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Contents1 Introduction..............................................................................................................81.1 Reference Documents ..........................................................................................91.2 Definition of Terms ..............................................................................................92 Package Mechanical Specifications .......................................................................... 112.1 Package Mechanical Specifications ....................................................................... 112.1.1 Package Mechanical Drawing.................................................................... 122.1.2 Processor Component Keep-Out Zones...................................................... 152.1.3 Package Loading Specifications ................................................................ 152.1.4 Package Handling Guidelines.................................................................... 152.1.5 Package Insertion Specifications............................................................... 152.1.6 Processor Mass Specification.................................................................... 162.1.7 Processor Materials................................................................................. 162.1.8 Processor Markings................................................................................. 162.1.9 Processor Land Coordinates ..................................................................... 173 LGA1366 Socket ...................................................................................................... 183.1 Board Layout .................................................................................................... 203.2 Attachment to Motherboard ................................................................................ 213.3 Socket Components........................................................................................... 213.3.1 Socket Body Housing .............................................................................. 213.3.2 Solder Balls ........................................................................................... 213.3.3 Contacts ............................................................................................... 223.3.4 Pick and Place Cover............................................................................... 223.4 Package Installation / Removal ........................................................................... 233.4.1 Socket Standoffs and Package Seating Plane.............................................. 233.5 Durability ......................................................................................................... 243.6 Markings .......................................................................................................... 243.7 Component Insertion Forces ............................................................................... 243.8 Socket Size ...................................................................................................... 243.9 LGA1366 Socket NCTF Solder Joints..................................................................... 244 Independent Loading Mechanism (ILM)................................................................... 264.1 Design Concept................................................................................................. 264.1.1 ILM Cover Assembly Design Overview ....................................................... 264.1.2 ILM Back Plate Design Overview............................................................... 274.2 Assembly of ILM to a Motherboard....................................................................... 285 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 315.1 Component Mass............................................................................................... 315.2 Package/Socket Stackup Height .......................................................................... 315.3 Socket Maximum Temperature............................................................................ 315.4 Loading Specifications........................................................................................ 335.4.1 Board Deflection Guidance....................................................................... 335.5 Electrical Requirements...................................................................................... 345.6 Environmental Requirements .............................................................................. 356 Thermal Specifications ............................................................................................ 366.1 Package Thermal Specifications........................................................................... 366.1.1 Thermal Specifications ............................................................................ 366.1.2 Thermal Metrology ................................................................................. 476.2 Processor Thermal Features................................................................................ 486.2.1 Processor Temperature ........................................................................... 486.2.2 Adaptive Thermal Monitor........................................................................ 48Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 3