IntelÃ‚Â® Desktop Board DG41RQ Technical Product Specification

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Intel Desktop Board DG41RQ Technical Product Specification1.5.1 Memory ConfigurationsThe Intel 82G41 GMCH supports the following types of memory organization:• Dual channel (Interleaved) mode. This mode offers the highest throughput forreal world applications. Dual channel mode is enabled when the installed memorycapacities of both DIMM channels are equal. Technology and device width can varyfrom one channel to the other but the installed memory capacity for each channelmust be equal. If different speed DIMMs are used between channels, the slowestmemory timing will be used.• Single channel (Asymmetric) mode. This mode is equivalent to single channelbandwidth operation for real world applications. This mode is used when only asingle DIMM is installed or the memory capacities are unequal. Technology anddevice width can vary from one channel to the other. If different speed DIMMs areused between channels, the slowest memory timing will be used.• Flex mode. This mode provides the most flexible performance characteristics.The bottommost DRAM memory (the memory that is lowest within the systemmemory map) is mapped to dual channel operation; the topmost DRAM memory(the memory that is nearest to the 8 GB address space limit), if any, is mapped tosingle channel operation. Flex mode results in multiple zones of dual and singlechannel operation across the whole of DRAM memory. To use flex mode, it isnecessary to populate both channels.For information about…Memory Configuration ExamplesRefer to:http://www.intel.com/support/motherboards/desktop/sb/cs-011965.htm16
Product DescriptionFigure 3 illustrates the memory channel and DIMM configuration.Figure 3. Memory Channel Configuration and DIMM Configuration INTEGRATOR’S NOTERegardless of the memory configuration used (dual channel, single channel, or flexmode), DIMM 0 of Channel A must always be populated.17
Page 1 and 2: Взято с сайта www.wit.ru
Page 3 and 4: PrefaceThis Technical Product Speci
Page 5 and 6: Contents1 Product Description1.1 Ov
Page 7 and 8: ContentsFigures1. Major Board Compo
Page 9 and 10: 1 Product Description1.1 Overview1.
Page 11 and 12: Product Description1.1.2 Board Layo
Page 13 and 14: Product Description1.1.3 Block Diag
Page 15: Product DescriptionFor information
Page 19 and 20: Product Description• Display⎯ S
Page 21 and 22: Product Description1.6.3 Serial ATA
Page 23 and 24: Product Description1.8 Real-Time Cl
Page 25 and 26: Product Description1.10 Audio Subsy
Page 27 and 28: Product Description1.11 LAN Subsyst
Page 29 and 30: Product Description1.12 Hardware Ma
Page 31 and 32: Product Description1.13 Power Manag
Page 33 and 34: Product Description1.13.1.2 Wake-up
Page 35 and 36: Product Description1.13.2.2 Fan Hea
Page 37 and 38: Product Description1.13.2.9 +5 V St
Page 39 and 40: 2 Technical Reference2.1 Memory Map
Page 41 and 42: Technical ReferenceTable 9 lists th
Page 43 and 44: Technical Reference2.2.1 Back Panel
Page 45 and 46: Technical ReferenceTable 10 lists t
Page 47 and 48: Technical ReferenceTable 13. Rear C
Page 49 and 50: Technical Reference2.2.2.2 Add-in C
Page 51 and 52: Technical Reference2.2.2.5 Front Pa
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Page 55 and 56: Technical Reference2.4 Mechanical C
Page 57 and 58: Technical Reference2.5.2 Fan Header
Page 59 and 60: Technical ReferenceTable 29 provide
Page 61 and 62: 3 Overview of BIOS Features3.1 Intr
Page 63 and 64: Overview of BIOS Features3.3.2 PCI
Page 65 and 66: Overview of BIOS Features3.6 BIOS U
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Overview of BIOS Features3.8 Boot O
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Overview of BIOS Features3.10 BIOS
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4 Error Messages and Beep Codes4.1
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Error Messages and Beep CodesTable
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Error Messages and Beep CodesTable
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5 Regulatory Compliance and Battery
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Regulatory Compliance and Battery D
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