Master of Engineering Balram Sahu - Embedded Sensing ...

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6.2. Scope for Future Work 426.2 Scope for Future WorkThis work is done in 0.13µm technology node. As per the earlier discussion, the secondordereffects becomes more prominent as the technology shrinks down. So it will beinteresting to see the results in lower technology nodes and can open more doors to thiswork.Our first assumption was that the critical path does not change with PVT variation.Which is a weak assumption and in further work we can find out the way to track thecritical path along with minimum energy point with scaling down the voltage.In this work we assumed that the leakage power is independent <strong>of</strong> input combinationsand, in the calculations, we took the average leakage power <strong>of</strong> all the input combinations.To get the exact leakage power we can track the activity in future.
Appendix APlace And Route using SoC EncounterSoC Encounter is a powerful place and route tool which has first encounter, Nano Route,Celtic and optimization tool as in built. It is widely used for RTL to GDSII flow andcan perform various functions as floor planning, feasibility analysis, placement, clock treesynthesis, power routing, SI (Signal integrity) aware routing and IR drop analysis [16, 13].SoC Encounter flow is shown in Figure A.1.Figure A.1: SoC Encounter Flow43
Page 1: "Minimum Energy Point Operation of
Page 4 and 5: CONTENTSiv4 Flip-Flop Characterizat
Page 6 and 7: LIST OF FIGURESvi5.3 Normalized Del
Page 8 and 9: viii
Page 12 and 13: 1.4. Thesis Organization 4harvestin
Page 14 and 15: 2.1. Modeling for Sub-threshold ope
Page 16 and 17: 2.2. Challenges in Sub-threshold op
Page 18 and 19: 2.2. Challenges in Sub-threshold op
Page 20 and 21: 3.2. Standard transmission gate CMO
Page 22 and 23: 3.3. Clocked Inverter CMOS Flip-flo
Page 24 and 25: 3.4. Modification in Standard Cell
Page 26 and 27: 4.1. Requirements on the library 18
Page 28 and 29: 4.3. Generation of LEF 20each metal
Page 30 and 31: 4.3. Generation of LEF 2221 PORTLAY
Page 32 and 33: 4.4. Behavioral Model 24127 RECT 3
Page 34 and 35: 4.4. Behavioral Model 26#Falling ed
Page 36 and 37: 4.4. Behavioral Model 28Figure 4.7:
Page 38 and 39: 4.4. Behavioral Model 30v a l u e s
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Page 42 and 43: 5.2. Process Flow 34changes and thu
Page 44 and 45: 5.3. Results 365.3 ResultsCORDIC al
Page 46 and 47: 5.4. Comparison of results with Nor
Page 48 and 49: 5.5. The openMSP430 Micro-controlle
Page 52 and 53: A.1. Input Requirements of SoC Enco
Page 54 and 55: A.2. SoC Encounter Flow 46design hi
Page 56 and 57: A.2. SoC Encounter Flow 48Do the se
Page 58 and 59: A.2. SoC Encounter Flow 50Figure A.
Page 60 and 61: A.2. SoC Encounter Flow 52
Page 62 and 63: 54The first part can be generated b
Page 64 and 65: 563. Press RUN button and wait unti
Page 66: BIBLIOGRAPHY 58[11] FARADAY cell li

Master of Engineering Balram Sahu - Embedded Sensing ...

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