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Q150T S/E/ES Sample Preparation System Instruction Manual

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Name Default<br />

Value<br />

Evaporation<br />

Current (A)<br />

Evaporation time<br />

(Minutes)<br />

Max Evaporation<br />

Voltage(V)<br />

<strong>Q150T</strong> <strong>Sample</strong> <strong>Preparation</strong> <strong>System</strong><br />

Table 26 Aperture Cleaning profile parameters<br />

Minimum<br />

Value<br />

Maximum<br />

Value<br />

Comment<br />

0 0 50** Current applied to evaporation<br />

source during the evaporation.<br />

**If Max Evaporation Voltage<br />

parameter set below 2V the<br />

maximum value will increase to<br />

100A.<br />

1 0.1 4 Duration of evaporation pulse.<br />

20 1 20 Set the maximum voltage that<br />

can be driven on to the source.<br />

Tooling Factor 5 0.1 10 Tooling factor for this process<br />

Pump hold No No Yes If Yes, <strong>Q150T</strong> pumps down to<br />

outgas-ready state and waits for<br />

user input.<br />

Note: If hold time (set in<br />

<strong>System</strong> | Vacuum | Pump hold<br />

time – see page 41) is<br />

exceeded, <strong>Q150T</strong> vents<br />

chamber.<br />

Flush chamber No No Yes Set to Yes to flush chamber<br />

with nitrogen before pumping<br />

down.<br />

Name Default<br />

Value<br />

Shut down<br />

Vacuum (mBar)<br />

Table 27 Vacuum shutdown properties<br />

Minimum<br />

Value<br />

9.2 <strong>System</strong> Overrideable Parameters<br />

Maximum<br />

Value<br />

Comment<br />

1 1x10-2 1x10+2 Set the Vacuum that the system<br />

will pump down to.<br />

Note the final vacuum may be<br />

different.<br />

If you have Admin group privileges, you can override some of the parameters normally<br />

determined by the selected profile.<br />

Table 28 <strong>System</strong> override properties<br />

Name Overridden <strong>System</strong> property Description<br />

Gas bleed time <strong>System</strong>>Generic Sputter> Gas bleed<br />

time<br />

Bleed Vacuum <strong>System</strong>>Generic Sputter> Bleed<br />

Vacuum<br />

Clean current <strong>System</strong>>Generic Sputter> Clean<br />

current<br />

Time Ar allowed to flow into<br />

chamber before plasma started<br />

Pressure at which the chamber<br />

is maintained at while the<br />

plasma is present<br />

Current at which the target is<br />

cleaned at.<br />

Clean time <strong>System</strong>>Generic Sputter> Clean time Time for which the target is<br />

cleaned for<br />

Stage rotate <strong>System</strong>>Hardware>Stage Rotate Allow the stage to be turned off<br />

for just this cycle<br />

Stage Speed <strong>System</strong>>Hardware>Stage Speed Set the speed of the stage for<br />

this process<br />

10473 - Issue 3 76 <strong>Q150T</strong> - <strong>Instruction</strong> <strong>Manual</strong>

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