1 - Erich Schmid Institute

1
Summary
the corresponding bending moments, respectively, and the relaxed system, which curves
owing to the internal residual stresses. Then, the equations derived are used to calculate
the depth profile of residual stresses of a model system consisting of a thin film and a
thick substrate. Finally, the result is compared with Stoney’s equation .
In summary, the layer removal method presented allows the determination of residual
stress profiles in near-surface structures with a depth resolution on a nanoscale and a
lateral resolution in the micron range. It can be used to investigate depth- and spatial
stress distributions in crystalline as well as amorphous materials. The cantilever bending
technique developed allows the determination of strength and fracture toughness of thin
films. Owing to the simple specimen and loading geometry, this method provides a very
precise and reliable way for the investigation of such fracture properties.
Nix WD. Metall Trans A 1989;20A:2217.
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