Annual Report 2011 (5.07 MB, PDF-File) - Oerlikon

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Solar in CHF million 2011 2010 Orders received 202 230 Order backlog 130 255 Sales (to third parties) 323 254 EBIT –10 –59 Employees 660 648 Oerlikon Solar provides field-proven equipment and end-to-end manufacturing lines for the mass production of environmentally sustainable thin film silicon solar modules. With its leading technology, Oerlikon Solar has increased the efficiency of thin film silicon and created innovative end-to-end turnkey manufacturing solutions for thin film PV. Oerlikon Solar leads the thin film solar equipment sector with 15 customers in production in seven countries, and more than 5 million modules with 450 MW of capacity produced worldwide. Amorphous thin film silicon PV technology Micromorph ® tandem technology High-precision laser scribing Transparent Conductive Oxide (TCO) Apollo Solar Ulvac Plasma-enhanced chemical vapor deposition (PECVD) End-to-end solutions for the mass production of thin film silicon solar modules Astronergy, Auria Solar, Bosch Solar, DongXu, Gongchuang, Hevel, Inventux, Pramac, Schott Solar, Sun Well, Tianwei N. America 0 % Europe 9 % Asia 68 % Other 23 % Coating in CHF million 2011 2010 Orders received 484 422 Order backlog – – Sales (to third parties) 484 422 EBIT 97 52 Employees 2 986 2 711 Oerlikon Coating is the world’s leading supplier of PVD coatings for tools and precision components. The coatings – deposited with state of the art equipment from Oerlikon Balzers – increase performance and therefore productivity. Coating services are offered through a network of 87 centers in 32 countries. High-performance coatings for: Cutting tools Punching and forming tools Dies and molds Cemecon Eifeler Hauzer Precision components for engine and fluid technology and mechanical drives Audi, Bosch, Ceratizit, Continental, Daimler, Ford, Hitachi, Iscar, Kennametal, Mahle, OSG, Samputensili, Sandvik, Siemens, SKF, VW, ZF N. America 12 % Europe 51 % Asia 30 % Other 7 % Ionbond Kobelco Platit Advanced Technologies in CHF million 2011 2010 Orders received 88 129 Order backlog 8 29 Sales (to third parties) 108 129 EBIT 11 10 Employees 200 196 Oerlikon Advanced Technologies offers cost-efficient and flexible thin film deposition systems and processes to the semiconductor, optical data storage and advanced nanotechnology markets. Applications for the semiconductor market include advanced packaging, power devices, read/write heads for hard disks, LEDs and Micro-Electro-Mechanical Systems (MEMS). Solutions in the advanced nanotechnology sector comprise photovoltaics, touch panels and thermoelectrics. Semiconductor deposition production equipment for: Read/Write heads for hard drives Advanced packaging/ 3D Thin wafer processing for backside metal MEMS and solid state lighting (LED) Applied Materials Centrotherm Nexx Deposition production equipment for: c-Si solar cells energy harvesting applications thermoelectric generators ABB, Amkor, ASE, Bosch, CREE, Fairchild, Hewlett Packard, Infineon, NXP, Osram, Panasonic, PV Industry, Ritek, Seagate, SMIC, Sony, ST, TI, TSMC N. America 12 % Europe 42 % Asia 45 % Other 1 % Micromorph 1 1 1 ® production Coating services of Advanced lines cutting tools Nanotechnology 41 % 40 % 33 % SPTS Ulvac
On a new level 2011 was a year of significant progress and improvement. We went through a fundamental process of change, marking the beginning of a multi-year agenda to rebuild processes at the very foundations of the organization. 3
Page 1 and 2: on a new level Annual Report 2011
Page 3 and 4: Vision Oerlikon creates innovative
Page 5: Oerlikon’s Segments in brief Text
Page 9 and 10: I. Operational review We achieved a
Page 11 and 12: Dear Shareholders, 2011 was a break
Page 13 and 14: Solid performance of Oerlikon share
Page 15 and 16: Remuneration Report Risk Management
Page 19 and 20: Achieving a new level of profitabil
Page 23: Remuneration Report Risk Management
Page 26 and 27: Dr. Michael Buscher, CEO Oerlikon G
Page 28 and 29: 3.1 Oerlikon Textile 1. In 2011, Oe
Page 31 and 32: Turnaround time reduced by 40 % The
Page 33 and 34: Turnaround time reduced by 40 %
Page 35: Business development Oerlikon Drive
Page 38 and 39: Gary Lehman, CEO Oerlikon Drive Sys
Page 40 and 41: 3.3 Oerlikon Vacuum 1. Oerlikon Vac
Page 43 and 44: Output improved by 30 % “For a lo
Page 45 and 46: Output improved by 30 %
Page 47: Business development In 2011, the s
Page 50 and 51: Helmut Frankenberger, CEO Oerlikon
Page 52 and 53: 3.5 Oerlikon Coating 1. Oerlikon Co
Page 55 and 56: Productivity gains boost profitabil
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Productivity gains boost profitabil
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Business development Oerlikon Advan
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Andreas Dill, CEO Oerlikon Advanced
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4.0 Sustainability 1. Oerlikon prod
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48 When a fine spray of fuel is fir
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5.0 Compliance 1. In 2011, Oerlikon
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6.0 Corporate Governance Group stru
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54 Letter Information for Investors
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58 Stability and competence The Oer
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60 Composition of the Board of Dire
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62 Composition of Committees of the
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68 Leadership and accountability Th
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70 Composition of the Executive Com
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7.0 Remuneration report In this rem
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78 Compensation of non-executive me
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82 Share options Letter Information
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8.0 Risk management 1. The 2011 enh
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Contents I. Operational review 1.0
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Key Figures Group Notes OC Oerlikon
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102 Expenses included in EBIT Key F
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104 Deferred taxes Key Figures Grou
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106 Financial investments Key Figur
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108 Property, plant and equipment i
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110 Key Figures Group Notes OC Oerl
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112 Intangible assets Previous year
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114 Post-employment benefit provisi
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116 Provisions in CHF million Key F
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118 Liquidity risk Key Figures Grou
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120 Credit risk Key Figures Group N
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122 Market risk Key Figures Group N
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124 Capital management Key Figures
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126 Related Party transactions Key
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128 Related Party transactions Memb
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130 Segment information Key Figures
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132 Companies by country Country Pr
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134 Report of the Statutory Auditor
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Contents I. Operational review 1.0
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9.0 Outlook for global markets Tren
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Remuneration Report Risk Management
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10.0 Research and development In 20
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166 Innovation highlights Oerlikon
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168 Oerlikon Vacuum MAGiNTEGRA: rob
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170 Oerlikon Coating INGENIA: the q
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11.0 Expanding the global footprint
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174 Oerlikon further expands in gro
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176 the greater the opportunity for
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Financial calendar March 5, 2012 An
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AB Applied Biosystems ∙ ABB ∙ A
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Annual Report 2011 (5.07 MB, PDF-File) - Oerlikon

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