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4. (Thermal) Oxidation

4. (Thermal) Oxidation

4. (Thermal) Oxidation

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<strong>Oxidation</strong> Rate: Crystal Orientation<br />

(111)<br />

(011)<br />

(100)<br />

• The parabolic rate depends on the D of oxidants through SiO 2 .<br />

• On the other hand, the linear rate constant B/A depending on the reaction k S<br />

at SiO 2 /Si interface is strongly related to the crystallographic orientation of Si.<br />

• The growth rate ratio (v 111 /v 100 ) decreases at high temperatures and at long time<br />

since the parabolic rate constant is predominant. (diffusion-limited)<br />

Ø CO changes the # of Si bonds available at the surface<br />

(100) silicon: the smallest number of unsatisfied Si bonds at the Si-SiO2<br />

interface, and the choice of the (100) orientation yields the lowest number of<br />

interface traps, leading to lowest oxidation rate.

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