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Vacuum Design Constraints and Considerations - Owens Design

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<strong>Vacuum</strong> <strong>Design</strong> <strong>Constraints</strong> <strong>and</strong><br />

<strong>Considerations</strong><br />

Martin P. Aalund, Ph.D.


Summary<br />

• Intro to <strong>Vacuum</strong> Technology<br />

– History<br />

– Terminology<br />

– Levels of <strong>Vacuum</strong>s<br />

– Cluster Tools<br />

• The <strong>Vacuum</strong> barrier, How do you Cross it?<br />

– Robotics<br />

– Motion Across The Barrier<br />

– Data <strong>and</strong> Electrically<br />

• <strong>Design</strong> Consideration<br />

– How do we Maintain it<br />

– Virtual Leaks<br />

– Material Compatibility<br />

• Out gassing


Intro to <strong>Vacuum</strong> Technology<br />

• History<br />

• Why do we need <strong>Vacuum</strong>s<br />

• Terminology<br />

• Levels of <strong>Vacuum</strong>s<br />

• Cluster Tools<br />

• Robots


<strong>Vacuum</strong> History<br />

• Evangelista Torricelli was the first person credited with creating<br />

a vacuum 1643 <strong>and</strong> also invented the barometer. This was in<br />

an attempt underst<strong>and</strong> why a suction pump could only raise<br />

water to 32 feet.<br />

• Robert Boyle (1627-1691) used a von Guericke pump,<br />

improved by the young Robert Hooke, to investigate the<br />

vacuum <strong>and</strong> the general properties of gases <strong>and</strong> gas pressure<br />

• Engl<strong>and</strong>. Papin invented the Pressure Cooker<br />

• Currently one of the most impressive bits of artificial emptiness<br />

is created in the particle accelerators. The large electronpositron<br />

collider (LEP) at CERN gets down to a pressure of 10-<br />

12 Torr or 1.3*10-10 Pa This corresponds to a particle density<br />

of about 1011 hydrogen molecules per cubic meter.<br />

• To a first approximation the average density of the universe is<br />

about 1 hydrogen atom per m3


Why do we need <strong>Vacuum</strong><br />

• Limits Contamination<br />

– No Airborne Contamination<br />

– Limits Cross Contamination<br />

• Control Chemistries<br />

– Slows Oxidation<br />

– Allows for Controlled Atmospheres<br />

• Many process can be made more predictable or require a vacuum to<br />

function<br />

– Plasma Production<br />

– Metallization: Metal is evaporated <strong>and</strong> deposited onto a substrate<br />

– Etch<br />

– Deposition<br />

– Sputtering<br />

– Ion Implantation<br />

– E-beam<br />

• Metrology<br />

• Inspection


Terminology<br />

• <strong>Vacuum</strong>:<br />

– A volume of Space Substantially void of matter<br />

(Wikepedia)<br />

– a space partially exhausted (as to the highest<br />

degree possible) by artificial means (as an air<br />

pump) (Websters)<br />

• Manometer: Liquid scale used to measure<br />

vacuum or pressure usually in Inches or mm<br />

• torr: A unit of measurement for pressure:<br />

torr<br />

= 1mm_Hg torr = 1.32× 10 − 3 atm<br />

P 1<br />

P 2<br />

∆P<br />

torr<br />

= 0.039in_Hg torr = 133.32Pa<br />

• (it is named after Evangelista Torricelli)<br />

• Virtual Leek: A void or trapped volume that<br />

slowly released material into a vacuum.<br />

Examples include Blind wholes with screws etc.


Terminology<br />

• Atmospheric pressure is variable based on weather <strong>and</strong> location, but is<br />

st<strong>and</strong>ardized at 101.325 kPa (760 Torr)<br />

• Low vacuum, also called rough vacuum or coarse vacuum, is vacuum that can<br />

be achieved or measured with rudimentary equipment such as a household<br />

vacuum cleaner. Can be measure with a simple manmometer<br />

• Medium vacuum is vacuum that can be achieved with a single pump, but is<br />

too low to measure with a liquid or mechanical manometer. It can be measured<br />

with a McLeod gauge, thermal gauge or a capacitive gauge.<br />

• High vacuum is vacuum where the mean free path of residual gases is longer<br />

than the size of the chamber or of the object under test. High vacuum usually<br />

requires multi-stage pumping <strong>and</strong> ion gauge measurement. Some texts<br />

differentiate between high vacuum <strong>and</strong> very high vacuum.<br />

• Ultra high vacuum requires baking the chamber to remove trace gases, <strong>and</strong><br />

other special procedures.<br />

• Deep space is generally much more empty than any artificial vacuum that we<br />

can create. But it is not uniform <strong>and</strong> has areas of gas that may be quite dense.<br />

• Perfect vacuum is an ideal state that cannot be obtained in a lab, nor even in<br />

outer space.<br />

• AMC: Airborne Molecular Contaminates: Gaseous Atoms, Molecules, or<br />

clusters


AMCs<br />

• Can be emitted from Cables, Plastic or Electrometric Parts<br />

• Airborne molecular Include<br />

– Acids: HCl, HF, SO x , NO x , etc.<br />

– Basis: Amonias: Amines, etc<br />

– Condensates: Phthalic Ester, Siloxane, Etc<br />

– Dopants: Boron, Phosphorous<br />

• AMC Related Problems include<br />

– Yield Loss<br />

– Corrosion of metal surfaces on the wafer<br />

– Surface Pollution<br />

• Haze on wafers<br />

• Haze on optics<br />

– Changes in contact resistance<br />

• AMC Control<br />

– Use materials with High Molecular weight <strong>and</strong> Low Volatility<br />

– Use High Purity Materials<br />

– Control Cross Contamination during Manufacturing <strong>and</strong> Installation<br />

• Outgassing Measurements<br />

– Testing is performed in vacuum. Sample from 100 to 300 grams in placed in special aluminum boat<br />

<strong>and</strong> heated to 398K inside a copper container with a 6.3 mm hole for 24 hours. A Chromium plated<br />

disk is placed in front of a 6.3 mm hole.<br />

– TML Total Mass Loss<br />

– CVCM Collected Volatile Condensable Material<br />

– WVR Water Vapor Regained (Exposed to 50% Humidity for 24 Hours)


Levels of <strong>Vacuum</strong><br />

Name<br />

Atmospheric Pressure (variable)<br />

Low, Rough or Course <strong>Vacuum</strong><br />

Medium <strong>Vacuum</strong><br />

High <strong>Vacuum</strong><br />

Ultra High <strong>Vacuum</strong><br />

Extremely High <strong>Vacuum</strong><br />

Outer Space<br />

Perfect <strong>Vacuum</strong><br />

Start torr (Pa)<br />

760 (101.325 kPa)<br />

760 (101kPa)<br />

25 (3kPa)<br />

1x10 -3 (100nPa)<br />

1X10 -9 (100mPa)<br />

1x10 -12 (100pPa)<br />

1x10 -6 (100uPa)<br />

0 (0)<br />

Stop torr (Pa)<br />

25 (3kPa)<br />

1x10 -3 (100mPa)<br />

1x10 -9 (100pPa)<br />

1x10 -12<br />

3x10- 17 (3fPa)


<strong>Vacuum</strong> Cluster<br />

Challenges<br />

• Process Challenges<br />

– Time to purge<br />

– Temperature<br />

– Chemistries<br />

• Clusters used for<br />

alternate<br />

atmospheres<br />

• Operate near strong<br />

electro-magnetic<br />

fields<br />

– No magnetic<br />

signature<br />

– Static electricity<br />

• Moving the Wafer<br />

<strong>Vacuum</strong> Robot<br />

High <strong>Vacuum</strong><br />

Process<br />

Chambers<br />

Integrated<br />

Process<br />

Chambers<br />

Orienter / Degas<br />

Low <strong>Vacuum</strong><br />

Wafer Cassette Loadlocks<br />

Process<br />

Chambers<br />

Cool-Down/<br />

PreClean<br />

Chambers<br />

Orienter / Degas


<strong>Vacuum</strong> Robots<br />

• Very high reliability<br />

• Operate in vacuum<br />

– 10-8 Torr<br />

– Material compatibility<br />

– No virtual leaks<br />

• Low profile<br />

– MESC compatibility<br />

– Minimize chamber volume<br />

• Sophisticated controls<br />

– Increase wafer throughput<br />

– Prevent wafer slippage<br />

– Time optimized trajectories<br />

• 7 to 9" arm links


Robot ARM Types<br />

• Frog Leg<br />

– More Bearings<br />

– Second Wafer Moves at Low Speed<br />

– Higher Throughput for Same Accel<br />

• SCARA<br />

– Simple <strong>Design</strong><br />

– Must Have B<strong>and</strong>s or Belts in <strong>Vacuum</strong><br />

– Speed of Extension limited by Second Wafer<br />

• Four-Bar Linkage<br />

– No B<strong>and</strong>s<br />

– More Bearings


<strong>Vacuum</strong> Robot Vendors<br />

Vendor<br />

Brooks<br />

IDE<br />

Rorze<br />

Genmark<br />

Yaskawa<br />

JEL<br />

AITEC<br />

Sankyo<br />

Models<br />

Mag 7<br />

RR452, RR713<br />

AVR3000<br />

SVHR3163, STVHR4000,<br />

DVHR3200<br />

AR-SV300, AR-WV300<br />

SR8600<br />

Technology<br />

Permanent Magnet<br />

Ferrofluidic Seals<br />

Ferrofluidic Seals,<br />

Only in Japan<br />

Ferrofluidic Seals<br />

Single <strong>and</strong> Dual<br />

Single <strong>and</strong> Dual Arm


Motion <strong>and</strong> <strong>Vacuum</strong><br />

• Cannot use a vacuum ∆P chuck<br />

to hold a substrate<br />

– Edge Grip<br />

– Highly Optimized Motion<br />

– Special Materials<br />

• Motion can be created either<br />

inside or outside the vacuum<br />

barrier, both create challenges.<br />

• We will look at some of these<br />

challenges for robotics, but could<br />

be applied to any general device.


The <strong>Vacuum</strong> barrier, How do you Cross<br />

• Mechanically<br />

– How do We transmit Motion or Torque Across the<br />

Barrier<br />

• Electrically<br />

– Need to get Signals <strong>and</strong> Power Across the Barrier<br />

• Information<br />

– Need to See <strong>and</strong> measure things<br />

• Quarts<br />

• Encoders<br />

• Lasers


Two Main Choices<br />

• Create Motion in the vacuum<br />

• Create Motion outside of vacuum <strong>and</strong> then<br />

provide feed through transferring motion to<br />

the vacuum.<br />

– Bellows<br />

– Ferro fluidic Seals<br />

– Lip Seals<br />

– Mag Coupling


Permanent Magnet<br />

•Pros<br />

•Good <strong>Vacuum</strong> Isolation<br />

•Simple <strong>Design</strong><br />

•Cons<br />

•Bearings in <strong>Vacuum</strong><br />

•Magnets <strong>and</strong> epoxy in vacuum<br />

•Can Stack for extra DOF<br />

•Brooks has Patent<br />

<strong>Vacuum</strong><br />

Flux<br />

N<br />

Magnet Flux<br />

S<br />

Magnet Flux<br />

Flux<br />

Bearings


Bearing<br />

Magnetic Coupling<br />

•Pros<br />

•Good <strong>Vacuum</strong> Isolation<br />

•Cons<br />

•Bearings in <strong>Vacuum</strong><br />

•Magnets <strong>and</strong> epoxy in vacuum<br />

•Two air gaps produces control <strong>and</strong><br />

stiffness issues<br />

•Can Stack for extra DOF<br />

•AMAT has Patent<br />

<strong>Vacuum</strong><br />

Flux<br />

S<br />

Magnet Flux<br />

N<br />

S<br />

Magnet Flux<br />

Flux<br />

S N N<br />

Magnet Flux<br />

Magnet Flux


Ferrofluidic Seals<br />

•Pros<br />

•No Bearing in <strong>Vacuum</strong><br />

•Motor <strong>and</strong> Sensors can be st<strong>and</strong>ard<br />

•Cons<br />

•Seal can Burp during pump down<br />

•Seal can Outgas<br />

•Reliability of Seal<br />

•Concentric shaft for added DOFs<br />

•Used by Yaskawa, Brooks has some<br />

Patents via Smartmachines<br />

<strong>Vacuum</strong><br />

N<br />

S<br />

Magnet Flux<br />

Magnet Flux<br />

Magnet Flux<br />

Magnet Flux<br />

Magnet Flux<br />

Magnet Flux<br />

N<br />

S<br />

Ferrofluidic Liquid<br />

Flux<br />

N<br />

Magnet Flux<br />

S<br />

Magnet Flux<br />

Flux<br />

Bearings


Harmonic Drive<br />

•Pros<br />

•Motor <strong>and</strong> Sensors can be st<strong>and</strong>ard<br />

•Gear Reduction reduces motor <strong>and</strong><br />

sensor costs.<br />

•Cons<br />

•Bearings in <strong>Vacuum</strong><br />

•Flex Spline Circular Spline Interface<br />

in Bearing<br />

•Costs<br />

Circular Spline<br />

<strong>Vacuum</strong><br />

Flex Spline<br />

Wave Generator


Placing Motor in <strong>Vacuum</strong><br />

• St<strong>and</strong>ard Motors not suitable for less than 10^-4 Torr.<br />

– bearing grease,<br />

– paper slot liners,<br />

– conformal coatings,<br />

– winding insulation<br />

• Lubricants are not suitable <strong>and</strong> will vaporize resulting in bearing failures <strong>and</strong><br />

fouling other components.<br />

• Some lubricants boil off very quickly others such as Silicon don’t vaporize as<br />

fast but create low level contamination on all components <strong>and</strong> are very hard to<br />

clean.<br />

• Cooling. How do we get the heat out.<br />

– Heat Sink<br />

– Heat Pipes<br />

– Radiation<br />

• Micro Leaks due to construction<br />

– Laminations<br />

– Non Vented Screws.<br />

• Micro Environments make create voltage discharge paths


Electrical Challenges in A <strong>Vacuum</strong><br />

• Insulation<br />

• Getting rid of heat<br />

• Out gassing<br />

• Exiting the <strong>Vacuum</strong>


Electrically<br />

• Exposed conductors should be insulated<br />

– Arcing can be an Issue<br />

• <strong>Vacuum</strong> approved Solders<br />

• Virtual Leaks<br />

• Electronics Components in <strong>Vacuum</strong><br />

– Enclosing<br />

• Enclose in Box<br />

• Must monitor pressure<br />

• Shields device from vacuum (issue for some chips)<br />

• Prevents Out gassing<br />

– Potting<br />

• Completely cover with Potting material such as vacuum compatible<br />

epoxy.<br />

• Should Minimize area by placing in recess<br />

• Whole assembly often must be scrapped if there is a component failure<br />

• Can actually improve heat transfer.<br />

– Venting<br />

• Same as Enclosing, but vent supplied to atmosphere.


Out gassing in Cables<br />

• Construction<br />

– Str<strong>and</strong>ed Cables can have<br />

voids between wires creating<br />

virtual leaks<br />

– Trapped Air can cause Cable<br />

Ruptures <strong>and</strong> expose Interior<br />

materials<br />

• Materials<br />

– Must select Materials that<br />

have low Out gassing.


Position Information<br />

• Type of Rotary Actuator<br />

– Encoders<br />

• Easy to Interface<br />

• Lower Cost<br />

– Revolvers<br />

• Absolute Position<br />

• Robust<br />

– Capacitive Encoders<br />

• Low Cost<br />

• Absolute <strong>and</strong> Incremental<br />

• Could be Made <strong>Vacuum</strong> Compatible<br />

– In <strong>Vacuum</strong><br />

• Disc in <strong>Vacuum</strong> Sensor Outside<br />

• Use Quarts viewing Window (Adds Costs)<br />

• New <strong>Vacuum</strong> Compatible Read heads can be placed in vacuum


Use a Window to View Sensor<br />

Code Wheel<br />

Sensor Window<br />

Quarts Windows<br />

<strong>Vacuum</strong> Barrier


<strong>Design</strong> Consideration<br />

• How do we Maintain it<br />

– Virtual Leaks<br />

– Material Compatibility<br />

– Out gassing


Pump down Speed is Critical<br />

How do we optimize it<br />

• Minimize the Volume<br />

• Eliminating the cracks, crevices <strong>and</strong> other areas that<br />

trap gasses<br />

• Fine machine finishes hold less air<br />

• Porous metals typically require cleaning <strong>and</strong> sealing<br />

• Machined metals are preferable to castings<br />

• Avoid Leaks <strong>and</strong> Virtual Leaks<br />

– Leaks: Leaks can take the form of air leaking through seals,<br />

or air or other contaminates leaking from contained volume<br />

or voids.<br />

– Vent Screw<br />

• Select the correct Components


How To Select Materials<br />

• Out-gassing<br />

– Evaporation<br />

– Sublimation<br />

• Thermal Compatibility<br />

• Use


Material Compatibility<br />

Carefully Selected<br />

Wet Lubricants<br />

<strong>Vacuum</strong> Lubricants<br />

Dry Lubricant<br />

Low <strong>Vacuum</strong> (Mechanical Pump)<br />

High <strong>Vacuum</strong> Turbo Pump<br />

Many<br />

Commercial<br />

Plastics<br />

Limited Plastics<br />

Most Natural Materials<br />

Must be eliminated<br />

No Plastics<br />

ATM<br />

10 -1 10 -2 10 -3 10 -4 10 -5 10 -6 10 -7 10 -8 10 -9


<strong>Vacuum</strong> Lubricants<br />

• Solid<br />

– MoS2 (molybdenum disulphide) Good down to 10 -12 torr<br />

– WS2 (Tungsten Disulfide)<br />

– Lubricant is often provided by cage or Spacer.<br />

• Grease/Oil<br />

– TorrLube Good Down to 10 -9 torr<br />

– Fomblin Y perfluoroalkylpolyether (PFPE)<br />

– Isoflex<br />

– Krytox (PFPE)<br />

– Barrierta


Common Materials<br />

• Stainless Steal<br />

– Strength<br />

– Corrosion Resistance<br />

– Available in Magnetic <strong>and</strong> Non-Magnetic Forms<br />

– Common Alloys Include<br />

• Xxx Mag<br />

• XXx non Mag<br />

• Aluminum<br />

– Good Stiffness To Weight Ration<br />

– Easily machined<br />

– Non Magnetic<br />

• Common Alloys Include<br />

• Ceramics<br />

– Chemical Resistance<br />

– Temperature Resistance<br />

– Thermal <strong>and</strong> Electrical Insulation<br />

– Alumina<br />

– Quarts<br />

– Beryllium Oxide?<br />

• Plastics<br />

– PolyBenzImidazole (Celazole) High Temp, Brittle, Hard to Machine. Bushings, Bearings, Rollers<br />

– Polyimide<br />

• Vespel High Temp, Expensive<br />

• Duration, Lower Cost than Vespel, similar Properties<br />

– PolyAmide-Imide (Torlon) Low Thermal Expansion, typically used for Insulators, spaces. Can be glass filled.<br />

– PTFE


Low Outgassing Plastics<br />

• PolyBenzImidazole<br />

– Celazole® is the highest temperature-capable plastic available. However, it is very brittle (almost ceramic-like) <strong>and</strong> quite<br />

difficult to machine. That said, is it frequently used for bushings, bearings, rollers, <strong>and</strong> spacers in extreme environments.<br />

Polyimide<br />

– DuPont Vespel® SP-1 is one of the most-used high-temperature plastic materials used in applications where high-purity<br />

<strong>and</strong> electrical properties are needed. Vespel is frequently used in ultra-clean semiconductor <strong>and</strong> chemical applications. It<br />

is also one of the most expensive materials sold, but is flight-approved for NASA, USAF <strong>and</strong> other aerospace agencies.<br />

– Duratron® XP is the first real alternative to Vespel ... it was developed specifically to replace Vespel in extreme<br />

applications at a slightly lower price. It contains less than 1% metallic impurities as measured using the ICP-MS test<br />

st<strong>and</strong>ard. Duratron XP is ideal for use in high-energy gas plasma etch <strong>and</strong> strip processes.<br />

• PolyAmide-Imide<br />

– Unfilled Torlon® 4203 has high dielectric properties <strong>and</strong> low thermal expansion, <strong>and</strong> is much less expensive than some<br />

advanced polymers. Torlon 4203 is typically used for insulators, spacers, <strong>and</strong> mechanical parts up to 520°F.<br />

– Torlon 5530 (30% glass-filled) is typically used for applications where dimensional stability over a wide temperature<br />

range is needed, as with temperature test sockets, nests, <strong>and</strong> fixtures. : Torlon's moisture absorption is a bit high, so<br />

critical dimensional stability can be an issue.<br />

• Semitron® ESd 500HR (filled PTFE)<br />

Semitron® ESd 500HR is antistatic/conductive PTFE. This material is relatively clean, readily machinable,<br />

dissipates static electricity reliably ... as a result it is used in test h<strong>and</strong>ling equipment, fixtures, <strong>and</strong> other<br />

applications where static generation may cause failures <strong>and</strong>/or errors in production environments. PTFE<br />

has good mechanical properties up to approximately 500°F.<br />

• Neoflon® PCTFE (PolyChloroTetraFluoroEthylene)<br />

PCTFE exhibits high chemical resistance, low <strong>and</strong> high temperature capability, resistance to most<br />

chemicals (including strong acids <strong>and</strong> bases), low friction, electrical <strong>and</strong> thermal insulation, <strong>and</strong><br />

"slipperiness".


Low Outgassing Plastics<br />

• PEEK (PolyEtherEtherKetone)<br />

PEEK is pure, easily machinable, chemically resistant, stable, <strong>and</strong> also has relatively low outgassing<br />

values. PEEK has good mechanical properties, but will not take temperatures over 350°F, so it may not<br />

have the mechanical or thermal performance needed.<br />

• Techtron® PPS (PolyPhenylene Sulfide)<br />

Techtron® PPS is easily machined to close tolerance, has excellent mechanical, thermal <strong>and</strong> chemical<br />

stability <strong>and</strong> has one of the lowest outgassing thermoplastic material. Techtron PPS is generally a bit less<br />

expensive than PEEK or Torlon, but will not take as high temperatures.<br />

• Ultem® PEI (PolyEtherImide)<br />

Ultem® has good dielectric properties <strong>and</strong> low thermal expansion, <strong>and</strong> is considerably less expensive than<br />

some other polymers. PEI is also clean <strong>and</strong> stable, but is not particularly resistant to chemicals or solvents<br />

. PEI has good mechanical properties up to approximately 410°F.<br />

• Semitron® ESd 410C (filled PEI)<br />

Semitron® ESd 410C is antistatic/conductive PEI. This material is relatively clean, readily machinable,<br />

dissipates static electricity reliably ... as a result it is used in test h<strong>and</strong>ling equipment, fixtures, <strong>and</strong> other<br />

applications where static generation may cause failures <strong>and</strong>/or errors in production environments. PEI has<br />

good mechanical properties up to approximately 340°F.<br />

• Ertalyte® PET-P (Polyethylene Terephthalate)<br />

Ertalyte® offers the dimensional stability of acetal with the wear resistance of nylon. Ertalyte® PET-<br />

Polyester is clean, chemically resistant, stable, PET-P is considerably less expensive than most of the<br />

other materials listed above, but may not have the mechanical or thermal performance needed for all<br />

applications.<br />

• Semitron® ESd 225 (filled acetal)<br />

Semitron® ESd 225 is antistatic/conductive acetal. This material is relatively clean, readily machinable,<br />

dissipates static electricity reliably ... as a result it is used in test h<strong>and</strong>ling equipment, fixtures, <strong>and</strong> other<br />

applications where static generation may cause failures <strong>and</strong>/or errors in production environments. Acetal<br />

has good mechanical properties up to approximately 180°F.


Bearings<br />

• Ball<br />

• Cross Roller<br />

• Magnetic<br />

• Chamberlink Actuator<br />

– Puts Bearing on Outside


Bearings<br />

• EXAMPLE A:<br />

– RINGS: Stainless Steel<br />

BALLS: Stainless Steel<br />

RETAINER: Vespel® or PEEK<br />

LUBRICATION: Solid, MOS2. Solid, WS2 (Tungsten<br />

Disulfide)<br />

FEATURES: Clean, high temperature, corrosion resistant,<br />

solid lubricated, inexpensive.<br />

• EXAMPLE B<br />

– RINGS: Stainless Steel<br />

BALLS: Solid Lube Coated Stainless Steel<br />

RETAINER: PEEK<br />

LUBRICATION: Solid, MOS2<br />

FEATURES: Clean, high temperature, corrosion resistant,<br />

solid lubricated, increased life, increased performance, more<br />

expensive.


Materials Information<br />

• Good Information Available<br />

• Use Your Suppliers<br />

• Use the Web<br />

– NASA<br />

• http://outgassing.nasa.gov/


References<br />

• Low Outgassing Cables for Clean Room<br />

– HITACHI CABLE REVIEW No.24 (AUGUST<br />

2005)<br />

• http://outgassing.nasa.gov/<br />

• http://en.wikipedia.org/wiki/Main_Page


Backups


<strong>Design</strong> <strong>Considerations</strong><br />

• reliability,<br />

• product safety,<br />

• efficiency,<br />

• response time,<br />

• flexibility, <strong>and</strong><br />

• maintenance issues.<br />

• Thermal


Summary<br />

Cost<br />

Patent<br />

Clean<br />

Proven<br />

Stiffness<br />

Magnetic<br />

Coupling<br />

10<br />

10<br />

5<br />

3<br />

10<br />

Ferro Fluidic<br />

9<br />

3<br />

10<br />

3<br />

3<br />

Permanent<br />

Magnets<br />

7<br />

10<br />

5<br />

3<br />

4<br />

Harmonic Drive<br />

8<br />

3<br />

7<br />

5<br />

2


How do we create a <strong>Vacuum</strong><br />

• This vacuum is produced by pumping air out<br />

of a chamber or chambers<br />

• At pressures above 10 -6 Torr a st<strong>and</strong>ard<br />

Mechanical Pump can be used.<br />

• At pressures below 10 -6 Torr a st<strong>and</strong>ard<br />

turbo pumps are often used.


Types of <strong>Vacuum</strong> Pumps<br />

• Positive Displacement (.1Pa)<br />

– Diaphragm<br />

– Piston Pump<br />

– Scroll Pump<br />

– Gear Pump<br />

• Momentum Transfer (<br />

– Diffusion (10-8 to 1 pascals )<br />

– Turbo Molecular (intermediate<br />

vacuum (~10-4) up to<br />

ultra-high vacuum levels (~10-10 Torr). )<br />

• Entrapment<br />

– Cryopumps<br />

– Ion pump<br />

– Sorption Pumps


Cluster<br />

<strong>Vacuum</strong><br />

Loadlocks<br />

<strong>Vacuum</strong><br />

Robot<br />

<strong>Vacuum</strong> Transport<br />

Chamber<br />

View From Front End (EFEM<br />

Interface)<br />

Top View Looking Towards<br />

Front End


<strong>Vacuum</strong> Challenges<br />

• Operating in vacuum<br />

– Limits material selection<br />

– Limits lubrication<br />

– No out gassing<br />

• Motion across vacuum barrier<br />

– Ferofluidic seals<br />

– Magnetic coupling<br />

– Cooling<br />

• No <strong>Vacuum</strong> to Grip<br />

– Highly optimized motion<br />

– Special materials<br />

• Reliability


• Methods of Getting Power Across<br />

– Ferofluidic seals<br />

– Magnetic coupling<br />

– Cooling<br />

• Operating in vacuum<br />

– Limits material selection<br />

– Limits lubrication<br />

– No out gassing<br />

• Reliability


How do we create a <strong>Vacuum</strong><br />

• This vacuum is produced by pumping air out<br />

of a chamber or chambers<br />

• At pressures above 10 -6 Torr a st<strong>and</strong>ard<br />

Mechanical Pump can be used.<br />

• At pressures below 10 -6 Torr a st<strong>and</strong>ard<br />

turbo pumps are often used.


Sin/Cosine


Linked Slides


Median Speed<br />

• Friction between silicon <strong>and</strong><br />

stainless steel is about .24 G<br />

• Must Grip the Wafer to move<br />

faster, or use a polymer to<br />

increase Friction<br />

• We must limit the acceleration<br />

of the robot when it has a<br />

wafer on either end-effector.<br />

– Thus the Kinematics of the robot<br />

may affect the overall<br />

Throughput.


Paschen’s Law


Resolver<br />

• Uses an AC signal to excite the rotor winding.<br />

• Stator has two windings at 90 degrees to each other.<br />

• As the rotor turns the coupling to the two windings will change<br />

• Can have multiple poles, but you lose absolute capability.<br />

• Converters usually are analog <strong>and</strong> can be expensive, $200 for 14-16 bits.<br />

• Rotor current normally passed through an inductive coupling.<br />

• Could be placed in vacuum environment.<br />

Cosine<br />

Reference<br />

Sin

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