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Thermal SolutionsFigure 7-7.UP ATCA Thermal SolutionNote:Thermal sample only, retention not production ready.Figure 7-8.UP ATCA System LayoutAirflowdirectionNote:Heatsink should be optimized for the layout.<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 64

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