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Package Mechanical SpecificationsFigure 2-3. Processor Package Drawing (Sheet 2 of 2)HGFEDCBA8 7 6 5 4 3 2THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTSMAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.SEE DETAIL D2X 39BAAYAWAVAUATARAPANAMALAKAJAHAG4XAFSURFACEAETEST PAD AREAADACAB2X 36.514.4AAYWV7.2UTRPNMKHGFEDCBA1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 432 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 429.45518.910.23 C H EM NSEE DETAIL EMNHR 2DETAIL DSCALE 15:1R 1GH0.23 C H GJ KDETAIL ESCALE 15:1MILLIMETERSSYMBOLCOMMENTSMIN MAXR 1 R1.09 --R 2 R1.09 --T 1 0.2 --T 2 11.7 --V 1 0.2 --V 2 11.7 --DEPARTMENT8 7 6 5 4 3 2 1V 2HT 1T 2V 1G2200 MISSION COLLEGE BLVD.P.O. BOX 58119SANTA CLARA, CA 95052-8119DWG. NO SHT. REVD76126 2 7C1.06 MAXCOMPONENT HEIGHTSIZE DRAWING NUMBER REVA1 D76126 7SCALE: NOT SCALE DRAWING 2:1 DO SHEET 2 OF 2HGFEDCBAJKELJRE<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketThermal/Mechanical Design Guide August 201014 Order Number: 323107-002US
Package Mechanical Specifications2.1.2 Processor Component Keep-Out ZonesThe processor may contain components on the substrate that define componentkeep-out zone requirements. A thermal and mechanical solution design must notintrude into the required keep-out zones. Do not contact the Test Pad Area withconductive material. Decoupling capacitors are typically mounted to either the topsideor land-side of the package substrate. See Figure 2-2 and Figure 2-3 for keep-outzones. The location and quantity of package capacitors may change due tomanufacturing efficiencies but will remain within the component keep-in.2.1.3 Package Loading Specifications.Table 2-1 provides load specifications for the processor package. These maximumlimits should not be exceeded during heatsink assembly, shipping conditions, orstandard use condition. Exceeding these limits during test may result in componentfailure. The processor substrate should not be used as a mechanical reference or loadbearingsurface for thermal solutions.Table 2-1.Processor Loading SpecificationsParameter Maximum NotesStatic Compressive Load 890 N [200 lbf] 1, 2, 3Dynamic Compressive Load1779 N [400 lbf] [max staticcompressive + dynamic load]1, 3, 4Notes:1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism(ILM).3. These specifications are based on limited testing for design characterization. Loading limits are for thepackage constrained by the limits of the processor socket.4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static loadrequirement.2.1.4 Package Handling GuidelinesTable 2-2 includes a list of guidelines on package handling in terms of recommendedmaximum loading on the processor IHS relative to a fixed substrate. These packagehandling loads may be experienced during heatsink removal.Table 2-2.Package Handling GuidelinesParameterShearTensileTorqueMaximum Recommended70 lbs25 lbs35 in.lbs2.1.5 Package Insertion SpecificationsThe processor can be inserted into and removed from a LGA1366 socket 15 times. Thesocket should meet the LGA1366 requirements detailed in Section 5.<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 15
Page 1 and 2: Intel ® Xeon ® ProcessorC5500/C35
Page 3 and 4: Contents1 Introduction.............
Page 6 and 7: C-1 Socket Mechanical Drawing - (Sh
Page 9 and 10: Introduction1.1 Reference Documents
Page 11 and 12: Package Mechanical Specifications2
Page 13: Package Mechanical SpecificationsFi
Page 19 and 20: LGA1366 SocketFigure 3-2.LGA1366 So
Page 21 and 22: LGA1366 Socket3.2 Attachment to Mot
Page 23 and 24: LGA1366 Socket3.4 Package Installat
Page 25 and 26: LGA1366 Socket.Figure 3-7.LGA1366 N
Page 27 and 28: Independent Loading Mechanism (ILM)
Page 29 and 30: Independent Loading Mechanism (ILM)
Page 31 and 32: LGA1366 Socket and ILM Electrical,
Page 37 and 38: Thermal SpecificationsThe Intel ®
Page 39 and 40: Thermal SpecificationsFigure 6-2.In
Page 41 and 42: Thermal SpecificationsTable 6-6.Int
Page 43 and 44: Thermal SpecificationsTable 6-9.Int
Page 45 and 46: Thermal SpecificationsTable 6-12.In
Page 47 and 48: Thermal Specifications6.1.2 Thermal
Page 49 and 50: Thermal Specifications6.2.2.1 Frequ
Page 51 and 52: Thermal SpecificationsPROCHOT# can
Page 53 and 54: Thermal Specifications6.3.2 PECI Sp
Page 55 and 56: Thermal SolutionsFor a 1U reference
Page 57 and 58: Thermal SolutionsFigure 7-3.TTV Die
Page 59 and 60: Thermal Solutions7.5 Thermal Design
Page 61 and 62: Thermal Solutions7.5.3 Power Therma
Page 63 and 64: Thermal SolutionsIncreased IMON acc
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Thermal SolutionsFigure 7-9.UP ATCA
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Quality and Reliability Requirement
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Quality and Reliability Requirement
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Component SuppliersTable A-2.LGA136
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Mechanical DrawingsFigure B-1. Boar
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Mechanical DrawingsFigure B-3. Boar
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Mechanical DrawingsFigure B-5. 1U R
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Mechanical DrawingsFigure B-7. 1U R
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Mechanical DrawingsFigure B-9. Heat
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Mechanical DrawingsFigure B-11. Hea
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Mechanical DrawingsFigure B-13. ATC
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Mechanical DrawingsFigure B-15. ATC
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Socket Mechanical DrawingsCSocket M
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Socket Mechanical DrawingsFigure C-
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Socket Mechanical DrawingsFigure C-
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