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EXAMPLE 17: Full.Coupled Diffusion 312 SUPREM-IV.GS – 2D ...

EXAMPLE 17: Full.Coupled Diffusion 312 SUPREM-IV.GS – 2D ...

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<strong>EXAMPLE</strong> 11: GaAs Simulation <strong>–</strong> <strong>2D</strong><br />

<strong>EXAMPLE</strong> 11 GaAs Simulation <strong>–</strong> <strong>2D</strong><br />

This shows how one would do a <strong>2D</strong> GaAs simulation. A <strong>2D</strong> grid is set up,<br />

and silicon and beryllium are implanted in the source, drain and channel<br />

regions. Then the doping contours are plotted for the designated concen-<br />

tration levels in Figure 2. In this example, only one half of the structure is<br />

simulated, then mirrored before the result is plotted, in order to speed up<br />

simulation time. The input file for the simulation is in the “examples/<br />

exam11” directory, in the file example11.in.<br />

option quiet<br />

set echo<br />

line x loc = 0.0 tag=left spacing = 0.5<br />

line x loc = 0.50 spacing = 0.5<br />

line x loc = 4.00 spacing = 0.5<br />

line x loc = 4.10 spacing = 0.1<br />

line x loc = 4.20 spacing = 0.05<br />

line x loc = 4.50 spacing = 0.05<br />

line x loc = 5.00 tag=right spacing = 0.05<br />

line y loc=0.0 tag=top spacing=0.03<br />

line y loc=0.3 spacing=0.03<br />

line y loc=1.0 spacing=0.1<br />

line y loc=3.0 tag=bottom spacing=0.3<br />

region gaas xlo=left xhi=right ylo=top yhi=bottom<br />

boundary exposed xlo=left xhi=right ylo=top yhi=top<br />

boundary backside xlo=left xhi=right ylo=bottom yhi=bottom<br />

init isilicon conc=3e15<br />

deposit nitride thick=1.0<br />

etch nitride start x=5 y=0.0<br />

etch continue x=5 y=-1.10<br />

etch continue x=4.5 y=-1.10<br />

etch done x=4.5 y=0.0<br />

implant isilicon dose=1.75e12 energy=75 pearson<br />

<strong>SUPREM</strong>-<strong>IV</strong>.<strong>GS</strong> <strong>–</strong> <strong>2D</strong> Process Simulation for Si and GaAs 291

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