Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec

26.01.2014 • Views

Share Embed Flag

Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec

Novel Dielectric Etch Solution for FIB Circuit Edit: Application ... - Imec

DOWNLOAD ePAPER

imec.be

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

START NOW

Exposure of Tungsten lines from under uneven<br />

dielectric after Copper removal<br />

NDE<br />

XeF2

1
2
3
4
5
6
7
8
9
10
11
12

A High-Stability, Ultra-Low-Power Differential Oscillator ... - Imec

A Slew Rate Controlled Output Driver Using PLL as ... - Imec

Influence of Excitonic Scattering on Charge Carrier Ambipolar ... - Imec

Backside Circuit Edit on Device Level - New Methodologies - Imec

A Direct Conversion IC for Digital Satellite TV - Imec

Modelling and Simulating the Selective Epitaxial Growth of ... - Imec

CMOS Production Compatible SiGe Heteroepitaxy for High ... - Imec

ASPIRE INVENT ACHIEVE - Imec

Annual report 2009 - Imec

Exposure of Tungsten lines from under uneven dielectric after Copper removal NDE XeF2

When XeF 2 is in use, Tungsten lines are etched faster than dielectric! XeF2

Page 1 and 2: Novel Dielectric Etch Solution for
Page 3 and 4: What Novel Dielectric Etch (NDE) is
Page 5 and 6: What NDE is good for • Allows to
Page 7: Exposure of Tungsten lines from und
Page 11 and 12: Testing Selectivity of Etching Diel