Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec
Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec
Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec
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Summary<br />
• Using NDE <strong>for</strong> <strong>Circuit</strong> <strong>Edit</strong> of devices with<br />
Tungsten metallization provides reliable and<br />
safe method to expose Tungsten lines.<br />
• Compared to commonly used XeF2, NDA<br />
provides much higher selectivity <strong>for</strong> etching<br />
dielectric versus etching Tungsten . This<br />
reduces risk of Tungsten lines damage and<br />
disintegration
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