Key Elements Of Vacuum Chamber Design - Owens Design
Key Elements Of Vacuum Chamber Design - Owens Design
Key Elements Of Vacuum Chamber Design - Owens Design
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<strong>Key</strong> <strong>Elements</strong> of <strong>Vacuum</strong><br />
<strong>Chamber</strong> <strong>Design</strong>:<br />
Will they all fit on a napkin or envelope??<br />
Neil Peacock<br />
MKS Instruments, HPS Products<br />
Boulder Colorado<br />
neil_peacock@mksinst.com<br />
23 Sept 2010
Intent<br />
This talk is to be a guide, provide food for your<br />
thought process, when arriving at specifications<br />
for high to ultra-high vacuum chambers.<br />
For more in-depth treatment of vacuum<br />
technology or practices, I urge you to consult<br />
some of the many text books on the subject or<br />
consider short course offered by the AVS<br />
(American <strong>Vacuum</strong> Society) or SVC (Society of<br />
<strong>Vacuum</strong> Coaters).<br />
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Important Aspects of <strong>Vacuum</strong><br />
Technology<br />
Containment<br />
Production (pumps)<br />
Measurement (gauges and RGAs)<br />
Control (valves, fittings)<br />
It is the containment topic that we are going to talk about<br />
today.<br />
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Napkin vs. Back of Envelope…<br />
Written documentation is needed to help<br />
insure that the chamber will meet<br />
expectations. This documentation will help<br />
whoever is building the chamber, as well as<br />
during system assembly, use, maintenance<br />
and upgrades.<br />
The first question is what size envelope or<br />
napkin we’ll need to scribble the<br />
documentation on. Let’s start examining<br />
some of what needs to be covered in that<br />
documentation.<br />
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One of a kind vs. Cookie-Cutter<br />
Is the chamber for or<br />
part of an R&D system?<br />
– Flexible so it can be used<br />
for many experiments<br />
– Expandable<br />
! In this case, it is likely<br />
that extra money<br />
spent upfront for<br />
flexibility will be paid<br />
back.<br />
Is the chamber going to<br />
be a production item,<br />
with many identical ones<br />
made?<br />
– Requirements such as<br />
number of ports are<br />
constant<br />
– Presumably cost is an<br />
issue.<br />
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Unknown vs. the Known<br />
Is the process something<br />
new, groundbreaking?<br />
Should function, come<br />
ahead of form? Make<br />
design trade-offs such as<br />
for quick delivery?<br />
Is there history? If so,<br />
learn what has worked, or<br />
hasn’t worked. Is this to<br />
be an incremental<br />
improvement—or next<br />
generation. What<br />
improvements were<br />
thought of during the<br />
previous generation’s<br />
commissioning, use or<br />
upgrades?<br />
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Get Opinions, Input from Many<br />
Sources!<br />
Input from many directions through out the<br />
design and fabrication of a chamber helps to<br />
ensure that the chamber (and the process<br />
performed in it) meet design criteria and<br />
expectations.<br />
Within your facility:<br />
• Process Gurus<br />
• <strong>Vacuum</strong> Expert<br />
• Users<br />
• Fabrication, Shop and<br />
Assembly<br />
• Maintenance<br />
• Firmware/automation<br />
Outside your facility:<br />
• Other workers in the<br />
same field<br />
• Manufacturers<br />
• <strong>Chamber</strong> and hardware<br />
• Components<br />
• Instrumentation<br />
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Questions to Ask<br />
Is the chamber going to be stand alone/free<br />
standing? How will it be supported?<br />
Is it part or section of a larger system? Such<br />
as a ‘pod’ on a cluster tool, or unit/module on<br />
a serial process like solar production….<br />
What are access requirements<br />
– for use<br />
– for service—which ‘sides’ and components need<br />
access—remember pumps, valves, instruments<br />
! Footprint allowed for working system needs to<br />
allow for disassembly, maintenance<br />
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More Questions to ask…<br />
How automated will the system need to be? Level of<br />
operator training?<br />
How is the chamber to be loaded in use? Will there<br />
be a loadlock?<br />
Where in the chamber will the process occur? Is it only<br />
in some section of the chamber—under a target say.<br />
This may mean the need for movement/robotics to<br />
transport the substrate. How will the substrate be<br />
located and held? Chuck, platen?<br />
On heavy and large chambers, is a crane needed for<br />
installation?<br />
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Still more Questions!<br />
What services need to be provided<br />
– Electrical connections, with power ratings<br />
– Gasses<br />
– Heating, cooling requirements<br />
– Viewports<br />
Wavelength<br />
Shutter<br />
Weight of ‘attachments’<br />
– Do they need support?<br />
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Safety<br />
“A vacuum chamber is a pressure vessel waiting<br />
to happen.”<br />
--Joel Bowers, LLNL & AVS Instructor<br />
For many processes, gas is admitted to the<br />
chamber. This makes the above statement a<br />
possibility. Some steps to take:<br />
– Use a burst disk or some other safety device<br />
– <strong>Design</strong> to some pressure vessel standard<br />
– Use a direct gauge for back filling<br />
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Additional Safety Concerns<br />
Handling of hazardous gases or materials<br />
Electrical service—voltage and current levels<br />
may be transferred into to the chamber<br />
Personnel safety, especially on large<br />
chambers where people enter<br />
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Interior of Alcator CMOD with<br />
person climbing in to work.<br />
(Courtesy of Bob Childs)<br />
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Minimize all Gas Sources<br />
Point of vacuum technology is to get a low<br />
pressure, low gas density environment<br />
Remember our basic equation: P = Q/S<br />
Keep in mind Q is really Q total . Sources of gas<br />
are:<br />
– outgassing<br />
– diffusion<br />
– permeation<br />
– virtual leak<br />
– real leak<br />
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Virtual Leaks<br />
Material issues<br />
Welding<br />
– NO double welds<br />
Trapped volumes<br />
– O-ring grooves<br />
– Screw threads<br />
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Materials<br />
Process compatibility, requirements<br />
<strong>Vacuum</strong> compatibility<br />
Fabrication methods available<br />
Strength<br />
Availability<br />
! Be open minded on use of different alloys or<br />
materials<br />
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Specific Material Concerns<br />
<strong>Chamber</strong><br />
– Outgassing<br />
– Surface finish<br />
– Durabitlity, scratch resistance<br />
– Weight<br />
Seal<br />
– Metal vs. Elastomers<br />
Lubricants<br />
Windows<br />
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Outgassing Rates<br />
Material Outgassing Rate<br />
( Torr-liters/sec-cm 2 )<br />
Aluminum (fresh) 6.3 x 10 -9 -9<br />
OFHC Copper (mech. polished 3.5 x 10 -9 -9<br />
Stainless Steel<br />
(mechanically polished) 1.7 x 10 -9 -9<br />
(vacuum baked at 250°C for 30 hrs) 3.0 x 10 -12<br />
Aluminum<br />
(vacuum baked at 250°C for 15 hrs) 4.0 x 10 -13<br />
Pyrex (fresh) 7.4 x 10 -9 -9<br />
Neoprene 3.0 x 10 -5 -5<br />
Polystyrene 2.0 x 10 -5 -5<br />
Plexiglas 3.1 x 10 -6 -6<br />
Viton A 1.1 x 10 -6 -6<br />
PVC (24 hr at 95% RH) 8.5 x 10 -7 -7<br />
Teflon 6.5 x 10 -8 -8<br />
Viton A (baked) 8.0 x 10 -9 -9<br />
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Outgassing Rates, sst<br />
Ref: M.H. Hablanian, ‘High-<strong>Vacuum</strong>Technology:<br />
A Practical Guide’. 2 nd nd ed. 1997, CRC<br />
Press<br />
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Limitations of Elastomer Seals<br />
Elastomers such as in seals can adversely affect<br />
the ultimate pressure of a system.<br />
Ways in which elastomers add to the gas load<br />
are:<br />
– Outgassing<br />
– Permeation<br />
– Water dissolved in the bulk:<br />
Reported value for Viton-A, for air 4.3 atm-cm 3 /cm 3 of<br />
Viton (de Csernatony, VACUUM 16,129, 1966)<br />
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<strong>Chamber</strong> with Necessary O-ring<br />
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Outgassing Rates of Common<br />
Elastomers<br />
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Gas Load due to Permeation<br />
1.00E-06<br />
1.00E-07<br />
Leak Indication, mbar-l/sec<br />
1.00E-08<br />
1.00E-09<br />
1.00E-10<br />
1.00E-11<br />
0:00:00 0:02:00 0:04:00 0:06:00 0:08:00 0:10:00<br />
Time (h : m : sec)<br />
22% comp,Viton,140 C, 3 Oct 08 22% comp, Viton, Room T, 4 Sept 08<br />
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Temperature Effect on<br />
Permeation<br />
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Fabrication Methods<br />
Machining from billet<br />
– Expensive<br />
– More likely for aluminum<br />
Assembled<br />
– By welding plates together<br />
– Using tubing<br />
Casting<br />
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<strong>Chamber</strong> Made By Casting<br />
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<strong>Chamber</strong> from Welded Plate<br />
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Surface Treatments<br />
Outgassing of internal surface is important<br />
parameter from a functional sense.<br />
Typical Surface treatments:<br />
–Electropolishing<br />
Maybe done offsite<br />
–Beadblasting<br />
Beadblasting of most seal surfaces is ok.<br />
–Mechanical polishing<br />
! Specify a surface treatment for function rather<br />
than looks.<br />
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Electropolished <strong>Chamber</strong><br />
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Cleaning Processes<br />
What is the necessary requirement for ‘clean’?<br />
How was it determined?<br />
Customary types of cleaning are:<br />
– Ultrasonic washing<br />
– Pressure washing<br />
– Wipe down<br />
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Packaging and Shipping<br />
Maintain the cleanliness<br />
until assembly.<br />
Protect seal surfaces,<br />
etc.<br />
How will it be shipped?<br />
How much protection is<br />
needed?<br />
Different size chambers<br />
have different<br />
requirements<br />
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A LONG Trip!<br />
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Performance and Verification<br />
Is some chamber performance verification needed?<br />
If so, where is the verification to be done?<br />
– At manufacturer’s or at customer site?<br />
What parameter is to be used?<br />
– Ultimate pressure?<br />
– Pumpdown time?<br />
– RGA scan ?<br />
! Process or result base, such as quality of a film produced—<br />
but this is not a chamber spec!<br />
Should be before any process is run, or gas admitted<br />
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Leak Testing<br />
State a reasonable leak spec<br />
HeMSLDT is most likely leak test method<br />
– Rate of rise is another possible method<br />
– Acoustic methods<br />
How is the leak testing to be performed?<br />
– Pump chamber with leak detector port attached to<br />
chamber and spray outside of chamber.<br />
– Pressurize the chamber and ‘sniff’<br />
! Leak signal response time<br />
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Putting <strong>Chamber</strong> into Service<br />
Perform assembly under clean conditions to<br />
maintain cleanliness.<br />
Consider a ‘modular assembly’ procedure to<br />
test component performance piece wise.<br />
Leak testing a chamber/system during<br />
assembly may utilize different techniques.<br />
– Use system pumping to pump/rough for HeMSLT<br />
– RGA<br />
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Use and Maintenance<br />
Involve maintenance dept. during set up<br />
Log books for operators and maintenance—<br />
from ‘Day 1’. Log<br />
– Performance when new<br />
– Performance at regular intervals<br />
– Maintenance and upgrades<br />
– Performance after maintenance<br />
! Record/document improvements that should be<br />
incorporated into future builds.<br />
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Upgrades and Expansion Down<br />
the Road<br />
Process Gurus always want some better<br />
performance later…<br />
Additional instrumentation<br />
– Include additional ports<br />
Pump ports<br />
– Go up a flange size?<br />
Perhaps a modular design approach where<br />
some parts can be reused, or easily modified<br />
Use metal seals up front instead of (initially)<br />
lower cost elastomers sealed<br />
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Tolerances<br />
Tight tolerances cost money!<br />
Keep all tolerances reasonable<br />
– Linear dimensions<br />
– Port placement<br />
– Port angular placement<br />
– Alignment<br />
! In a reasonably engineered product, only some<br />
dimensions will be critical, and therefore have tight<br />
tolerances.<br />
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List Details Like Port size and Use<br />
<strong>Chamber</strong> Ports Listing<br />
1. Port for Turbo Pump (One 10-inch)<br />
a. 10-inch Conflat<br />
2. Port for Load Lock (One-10 or 12-inch)<br />
a. 12-inch Conflat (Maybe only 10-inch).<br />
3. Ports for sputtering sources (Four 8-inch)<br />
a. Configured in “sputter up” orientation.<br />
b. 2 at 180°, 3 at 120° (Dual and Triplet Co focal to allow future co sputtering)<br />
c. Nominal 25° angle with substrate normal.<br />
d. 16-inch distance from flange to substrate center.<br />
e. All 8-inch Conflat<br />
4. Substrate Mechanical Connection (“Touch-<strong>Of</strong>f” Port) (One, 8-inch)<br />
a. 8-inch Conflat.<br />
b. On deposition side of substrate<br />
5. View Ports (One 8-inch, One 4.5-inch, Three 2.75-inch)<br />
a. 8-inch Conflat (View substrate from side).<br />
b. 4.5-inch Conflat (View substrate from bottom).<br />
c. 2.75-inch Conflat (Optical Pyrometer)<br />
i. Located on deposition side of substrate<br />
ii. Near but not normal (allow for particle sequestration).<br />
d. 2.75-inch Conflat (Pair for Transmission Measurement)<br />
i. Collinear pair aligned through center of substrate. Near normal<br />
6. Gauge Ports (Four 2.75-inch)<br />
a. 2.75-inch Conflat. For Ionization Gauge (assess base pressure at highvacuum)<br />
b. 2.75-inch Conflat. For convection-enhance gauge (atmospheric pressure to<br />
10 -4 torr, used for system control)<br />
c. 2.75-inch Conflat. For high-precision capacitance manometer (0.1-100<br />
mtorr, used for depositon process control).<br />
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Lots of Ports!<br />
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The Specification should now<br />
include:<br />
Material information<br />
Bill of Materials<br />
Dimensions with reasonable tolerances<br />
Fabrication notes and methods<br />
Cleaning requirements<br />
Acceptance/performance verification<br />
Packaging information<br />
Plan for putting chamber into service<br />
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Don’ts in <strong>Chamber</strong> <strong>Design</strong><br />
Don’t Forget all the design help available<br />
– Manufacturers<br />
– Classes such as AVS classes<br />
– Software<br />
Don’t design a chamber without looking at the whole<br />
system ‘big picture’.<br />
– Get all inputs<br />
– Full documentation<br />
Don’t use unreasonable tolerances<br />
Don’t over specify material, surface finishes<br />
Don’t disregard input, information from your chamber<br />
vendor<br />
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Do’s in <strong>Chamber</strong> <strong>Design</strong><br />
Do use good vacuum design principles<br />
Do choose and involve chamber vendor at an<br />
early stage<br />
Do Share information, needs with vendor<br />
Do be open to give and take with the chamber<br />
vendor. Use their knowledge and experience.<br />
Do keep vendor in the loop as the chamber is<br />
put into service<br />
! We like feedback from our customers. It helps<br />
the next one.<br />
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Napkin vs. Envelope…<br />
A full ‘packet’ of documentation is needed. This will<br />
cover issues from the thinking stage to use of the<br />
system/chamber. Information will be helpful for both<br />
your facility as well as vendors in the project, such as<br />
MKS’ <strong>Chamber</strong> Facility.<br />
A full chamber design will not fit on a napkin or an<br />
envelope!<br />
very – (unless you write very very small, or the envelope is big).<br />
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Acknowledgments<br />
Thank you for your interest in the presentation.<br />
If you have questions, current or future<br />
chamber needs, please contact us.<br />
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