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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT ASPROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDINGLIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANYPATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, orlife sustaining applications.Intel may make changes to specifications and product descriptions at any time, without notice.Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intelreserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from futurechanges to them.The Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known as errata whichmay cause the product to deviate from published specifications. Current characterized errata are available on request.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.The code name “Picket Post" presented in this document are only for use by Intel to identify products, technologies, or services indevelopment, that have not been made commercially available to the public, i.e., announced, launched or shipped. They are notcommercial names for products or services and are not intended to function as trademarks.Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.* Other brands and names may be claimed as the property of others.Copyright © 2010, Intel Corporation.Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketThermal/Mechanical Design Guide August 20102 Order Number: 323107-002US
Contents1 Introduction..............................................................................................................81.1 Reference Documents ..........................................................................................91.2 Definition of Terms ..............................................................................................92 Package Mechanical Specifications .......................................................................... 112.1 Package Mechanical Specifications ....................................................................... 112.1.1 Package Mechanical Drawing.................................................................... 122.1.2 Processor Component Keep-Out Zones...................................................... 152.1.3 Package Loading Specifications ................................................................ 152.1.4 Package Handling Guidelines.................................................................... 152.1.5 Package Insertion Specifications............................................................... 152.1.6 Processor Mass Specification.................................................................... 162.1.7 Processor Materials................................................................................. 162.1.8 Processor Markings................................................................................. 162.1.9 Processor Land Coordinates ..................................................................... 173 LGA1366 Socket ...................................................................................................... 183.1 Board Layout .................................................................................................... 203.2 Attachment to Motherboard ................................................................................ 213.3 Socket Components........................................................................................... 213.3.1 Socket Body Housing .............................................................................. 213.3.2 Solder Balls ........................................................................................... 213.3.3 Contacts ............................................................................................... 223.3.4 Pick and Place Cover............................................................................... 223.4 Package Installation / Removal ........................................................................... 233.4.1 Socket Standoffs and Package Seating Plane.............................................. 233.5 Durability ......................................................................................................... 243.6 Markings .......................................................................................................... 243.7 Component Insertion Forces ............................................................................... 243.8 Socket Size ...................................................................................................... 243.9 LGA1366 Socket NCTF Solder Joints..................................................................... 244 Independent Loading Mechanism (ILM)................................................................... 264.1 Design Concept................................................................................................. 264.1.1 ILM Cover Assembly Design Overview ....................................................... 264.1.2 ILM Back Plate Design Overview............................................................... 274.2 Assembly of ILM to a Motherboard....................................................................... 285 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 315.1 Component Mass............................................................................................... 315.2 Package/Socket Stackup Height .......................................................................... 315.3 Socket Maximum Temperature............................................................................ 315.4 Loading Specifications........................................................................................ 335.4.1 Board Deflection Guidance....................................................................... 335.5 Electrical Requirements...................................................................................... 345.6 Environmental Requirements .............................................................................. 356 Thermal Specifications ............................................................................................ 366.1 Package Thermal Specifications........................................................................... 366.1.1 Thermal Specifications ............................................................................ 366.1.2 Thermal Metrology ................................................................................. 476.2 Processor Thermal Features................................................................................ 486.2.1 Processor Temperature ........................................................................... 486.2.2 Adaptive Thermal Monitor........................................................................ 48Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 3
Page 1: Intel ® Xeon ® ProcessorC5500/C35
Page 6 and 7: C-1 Socket Mechanical Drawing - (Sh
Page 9 and 10: Introduction1.1 Reference Documents
Page 11 and 12: Package Mechanical Specifications2
Page 13 and 14: Package Mechanical SpecificationsFi
Page 15 and 16: Package Mechanical Specifications2.
Page 19 and 20: LGA1366 SocketFigure 3-2.LGA1366 So
Page 21 and 22: LGA1366 Socket3.2 Attachment to Mot
Page 23 and 24: LGA1366 Socket3.4 Package Installat
Page 25 and 26: LGA1366 Socket.Figure 3-7.LGA1366 N
Page 27 and 28: Independent Loading Mechanism (ILM)
Page 29 and 30: Independent Loading Mechanism (ILM)
Page 31 and 32: LGA1366 Socket and ILM Electrical,
Page 37 and 38: Thermal SpecificationsThe Intel ®
Page 39 and 40: Thermal SpecificationsFigure 6-2.In
Page 41 and 42: Thermal SpecificationsTable 6-6.Int
Page 43 and 44: Thermal SpecificationsTable 6-9.Int
Page 45 and 46: Thermal SpecificationsTable 6-12.In
Page 47 and 48: Thermal Specifications6.1.2 Thermal
Page 49 and 50: Thermal Specifications6.2.2.1 Frequ
Page 51 and 52: Thermal SpecificationsPROCHOT# can
Page 53 and 54:
Thermal Specifications6.3.2 PECI Sp
Page 55 and 56:
Thermal SolutionsFor a 1U reference
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Thermal SolutionsFigure 7-3.TTV Die
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Thermal Solutions7.5 Thermal Design
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Thermal Solutions7.5.3 Power Therma
Page 63 and 64:
Thermal SolutionsIncreased IMON acc
Page 65 and 66:
Thermal SolutionsFigure 7-9.UP ATCA
Page 67 and 68:
Quality and Reliability Requirement
Page 69 and 70:
Quality and Reliability Requirement
Page 71 and 72:
Component SuppliersTable A-2.LGA136
Page 73 and 74:
Mechanical DrawingsFigure B-1. Boar
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Mechanical DrawingsFigure B-3. Boar
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Mechanical DrawingsFigure B-5. 1U R
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Mechanical DrawingsFigure B-7. 1U R
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Mechanical DrawingsFigure B-9. Heat
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Mechanical DrawingsFigure B-11. Hea
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Mechanical DrawingsFigure B-13. ATC
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Mechanical DrawingsFigure B-15. ATC
Page 89 and 90:
Socket Mechanical DrawingsCSocket M
Page 91 and 92:
Socket Mechanical DrawingsFigure C-
Page 93:
Socket Mechanical DrawingsFigure C-
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