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PISCES-2ET and Its Application Subsystems - Stanford Technology ...

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Physical Models<br />

Table 3.11<br />

Parameter Si GaAs/Al x Ga 1-x As Ga x In 1-x As y P 1-y Al x In 1-x As<br />

6<br />

6<br />

b p (V/cm) 3.26×10 [18] 2.03×10 [18] 6.4×10 4.5×10<br />

[21]<br />

E eff E ||<br />

m n 1 [18] 1 [19] 1 [20] 1 [21]<br />

m p 1 [18] 1 a 1 1 [21]<br />

a. 2 in [18] but by comparison to the experimental data 1 is more proper.<br />

3.3.1.2 Carrier Temperature Dependent II Models<br />

There are several ways to model the carrier temperature dependent impact ionization. One way is to<br />

map the carrier temperature to an effective electric field, , in replacing in Eq. (3.38) <strong>and</strong> all the<br />

material parameters in the expression are kept unchanged. The mapping between T c<br />

<strong>and</strong> E eff is done<br />

through the following formulation (refer to [22]):<br />

E eff =<br />

5<br />

-- k B<br />

---- T c – T<br />

----------------- L<br />

2 q γ L w<br />

(3.39)<br />

where L w = τ w v sat is called the energy relaxation length <strong>and</strong> γ is an adjustable parameter (for fitting<br />

the experimental data) which can be accessed by the user using impjt.ratio in the model card<br />

(default: 1.0). The second way is to approximate the actual carrier (drift) velocity with their saturation<br />

velocity <strong>and</strong> to use carrier-temperature dependent ionization rate as follows:<br />

5<br />

6<br />

G<br />

=<br />

α( T n )nv sat, n + α( T p )pv sat,<br />

p<br />

(3.40)<br />

– ⁄ B c<br />

α( T c ) A c e T c<br />

=<br />

(3.41)<br />

where c st<strong>and</strong>s for either n or p. The values of A <strong>and</strong> B are listed inTable 3.12. This model can be<br />

Table 3.12<br />

electrons<br />

holes<br />

A (cm -1 ) B (K)<br />

6<br />

3.8×10 1.75×10<br />

7<br />

2.25×10 3.26×10<br />

6<br />

6<br />

invoked through parameter imp.nvt in the model card.<br />

<strong>PISCES</strong>-<strong>2ET</strong> – 2D Device Simulation for Si <strong>and</strong> Heterostructures 29

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