Annual Report 2011 (5.07 MB, PDF-File) - Oerlikon
Annual Report 2011 (5.07 MB, PDF-File) - Oerlikon
Annual Report 2011 (5.07 MB, PDF-File) - Oerlikon
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Remuneration <strong>Report</strong> Risk Management Financial <strong>Report</strong> Global Markets R & D Global Presence<br />
<strong>Oerlikon</strong> Advanced Technologies<br />
HEXAGON: up to three times higher throughput<br />
<strong>Oerlikon</strong> Advanced Technologies presented its latest solution<br />
for wafer level packaging of semiconductor components in<br />
<strong>2011</strong> at SEMICON Taiwan. The HEXAGON features a throughput<br />
two to three times faster than competing systems, which<br />
enables customers to dramatically reduce costs.<br />
The HEXAGON is optimized for advanced packaging technologies,<br />
and backside metallization. Semiconductor components<br />
can be packed more densely in this process, allowing for a<br />
higher degree of integration. This approach enables production<br />
of compact components with an extremely wide range of functionality<br />
and exceptional performance. They are used in such<br />
devices as smartphones, tablet computers, and smart TV’s.<br />
Research and development<br />
171<br />
HEXAGON’s significant throughput rate improvement was<br />
made possible by use of an optimized transport concept<br />
derived from high-speed machines used in data storage and<br />
photovoltaics. For the first time, it was possible to successfully<br />
transfer the concept to the demanding advanced packaging<br />
applications, allowing wafers to move simultaneously and in the<br />
same sequence through the machine – without making compromises<br />
in terms of vacuum and process requirements.
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