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LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications5.5 Electrical RequirementsLGA1366 socket electrical requirements are measured from the socket-seating plane ofthe processor to the component side of the socket PCB to which it is attached. Allspecifications are maximum values (unless otherwise stated) for a single socketcontact, but includes effects of adjacent contacts where indicated.Table 5-4.Electrical Requirements for LGA1366 SocketParameter Value CommentMated loop inductance, loop
LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications5.6 Environmental RequirementsDesign, including materials, shall be consistent with the manufacture of units that meetthe following environmental reference points.The reliability targets in this section are based on the expected field use environmentfor these products. The test sequence for new sockets will be developed using theknowledge-based reliability evaluation methodology, which is acceleration factordependent. A simplified process flow of this methodology can be seen in Figure 5-2.Figure 5-2.Flow Chart of Knowledge-Based Reliability Evaluation MethodologyEstablish themarket/expected useenvironment for thetechnologyDevelop Speculativestress conditions based onhistorical data, contentexperts, and literaturesearchFreeze stressingrequirements and performadditional data turnsPerform stressing tovalidate acceleratedstressing assumptions anddetermine accelerationfactorsA detailed description of this methodology is at:ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.§<strong>Intel</strong> ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 35
Page 1 and 2: Intel ® Xeon ® ProcessorC5500/C35
Page 3 and 4: Contents1 Introduction.............
Page 6 and 7: C-1 Socket Mechanical Drawing - (Sh
Page 9 and 10: Introduction1.1 Reference Documents
Page 11 and 12: Package Mechanical Specifications2
Page 13 and 14: Package Mechanical SpecificationsFi
Page 15 and 16: Package Mechanical Specifications2.
Page 19 and 20: LGA1366 SocketFigure 3-2.LGA1366 So
Page 21 and 22: LGA1366 Socket3.2 Attachment to Mot
Page 23 and 24: LGA1366 Socket3.4 Package Installat
Page 25 and 26: LGA1366 Socket.Figure 3-7.LGA1366 N
Page 27 and 28: Independent Loading Mechanism (ILM)
Page 29 and 30: Independent Loading Mechanism (ILM)
Page 31 and 32: LGA1366 Socket and ILM Electrical,
Page 33: LGA1366 Socket and ILM Electrical,
Page 37 and 38: Thermal SpecificationsThe Intel ®
Page 39 and 40: Thermal SpecificationsFigure 6-2.In
Page 41 and 42: Thermal SpecificationsTable 6-6.Int
Page 43 and 44: Thermal SpecificationsTable 6-9.Int
Page 45 and 46: Thermal SpecificationsTable 6-12.In
Page 47 and 48: Thermal Specifications6.1.2 Thermal
Page 49 and 50: Thermal Specifications6.2.2.1 Frequ
Page 51 and 52: Thermal SpecificationsPROCHOT# can
Page 53 and 54: Thermal Specifications6.3.2 PECI Sp
Page 55 and 56: Thermal SolutionsFor a 1U reference
Page 57 and 58: Thermal SolutionsFigure 7-3.TTV Die
Page 59 and 60: Thermal Solutions7.5 Thermal Design
Page 61 and 62: Thermal Solutions7.5.3 Power Therma
Page 63 and 64: Thermal SolutionsIncreased IMON acc
Page 65 and 66: Thermal SolutionsFigure 7-9.UP ATCA
Page 67 and 68: Quality and Reliability Requirement
Page 69 and 70: Quality and Reliability Requirement
Page 71 and 72: Component SuppliersTable A-2.LGA136
Page 73 and 74: Mechanical DrawingsFigure B-1. Boar
Page 75 and 76: Mechanical DrawingsFigure B-3. Boar
Page 77 and 78: Mechanical DrawingsFigure B-5. 1U R
Page 79 and 80: Mechanical DrawingsFigure B-7. 1U R
Page 81 and 82: Mechanical DrawingsFigure B-9. Heat
Page 83 and 84: Mechanical DrawingsFigure B-11. Hea
Page 85 and 86:
Mechanical DrawingsFigure B-13. ATC
Page 87 and 88:
Mechanical DrawingsFigure B-15. ATC
Page 89 and 90:
Socket Mechanical DrawingsCSocket M
Page 91 and 92:
Socket Mechanical DrawingsFigure C-
Page 93:
Socket Mechanical DrawingsFigure C-
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