Towards 2020 – Photonics driving economic growth in Europe

2. Photonics Research and Innovation Challenges
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ETSI) in defining such multi-source agreements outside
the EU, and, in addition to the specifications,
would also be responsible for the implementation
with European partners. A successful example of
such an implementation is the 100G consortium
in Japan, where, under leadership of NTT, all major
system and component vendors have jointly developed
the necessary components (based on the
OIF specification) required for the realisation of
100G coherent interfaces, with substantial funding
from the Japanese government. Continuing these
collaborative activities, the same consortium is now
already working on solutions for 400G. Based on
Europe’s strength in the design & manufacturing
of photonics and electronics, it is desirable to also
adopt a similar approach in Europe, for example in
the following breakthrough technologies:
n Access: Low-cost tunable SFP+ DWDM transceivers
for TWDM-PON and P2P applications
n Access: Ultra-compact N×10G DWDM Tx / Rx
arrays for TWDM-PON and P2P applications
n Backbone: Ultra-compact Tx/Rx components
for 2nd generation 100G coherent transceivers
(based on Silicon or InP, integrated RF electronics,
common form factor)
n Backbone: 1-Tbps software-defined transceivers
(array transmitters and receivers with integrated
RF electronics at 2–3 times today’s baud
rate, Tbps DSP, Tbps OTN framer)
n Interconnects: Tbps active optical cable
The developments will be carried out by value chain
partners within the consortium, and will make
use of EuroFab facilities where indicated. System
vendors will then leverage these developments to
build system and network solutions, and then test
them with carrier partners.
EuroFab – European Photonics Fabrication: This
activity deals with photonics fabrication in Europe,
and aims at leveraging and extending activities
already started in projects such as EuroPIC (covered
by Work Group 6 Optical Components and
Systems). European research on photonic chips has
resulted in many innovative ideas. However, the
connection between the chip itself and a component
or subsystem that can be used in an optical
communication system, often needs strengthening.
The packaging of the components, the integration
with the necessary RF and control electronics, and
the overall integration into a module and subsystem
are all critical points for successfully turning a
photonic chip design into a commercial product.
Specifically for new components, custom drivers
and/or control electronics are often not available
and may need to be designed, manufactured, and
integrated. Assembly technology, and electrical,
mechanical and thermal management are critical
components that need to be considered in the
design flow, and for defining tooling support and
partner set. EuroFab will be a network of partners
that develops and follows a common design
flow, and which can be used for developing large
volume, standard products, as well as application
specific solutions. Given the fact that some of the
disciplines here require very specific knowledge,
there is a large opportunity in this area for SMEs,
who could offer their services in addressing one
or several steps throughout the entire process.
Based on the current European fab capabilities,
components and subsystems based on silicon, InP
and polymer photonics will be the likely focus of
this activity.
Optical fibre communication
enhances the knowledge society.
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