Download PDF - Intel

More documents

Recommendations

Info

Mechanical DrawingsFigure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4)DCBA8765THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTSMAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.PRIMARY SIDE3D HEIGHT RESTRICTION ZONESSECONDARY SIDE3D HEIGHT RESTRICTION ZONES876543DWG. NO SHT. REVD77712 4 021REVISION HISTORYZONE REV DESCRIPTION DATE APPROVED- A ORIGINAL RELEASE 09/29/06 -M.B COMPONENT HEIGHT RESTRICTION10/05/06CHANGED FROM 2.5MM TO 7MMC ADDED ADDITION KO FOR RM, SHEET 1 10/27/06D DRAWING RE-DO, ADDED BALL PATTERN, SOCKETBODY, BALL 1, BACKSIDE WINDOW, GENERAL11/03/06DRAWING CLARIFICATIONS.E UPDATED SOCKET KEEPIN OUTLINE TO REFLECT 11/30/06RECENT CHANGES. SEE KEEPIN ZONE 1OUTLINE, SHEETS 1 & 2.2D3 F CORRECTED ILM HOLE DIAMETER. WAS SHOWING 12/18/06RADIUS VALUE. 1.9 --> 3.82C1 UPDATED BACKPLATE HOLE DIAMTER SIZE FOR DTCOMPATIBILITY. DIAMETER 4.0 --> 4.03G REMOVED 3.0 MM HEIGHT RESTRICTION ZONE 01/12/07THIS HEIGHT REPRESENTS AN ARBITRARYTO THE LEFT AND RIGHT OF SOCKET OUTLINEMOTHERBOARD THICKNESSH MOVED REVISION HISTORY TABLE TO SHEET 4 01/19/07CORRECTED SOCKET SOLDERBALL ARRAY & POS1C641.66 --> 40.64 (ARRAY SIZE)1B544.85 --> 44.70 (ARRAY SIZE)2B862.43 --> 62.39 (ARRAY POSITION)2D619.17 --> 19.67 (ARRAY POSITION)2D4 ADDED TOPSIDE CU PAD CALLOUT FOR ILM HOLESSEE DETAIL A, SHEET 2I REVERTED SOCKET SOLDERBALL ARRAY01/22/07X DIRECTION SIZE AND POSITION TO REV G.1C640.64 --> 41.66 (ARRAY WIDTH)2D619.67 --> 19.17 (ARRAY POSITION)SOLDERBALL ARRAY OUTLINE REPRESENTS THECENTERLINE OF THE OUTER BALL ROWS/COLSSHT 4 J ADDED ISO VIEW OF SECONDARY SIDE02/06/07SHT 4 MOVED ISO VEWS TO SHEET 4SHT 3 MODIFIED BACKSIDE HEIGHT RESTRICTIONS FORNEW BACKPLATE GEOMETRYSHT 1 ADDED NOTE 5 DETAILING HEIGHT RESTRICTIONNOMENCLATUREREMOVED TOLERANCE BLOCK VALUES,SEE NOTE 5K UPDATED ZONE 1 KEEPOUT ON SHEETS 1 & 2 02/27/07TO ALLOW MORE SOCKET LEVER ARM ACCESS,LEFT SIDE OF ZONE01 PRODUCTION RELEASE 08/02/07ALL ZONES, SEE NOTE 502 ZONE 6 HEIGHT FROM 1.8MM --> 1.97MM02/24/09ADDED NOTE 7DEPARTMENTSIZE DRAWING NUMBERREV2200 MISSION COLLEGE BLVD.P.O. BOX 58119DD7771202EASD / PTMISANTA CLARA, CA 95052-8119SCALE: 2.500 DO NOT SCALE DRAWING SHEET 4 OF 44321DCBARB<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 76
Mechanical DrawingsFigure B-5. 1U Reference Heatsink Assembly (Sheet 1 of 2)ASSEMBLY, HEAT SINK, 1U<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketThermal/Mechanical Design Guide August 201077 Order Number: 323107-002US
Page 1 and 2:
Intel ® Xeon ® ProcessorC5500/C35
Page 3 and 4:
Contents1 Introduction.............
Page 6 and 7:
C-1 Socket Mechanical Drawing - (Sh
Page 9 and 10:
Introduction1.1 Reference Documents
Page 11 and 12:
Package Mechanical Specifications2
Page 13 and 14:
Package Mechanical SpecificationsFi
Page 15 and 16:
Package Mechanical Specifications2.
Page 19 and 20:
LGA1366 SocketFigure 3-2.LGA1366 So
Page 21 and 22:
LGA1366 Socket3.2 Attachment to Mot
Page 23 and 24:
LGA1366 Socket3.4 Package Installat
Page 25 and 26: LGA1366 Socket.Figure 3-7.LGA1366 N
Page 27 and 28: Independent Loading Mechanism (ILM)
Page 29 and 30: Independent Loading Mechanism (ILM)
Page 31 and 32: LGA1366 Socket and ILM Electrical,
Page 37 and 38: Thermal SpecificationsThe Intel ®
Page 39 and 40: Thermal SpecificationsFigure 6-2.In
Page 41 and 42: Thermal SpecificationsTable 6-6.Int
Page 43 and 44: Thermal SpecificationsTable 6-9.Int
Page 45 and 46: Thermal SpecificationsTable 6-12.In
Page 47 and 48: Thermal Specifications6.1.2 Thermal
Page 49 and 50: Thermal Specifications6.2.2.1 Frequ
Page 51 and 52: Thermal SpecificationsPROCHOT# can
Page 53 and 54: Thermal Specifications6.3.2 PECI Sp
Page 55 and 56: Thermal SolutionsFor a 1U reference
Page 57 and 58: Thermal SolutionsFigure 7-3.TTV Die
Page 59 and 60: Thermal Solutions7.5 Thermal Design
Page 61 and 62: Thermal Solutions7.5.3 Power Therma
Page 63 and 64: Thermal SolutionsIncreased IMON acc
Page 65 and 66: Thermal SolutionsFigure 7-9.UP ATCA
Page 67 and 68: Quality and Reliability Requirement
Page 69 and 70: Quality and Reliability Requirement
Page 71 and 72: Component SuppliersTable A-2.LGA136
Page 73 and 74: Mechanical DrawingsFigure B-1. Boar
Page 75: Mechanical DrawingsFigure B-3. Boar
Page 79 and 80: Mechanical DrawingsFigure B-7. 1U R
Page 81 and 82: Mechanical DrawingsFigure B-9. Heat
Page 83 and 84: Mechanical DrawingsFigure B-11. Hea
Page 85 and 86: Mechanical DrawingsFigure B-13. ATC
Page 87 and 88: Mechanical DrawingsFigure B-15. ATC
Page 89 and 90: Socket Mechanical DrawingsCSocket M
Page 91 and 92: Socket Mechanical DrawingsFigure C-
Page 93: Socket Mechanical DrawingsFigure C-
show all

Download PDF - Intel

Create successful ePaper yourself

Delete template?

Save as template?