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Thermal Solutions7.5.2 NEBS Thermal ProfileProcessors that offer a NEBS thermal profile are specified in the Intel ® Xeon ®Processor C5500/C3500 Series Datasheet).NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions.To help reliability, processors must meet the nominal thermal profile under standardoperating conditions and can only rise up to the Short-Term spec for NEBS excursions(see Figure 7-6). Short-Term is clearly defined for NEBS Level 3 but the 360 hours peryear limit is a key consideration.Note:Figure 7-6.Fan speed can be decreased and case temperatures can be allowed to rise above thethermal profile if the processor is below Tcontrol (see Section 7.6.1). Exceeding thethermal profile at these lower temperatures is not considered a risk to reliability.NEBS Thermal ProfileNote:1.) The thermal specifications shown in this graph are for reference only. See the Intel ® Xeon ® Processor C5500/C3500 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in theDatasheet supersedes any data in this figure.2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do notrequire NEBS Level 3 compliance.3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operatingtemperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.4.) Implementation of either thermal profile should result in virtually no TCC activation.5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processorthermal specifications and may result in permanent damage to the processor.Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 60
Thermal Solutions7.5.3 Power Thermal UtilityThe Intel ® Xeon ® processor C5500/C3500 series Power Thermal Utility allows powerand thermal testing of the processor.The Utility will allow power and thermal testing of the processor. The thermal solutionmust be designed to keep the processor Tcase within specification for the ThermalDesign Power (TDP) as specified in Section 6. Contact your Intel representative toobtain the latest revision of the PTU.The default power level from the drop down list represents TDP.7.6 Thermal FeaturesMore information regarding processor thermal features is contained in the appropriateDatasheet.7.6.1 Fan Speed ControlThere are many ways to implement fan speed control. Using processor ambienttemperature (in addition to Digital Thermal Sensor) to scale fan speed with ambienttemperature can improve acoustics when DTS > TCONTROL.Table 7-2.Fan Speed Control, T CONTROL and DTS RelationshipConditionDTS ≤ T CONTROLFSC SchemeFSC can adjust fan speed to maintain DTS ≤ T CONTROL (low acoustic region).DTS > T CONTROLFSC should adjust fan speed to keep T CASE at or below the Thermal Profilespecification (increased acoustic region).7.6.1.1 T CONTROL GuidanceFactory configured T CONTROL values are available in the appropriate Dear CustomerLetter or may be extracted by issuing a Mailbox or an RDMSR instruction. See theappropriate Electrical, Mechanical, and Thermal Specifications (EMTS) for moreinformation.Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketThermal/Mechanical Design Guide August 201061 Order Number: 323107-002US
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Intel ® Xeon ® ProcessorC5500/C35
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Contents1 Introduction.............
Page 6 and 7:
C-1 Socket Mechanical Drawing - (Sh
Page 9 and 10: Introduction1.1 Reference Documents
Page 11 and 12: Package Mechanical Specifications2
Page 13 and 14: Package Mechanical SpecificationsFi
Page 15 and 16: Package Mechanical Specifications2.
Page 19 and 20: LGA1366 SocketFigure 3-2.LGA1366 So
Page 21 and 22: LGA1366 Socket3.2 Attachment to Mot
Page 23 and 24: LGA1366 Socket3.4 Package Installat
Page 25 and 26: LGA1366 Socket.Figure 3-7.LGA1366 N
Page 27 and 28: Independent Loading Mechanism (ILM)
Page 29 and 30: Independent Loading Mechanism (ILM)
Page 31 and 32: LGA1366 Socket and ILM Electrical,
Page 37 and 38: Thermal SpecificationsThe Intel ®
Page 39 and 40: Thermal SpecificationsFigure 6-2.In
Page 41 and 42: Thermal SpecificationsTable 6-6.Int
Page 43 and 44: Thermal SpecificationsTable 6-9.Int
Page 45 and 46: Thermal SpecificationsTable 6-12.In
Page 47 and 48: Thermal Specifications6.1.2 Thermal
Page 49 and 50: Thermal Specifications6.2.2.1 Frequ
Page 51 and 52: Thermal SpecificationsPROCHOT# can
Page 53 and 54: Thermal Specifications6.3.2 PECI Sp
Page 55 and 56: Thermal SolutionsFor a 1U reference
Page 57 and 58: Thermal SolutionsFigure 7-3.TTV Die
Page 59: Thermal Solutions7.5 Thermal Design
Page 63 and 64: Thermal SolutionsIncreased IMON acc
Page 65 and 66: Thermal SolutionsFigure 7-9.UP ATCA
Page 67 and 68: Quality and Reliability Requirement
Page 69 and 70: Quality and Reliability Requirement
Page 71 and 72: Component SuppliersTable A-2.LGA136
Page 73 and 74: Mechanical DrawingsFigure B-1. Boar
Page 75 and 76: Mechanical DrawingsFigure B-3. Boar
Page 77 and 78: Mechanical DrawingsFigure B-5. 1U R
Page 79 and 80: Mechanical DrawingsFigure B-7. 1U R
Page 81 and 82: Mechanical DrawingsFigure B-9. Heat
Page 83 and 84: Mechanical DrawingsFigure B-11. Hea
Page 85 and 86: Mechanical DrawingsFigure B-13. ATC
Page 87 and 88: Mechanical DrawingsFigure B-15. ATC
Page 89 and 90: Socket Mechanical DrawingsCSocket M
Page 91 and 92: Socket Mechanical DrawingsFigure C-
Page 93: Socket Mechanical DrawingsFigure C-
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