Q150T S/E/ES Sample Preparation System Instruction Manual
Q150T S/E/ES Sample Preparation System Instruction Manual
Q150T S/E/ES Sample Preparation System Instruction Manual
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Name Default<br />
Value<br />
Evaporation<br />
Current (A)<br />
Evaporation time<br />
(Minutes)<br />
Max Evaporation<br />
Voltage(V)<br />
<strong>Q150T</strong> <strong>Sample</strong> <strong>Preparation</strong> <strong>System</strong><br />
Table 26 Aperture Cleaning profile parameters<br />
Minimum<br />
Value<br />
Maximum<br />
Value<br />
Comment<br />
0 0 50** Current applied to evaporation<br />
source during the evaporation.<br />
**If Max Evaporation Voltage<br />
parameter set below 2V the<br />
maximum value will increase to<br />
100A.<br />
1 0.1 4 Duration of evaporation pulse.<br />
20 1 20 Set the maximum voltage that<br />
can be driven on to the source.<br />
Tooling Factor 5 0.1 10 Tooling factor for this process<br />
Pump hold No No Yes If Yes, <strong>Q150T</strong> pumps down to<br />
outgas-ready state and waits for<br />
user input.<br />
Note: If hold time (set in<br />
<strong>System</strong> | Vacuum | Pump hold<br />
time – see page 41) is<br />
exceeded, <strong>Q150T</strong> vents<br />
chamber.<br />
Flush chamber No No Yes Set to Yes to flush chamber<br />
with nitrogen before pumping<br />
down.<br />
Name Default<br />
Value<br />
Shut down<br />
Vacuum (mBar)<br />
Table 27 Vacuum shutdown properties<br />
Minimum<br />
Value<br />
9.2 <strong>System</strong> Overrideable Parameters<br />
Maximum<br />
Value<br />
Comment<br />
1 1x10-2 1x10+2 Set the Vacuum that the system<br />
will pump down to.<br />
Note the final vacuum may be<br />
different.<br />
If you have Admin group privileges, you can override some of the parameters normally<br />
determined by the selected profile.<br />
Table 28 <strong>System</strong> override properties<br />
Name Overridden <strong>System</strong> property Description<br />
Gas bleed time <strong>System</strong>>Generic Sputter> Gas bleed<br />
time<br />
Bleed Vacuum <strong>System</strong>>Generic Sputter> Bleed<br />
Vacuum<br />
Clean current <strong>System</strong>>Generic Sputter> Clean<br />
current<br />
Time Ar allowed to flow into<br />
chamber before plasma started<br />
Pressure at which the chamber<br />
is maintained at while the<br />
plasma is present<br />
Current at which the target is<br />
cleaned at.<br />
Clean time <strong>System</strong>>Generic Sputter> Clean time Time for which the target is<br />
cleaned for<br />
Stage rotate <strong>System</strong>>Hardware>Stage Rotate Allow the stage to be turned off<br />
for just this cycle<br />
Stage Speed <strong>System</strong>>Hardware>Stage Speed Set the speed of the stage for<br />
this process<br />
10473 - Issue 3 76 <strong>Q150T</strong> - <strong>Instruction</strong> <strong>Manual</strong>