AT&S World

* The RIM and BlackBerry families of marks, images and symbols are
the exclusive properties and trademarks of Research In Motion, and are used with permission.
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Semi-flexible PCBs
Based on thin epoxy resin materials
for flex-to-install applications.
For one-time bending (radius 5 mm),
mainly in automotive and
industrial applications.
HDI microvias*
Laser-drilled circuit boards with up
to 5 microvia build-up layers per
printed circuit board side, or with
stacked microvias throughout, over
the whole thickness of the circuit
board.Main applications in handheld
devices and increasingly in
consumer electronics.
Flexible PCBs
For static and dynamic bend/twist
applications across the board
in all industry sectors including
space technology and sensors.
Embedded Components
Integration of passive and active
electronic components in the
printed circuit board, to make
even smaller applications practicable.
PCB thickness is in the same
range as standard circuit boards.
Rigid-flex PCBs
They combine the advantages of
rigid and flexible circuit
boards, replacing cables and
plug connections, thus increasing
the reliability of applications
and reducing the number
of processes in assembly.
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