SMT/THR PCB-COMPONENTS

EDITORIAL
EDITORIAL
In the past years, the process of printed circuit board assembly has undergone a
fundamental transformation. Conventional Through-Hole-Technology (THT) has been
increasingly replaced by Surface-Mount-Technology (SMT). The reasons for this
were both constantly changing requirements such as miniaturisation of components,
increased density of functions and lower production costs as well as the great
advances achieved in the development of Surface-Mount-Devices (SMD), which only
made use of the SMT production process possible at all. Today, SMT has established
itself as the standard in printed circuit board (PCB) assembly.
But there are still a few components (mainly electromechanical components such as
connectors or relays) which are not available as SMD versions and which, up to now,
still had to be placed on the PCB after the actual SMT process and in accordance with
the classical THT production method. This is why Weidmüller has developed a product
range for the so-called Through-Hole-Reflow (THR) process which makes it possible to
use leaded components in the SMT process as well, thus ensuring one hundred percent
consistency in SMT production.
With this brochure, we would like to provide you with a practical guide on the basis
of which you can choose the notes on pcb assembly that conform best to your
requirements. The brochure's design does justice to this. If you wish to find out briefly
and concisely what solution or product Weidmüller recommends within the scope of the
technology, then simply read the text in the separate boxes.
2 APPLICATION INFORMATION