TheTTL - Al Kossow's Bitsavers

MECHANICAL DATA
FN plastic chip carrier package
Each of these chip carrier packages consists of a circuit mounted on a lead frame and encapsulated within
an electrically non conductive plastic compound. the compound withstands soldering temperatures with
no deformation, and circuit performance characteristics remain stable when the devices are operated in
high-humidity conditions. The packages are intended for surface mounting on solder lands on 1,27-mm
(O.050-inch) centers. Leads require no additional cleaning or processing when used in soldered assembly.
FN PLASTIC CHIP CARRIER
(2a-terminal package used for illustration)
1.22 (0.048) X450
1.07 (0.042)
I
SEATING PLANE
(See Note C)
JEDEC
OUTLINE
NO. OF
TERMINALS
MO·047AA 20
MO·047A8 28
MO·047AC 44
MO·047AE 68
MIN
A
MAX
9.78 10.03
(0.3851 (0.3951
12.32 12.57
10.4851 10.4951
17.40 17.65
10.6851 (0.6951
25.02 25.27
10.9851 (0.9951
MIN MAX MIN
8.89 9.04 7.87
(0.3501 (0.3561 (0.3101
11.43 11.58 10.41
10.4501 10.4561 10.4101
16.51 16.66 15.49
10.6501 (06561 10.6101
24.13 24.33 23.11
(0.9501 (0.9561 10.9101
All dimensions and notes for the specified JEDEC outline apply.
MAX
8.38
10.3301
10.92
10.4301
16.00
10.6301
23.62
(0.9301
0.81 (0.032)-t-+I
0,66 (0.026) ~T
I ~ (0.060) MIN
I ~ (0.025) MIN
1-1.
~:~! :~:~~~: ~ I ~
LEAD DETAIL
NOTES: A. Centerline of center pin each side is within 0,10 (0.004) of package centerline as determined by dimension B.
B. Location of each pin is within 0,127 (0.005) of true position with respect to center pin on each side.
C. The lead contact points are planar within 0,10 (0.004).
,ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
7-6
TEXAS ..
INSTRUMENTS
POST OFFICE BOX 225012 • DALLAS. TEXAS 75265