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PISCES-2ET and Its Application Subsystems - Stanford Technology ...

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Physical Models<br />

There are now problems remain unspecified in the above Intel’s <strong>and</strong> Lombardi models. That<br />

is the evaluation of the transverse field <strong>and</strong> the reduction due to the longitudinal field. We discuss these<br />

issues in the following subsections.<br />

3.1.2.3 Evaluation of Transverse Electric Field<br />

The transverse field is defined as the field component the direction of which is perpendicular to the<br />

current flow, so, mathematically<br />

E × j<br />

E ⊥ = ---------------<br />

(3.20)<br />

j<br />

<strong>PISCES</strong>-<strong>2ET</strong> uses this formula to evaluate E ⊥ in the above three mobility models if the parameter<br />

strfld is not specified in model card. Such evaluation is computationally costly <strong>and</strong> might also<br />

cause numerically instability. Another alternative <strong>and</strong> simplification is to evaluate the normal field<br />

component based on the geometric proximity to the Si/SiO 2 interface. Thus when strfld is<br />

specified, the following formula is used:<br />

E ⊥ E y e y y int<br />

=<br />

(3.21)<br />

where y is the coordinate in the axis perpendicular to the interface, E y is the transverse field at the<br />

interface (y int<br />

), <strong>and</strong> L is the characteristic length which has a value of 0.5µ.<br />

3.1.2.4 Watt’s Surface Mobility Model<br />

–( – ) ⁄ L<br />

J. Watt of <strong>Stanford</strong> proposed a simple approach to modeling the surface mobility in the inversion layer<br />

in silicon near the Si-SiO 2 interface [9]. The inversion layer is assumed to be confined only in the first<br />

grid spacing in the silicon at the direction perpendicular to the interface. Thus the interface is at the top<br />

of the inversion layer whereas the first grid in the silicon lies at the bottom of the inversion layer. The<br />

requirement for the meshing when this model is to apply is that the top grid spacing should be<br />

reasonably large (a couple of hundred angstroms), quite contrary to the conventional thought that the<br />

meshing should be dense at the substrate surface. The carrier mobility in the inversion layer, µ 0,<br />

inv ,<br />

depends on the effective transverse field, E ⊥,<br />

eff , in the inversion layer. The model accuracy has been<br />

verified against the measurement <strong>and</strong> is in agreement with the universal mobility model requirement<br />

[10]. This model can be invoked by using parameter srfmob in the model card. The effective<br />

transverse field, , is defined <strong>and</strong> calculated as:<br />

E ⊥,<br />

eff<br />

<strong>PISCES</strong>-<strong>2ET</strong> – 2D Device Simulation for Si <strong>and</strong> Heterostructures 21

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