickel gratings<br />
Silicon<br />
(b) Grating Patterning<br />
patterned resist<br />
plated gold<br />
ARC<br />
SiN SiN<br />
SiN<br />
silicon<br />
SiN<br />
(g) Backside Etch<br />
silicon<br />
(b1) Pattern resist. (b2) Etch <strong>and</strong> plate. (b3) Strip resist.<br />
(e) Plug Pinholes<br />
resist exposed resist<br />
UV<br />
(e1) Spin resist <strong>and</strong> UV expose.<br />
plated nickel<br />
(e2) Plate nickel <strong>and</strong> strip resist.
MLS-2001-05-25.04.eps<br />
Nan<strong>of</strong>ilter Grating<br />
(gold)<br />
155 nm line<br />
45 nm space<br />
Support Grating<br />
(nickel)<br />
UV Nan<strong>of</strong>ilter Grating Support Mesh Design<br />
Triangular<br />
Support Mesh<br />
(nickel)<br />
Completed<br />
Flight Grating<br />
(Stainless Steel Frame)<br />
4.0 µm 346.4 µm 10 mm
MLS-01-03-14.01.eps<br />
Pinhole Plugging Results<br />
200 m<br />
Pinholes Be<strong>for</strong>e Plugging<br />
200 m<br />
4x 4x<br />
Pinholes After Plugging
MLS-2001-05-11-02.eps<br />
IMAGE Medium Energy Neutral Atom Camera (MENA)<br />
Magnetospheric Storm Observations<br />
(August 12, 2000)<br />
Shadow Shadow<br />
Sun Sun<br />
9:30 UT 22:00 UT<br />
Frames from an oxygen atom "movie."<br />
(Elapsed time between frames is 12.5 hours.)
Con-X-Concept<br />
NASA Constellation-X Mission Concept
CXC<br />
Ch<strong>and</strong>ra X-ray Observatory<br />
Assembly & Polishing <strong>of</strong> CXO Mirror Shell
cc_ASTROE.eps<br />
X-ray Foil Optics <strong>for</strong> High Throughput X-ray Telescopes<br />
Traditional foil optics assembly techniques yield<br />
resolution only on the arcminute level.<br />
X-ray Foil Optics On-board the USA/Japan ASTRO-E Satellite
MLS-2001-05-28.01.eps<br />
Microstructures <strong>for</strong> High-Resolution X-ray Foil Optic Assembly<br />
500 m<br />
Old Technology New Technology<br />
Stainess-steel wire-EDM combs.<br />
Very low accuracy (> 20 microns).<br />
Poor optic resolution (>1 arcminute telescope).<br />
Silicon micromachined combs.<br />
500 m<br />
500 m<br />
Spring Comb Reference Comb<br />
Very high accuracy (
cc_Microcombs-2.eps<br />
Two Types <strong>of</strong> Silicon Micro-Combs<br />
Units: mm Spacing tolerances
Silicon Microcombs Establish an Accurate Metrology Frame<br />
Reference Surface<br />
Spring Comb<br />
Foils<br />
Spring<br />
Tooth<br />
Reference Comb<br />
Reference<br />
Tooth<br />
1mm 1mm<br />
Scanning Electron<br />
Microscope Images<br />
<strong>of</strong> Microcomb Teeth
MLS-2001-05-28.02.eps<br />
microcombs etched through<br />
entire wafer<br />
100 mm<br />
silicon wafer<br />
Micro-comb Fabrication Process Overview<br />
Silicon Wafer<br />
a) Grow thermal oxide.<br />
b) Photolithography.<br />
c) Reactive ion etch oxide.<br />
d) Attach quartz h<strong>and</strong>le-wafer.<br />
e) Deep reactive ion etch silicon.<br />
f) Extract finished micro-combs.<br />
Silicon Wafer Oxide Resist Quartz
MLS-2001-11-20.01<br />
X-ray wavelength λ ~ 1 nanometer.<br />
Why is nano-accuracy important?<br />
Diffraction from d = 2 mm-spaced x-ray mirrors is<br />
∆θ = λ/d = 0.5 microradian = 0.1 arcsecond.<br />
Diffraction-limited per<strong>for</strong>mance (λ/10) <strong>for</strong> 200 mm long mirror with 2 mm spacing<br />
occurs when mirror placement error is<br />
∆X = L ∆θ/10 = 10 nanometer.<br />
Nanometer accuracy achieves sub-arcsecond diffraction-limited per<strong>for</strong>mance.<br />
X ray Mirror<br />
L = 200 mm<br />
d = 2 mm<br />
X ray<br />
λ ~ 1 nm
MLS-2001-11-27.01.eps<br />
Limit to Microcomb Accuracy<br />
We believe microcomb accuracy can be improved to approach 10 nm goal.<br />
International Technology Roadmap <strong>for</strong> Semiconductors 2000<br />
Year 2001 2004 2007 2010 2013<br />
Minimum Feature Size (nm) 130 90 65 45 33<br />
Feature Size Error (nm) 13 9 7 5 3<br />
Feature Placement Error (nm) 45 31 26 18 13
foilclip.eps<br />
Microcombs Designed to Accommodate Foil Imperfections<br />
rough<br />
foil<br />
variable<br />
thickness<br />
foils<br />
edges spring reference<br />
microcomb<br />
tooth<br />
leaf<br />
spring<br />
microcomb<br />
tooth
cc_FlexBeamModel.ai<br />
Motion<br />
Spring<br />
Comb<br />
Glass Foil<br />
Analytical Model <strong>for</strong> Spring Micro Comb<br />
Reference<br />
Comb<br />
Force<br />
σ max<br />
l<br />
(l>>h)<br />
Model Spring as a Flexible Beam<br />
δ = Beam Displacement<br />
E = Young’s Modulus<br />
d = Wafer Thickness<br />
σ = Stress<br />
F<br />
h<br />
δ<br />
l (mm)<br />
7<br />
6<br />
5<br />
4<br />
3<br />
2<br />
1<br />
σ=600 MPa<br />
σ=300 MPa<br />
F Ed<br />
=<br />
δ 4<br />
σ=200 MPa<br />
3<br />
2<br />
Eh<br />
δ<br />
l 2<br />
Comb design <strong>for</strong> Fmin=0.18 N, δmin=20 µm<br />
Silicon Yield Limit<br />
Stiffness K =<br />
Maximum Stress σ max =<br />
h<br />
3<br />
l 3<br />
Constant Stiffness<br />
h (mm)<br />
0.1 0.2 0.3 0.4 0.5
F<br />
R<br />
Microcomb Design <strong>for</strong> Reference Teeth<br />
Surface Distortion Due to Hertz Contact Force<br />
Hertz De<strong>for</strong>mation (µm)<br />
1<br />
0.8<br />
0.6<br />
0.4<br />
0.2<br />
0<br />
-0.2<br />
Radius <strong>of</strong> Curvature R=7.5 mm<br />
0 0.1 0.2 0.3 0.4<br />
Force F (N)<br />
<strong>The</strong>ory<br />
Test1<br />
Test2
ASS_COLL.eps<br />
Assembly Truss Tests Using Autocollimator<br />
Autocollimator <strong>and</strong> Assembly Truss<br />
Demonstrated 0.5 µm Assembly Accuracy<br />
0.1 µm Repeatability<br />
Microcombs Mounting<br />
a Glass Plate
MLS-2001-05-01.01.eps<br />
X-Rays<br />
Wolter Telescope Reflection Grating Optics<br />
Telescope Optics<br />
Reflection<br />
Gratings<br />
Optical Axis<br />
First-Order Focus<br />
Zero-Order Focus<br />
Rowl<strong>and</strong> Circle<br />
Telescope<br />
Focus
MLS-2001-05-01.02.eps<br />
~2 µm<br />
p max<br />
X-ray Reflection Grating Geometry<br />
100 mm<br />
~2˚<br />
p min<br />
200 mm<br />
pave ~2 µm<br />
Chirp ∆p/p ~5%<br />
Blaze ~2˚<br />
Flatness
MLS-2001-05-02.07.eps<br />
4000 00<br />
000 00<br />
00<br />
000<br />
Super Smooth Reflection Grating Fabrication Results<br />
0<br />
000<br />
2000<br />
3000<br />
4000<br />
Mechanically Ruled <strong>and</strong> Replicated<br />
(XMM Grating - Old Technology)<br />
80<br />
40<br />
nm n<br />
Si (111) planes,<br />
AEF-97-05-23.02<br />
SiO 2<br />
ARC<br />
silicon<br />
(a) Pattern by<br />
Interference Lithography<br />
silicon<br />
(b) Reactive Ion Etch SiO 2,<br />
ARC, <strong>and</strong> Si 3N 4<br />
silicon<br />
(c) RCA Clean<br />
Reflection Grating Fabrication<br />
Process Detail<br />
resist<br />
Si 3 N 4<br />
(111)<br />
Planes<br />
(d) Anisotropically Etch<br />
with KOH<br />
Cr<br />
silicon<br />
silicon<br />
(e) Evaporate Cr &<br />
Wet Etch Si 3N 4<br />
silicon<br />
(f) Reactive Ion Etch Si &<br />
Wet Etch Cr
TAS-ail.eps<br />
Achromatic Interference Lithography<br />
resist-coated<br />
substrate<br />
λ=193 nm<br />
100 nm-period<br />
interference pattern<br />
micrometer<br />
phase grating<br />
(p = 200 nm)<br />
λ=193 nm (ArF excimer) can pattern 100 nm period (10,000 lines/mm)<br />
λ=157 nm (F 2 excimer) can pattern 80 nm period (12,000 lines/mm)
TAS-pmma100<br />
Achromatic Interference Lithography<br />
100 nm<br />
100nm-Period Grating in PMMA<br />
PMMA<br />
ARC<br />
Si
Focus on goals. “Nano” is not a goal.<br />
MIT<br />
SUCCESS FACTORS<br />
• Our lab has a narrow focus: using nanotechnology to improve space instrumentation.<br />
• Other labs successfully focus on applications to spacecraft systems (propulsion, power, attitude, sensors, etc.).<br />
• Nanostructure technologies <strong>and</strong> micro-electro-mechanical systems (MEMS) differ in scale by 1000X, but share<br />
many facilities <strong>and</strong> techniques. We find both technologies important <strong>for</strong> success.<br />
Develop <strong>for</strong> manufacturability.<br />
• Nano-size <strong>and</strong> nano-accuracy are both important.<br />
• Develop fabrication processes <strong>for</strong> tight control <strong>and</strong> manufacturability.<br />
• A large gap exists between lab benchtop demonstrations <strong>and</strong> manufacturing.<br />
• Need best available patterning <strong>and</strong> metrology tools (many are not commercially available).<br />
<br />
Massachusetts Institute <strong>of</strong> Technology
Establish strong connections to university.<br />
• Need best facilities, people <strong>and</strong> ideas.<br />
MIT<br />
SUCCESS FACTORS (continued)<br />
• Young people bring new ideas <strong>and</strong> energy. Pr<strong>of</strong>essors bring experience <strong>and</strong> depth <strong>of</strong> knowledge.<br />
• Integrate academic disciplines into research. Bring together different departments (e.g., mechanical, electrical<br />
& aerospace engineering, physics, chemistry & materials science).<br />
• Students <strong>and</strong> pr<strong>of</strong>essors can find many motivations. <strong>Space</strong> technology brings many new <strong>and</strong> interesting<br />
challenges: low weight <strong>and</strong> power, maximum efficiency <strong>and</strong> sensitivity to detect weak signals, need <strong>for</strong> small<br />
size <strong>and</strong> extreme accuracy, novel structures <strong>and</strong> devices.<br />
Avoid duplicating ef<strong>for</strong>ts.<br />
• Take maximum advantage <strong>of</strong> existing nanotechnology research. Progress is very rapid. Associate primarily<br />
with nanotechnology community, not with space community.<br />
• For example, massive industry investment is driving in<strong>for</strong>mation technology (IT) into the nano regime<br />
(microprocessors, memory, disk media, fiber optics, etc.). Circuit minimum features will reach 30 nm by 2013.<br />
• Much nanotechnology research is in bio/chemical areas. Little <strong>of</strong> this seems to have direct application to space<br />
technology.<br />
• <strong>Nanotechnology</strong> specialization can be important assets <strong>for</strong> “trading” technology with other laboratories.<br />
• Establish connections with industry <strong>and</strong> cultivate common interest.<br />
<br />
Massachusetts Institute <strong>of</strong> Technology
Laboratory Staff<br />
Robert Fleming<br />
James Carter<br />
Edward Murphy<br />
Physics<br />
Nat Butler<br />
Dr. G. S.Pati<br />
Dr. Ralf Heilmann<br />
Glen Monnelly<br />
MIT<br />
ACKNOWLEDGEMENTS<br />
Center <strong>for</strong> <strong>Space</strong> Research<br />
<strong>Space</strong> <strong>Nanotechnology</strong> Laboratory<br />
Electrical Engineering<br />
Carl Chen<br />
Mechanical Engineering<br />
Craig Forest<br />
Chulmin Joo<br />
Paul Konkola<br />
Yanxia Sun<br />
Aero/Astro Engineering<br />
Olivier Mongrard<br />
We thank NASA <strong>for</strong> support <strong>of</strong> this work.<br />
<br />
Massachusetts Institute <strong>of</strong> Technology
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