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Thermal SpecificationsFigure 6-7.Intel ® Xeon ® Processor LC3518 Thermal ProfileThermal ProfileTcase [C]1009080706050Short-term Thermal Profile may only be used forshort term excursions to higher ambienttemperatures, not to exceed 360 hours per yearShort-Term Thermal ProfileTc = 1.50 * P + 60Nominal Thermal ProfileTc = 1.50 * P + 45400 5 10 15 20Power [W]23Notes:1. Intel ® Xeon ® processor LC3518 Thermal Profile is representative of a volumetrically constrained platform.See Table 6-14 for discrete points that constitute the thermal profile.2. Implementation of Intel ® Xeon ® processor LC3518 nominal and short-term thermal profiles should resultin virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet this ThermalProfile will result in increased probability of TCC activation and may incur measurable performance loss.3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do notrequire NEBS Level 3 compliance.4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operatingtemperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instancesper year, as compliant with NEBS Level 3. Operation at the Short-Term Thermal Profile for durationsexceeding 360 hours per year violate the processor thermal specifications and may result in permanentdamage to the processor.Table 6-14.Intel ® Xeon ® Processor LC3518 Thermal ProfilePower (W)Nominal T CASE_MAX (°C)Short-term T CASE_MAX(°C)0 45.0 60.05 52.5 67.510 60.0 75.015 67.5 82.520 75.0 90.023 79.5 94.5Intel ® Xeon ® Processor C5500/C3500 Series and LGA1366 SocketAugust 2010Thermal/Mechanical Design GuideOrder Number: 323107-002US 46