Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec

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Exposure of Tungsten lines from under uneven

dielectric after Copper removal

XeF2

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Application of NDE for Circuit Edit on devices with Tungsten interconnects • Recently, new results arrived, regarding advantages of the NDE over XeF2 in CE on devices with Tungsten metallization This presentation shows these results.

Exposure of Tungsten lines from under uneven dielectric after Copper removal XeF2

Page 1 and 2: Novel Dielectric Etch Solution for
Page 3 and 4: What Novel Dielectric Etch (NDE) is
Page 5: What NDE is good for • Allows to
Page 9 and 10: When XeF 2 is in use, Tungsten line
Page 11 and 12: Testing Selectivity of Etching Diel

Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec

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