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Virtual Qualification of Electronic Hardware - NEPP - NASA

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Design Capture: Part Models<br />

Package<br />

Effective Material<br />

Attach Positions<br />

Interconnect<br />

Pad Size<br />

Lead Geometry<br />

Attach<br />

Joint Height<br />

Pad Size<br />

Operational<br />

Power dissipation<br />

CALCE <strong>Electronic</strong> Products and Systems Center University <strong>of</strong> Maryland<br />

c:\mydocuments\presentations\jpl010516.ppt

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