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Thermal SpecificationsFigure 6-4.Intel ® Xeon ® Processor LC5518 Thermal ProfileNotes:1. Intel ® Xeon ® processor LC5518 Thermal Profile is representative of a volumetrically constrained platform.See Table 6-8 for discrete points that constitute the thermal profile.2. Implementation of Intel ® Xeon ® processor LC5518 nominal and short-term thermal profiles should resultin virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this ThermalProfile will result in increased probability of TCC activation and may incur measurable performance loss.3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do notrequire NEBS Level 3 compliance.4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operatingtemperatures, not to exceed 360 hours per year per year, as compliant with NEBS Level 3. Operation at theShort-Term Thermal Profile for durations exceeding 360 hours per year violate the processor thermalspecifications and may result in permanent damage to the processor.Table 6-8.Intel ® Xeon ® Processor LC5518 Thermal ProfilePower (W)Nominal T CASE_MAX (°C)Short-term T CASE_MAX(°C)0 52.0 67.05 54.7 69.710 57.3 72.315 60.0 75.020 62.6 77.625 65.3 80.330 68.0 83.035 70.6 85.640 73.3 88.348 77.5 92.5Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 42