SC16IS740/750/760 Single UART with I2C-bus/SPI interface, 64 ...

NXP Semiconductors
SC16IS740/750/760
Single UART with I 2 C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
SOT616-3
D
B
A
terminal 1
index area
A
A1
c
E
detail X
e 1
C
L
1/2 e
e
b
7 12
v M
w M
C
C
A
B
y 1 C
y
6
E h
D h
e
13
e 2
1/2 e
1
18
terminal 1
index area
24 19
X
0 2.5 5 mm
DIMENSIONS (mm are the original dimensions)
A
UNIT
(1)
A 1 b c D D
max.
(1) h
E (1)
E h
scale
e e 1
e 2
L
v
w
y
y 1
mm
0.05 0.30
1 0.2
0.00 0.18
4.1
3.9
2.75
2.45
4.1
3.9
2.75
2.45
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05 0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC JEDEC JEITA
EUROPEAN
PROJECTION
ISSUE DATE
SOT616-3
- - -
MO-220
- - -
04-11-19
05-03-10
Fig 42.
Package outline SOT616-3 (HVQFN24)
SC16IS740_750_760_6
© NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 06 — 13 May 2008 55 of 62