1. Basic Concepts in Reliability Design - nl3prc

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[2] Designing for ReliabilityTable 2.3 Operating environment factors affecting reliabilityStress Factor Where and When It Can Occur Failure ModeHigh temperatureTemperatureLow temperatureTropics, deserts, space, cars, other specialenvironmentsCold zone, high altitude, space, aircraft, otherspecial environmentsCharacteristic fault, unstable operationCharacteristic fault, unstable operationTemperature changeWhen operated intermittentlyDie crack, degraded die bonding,characteristic fault, unstable operationRusting, improper contact, corrosion,High humidity Tropics, tunnels, cars, other special environmentsHumiditycharacteristic faultLow humidity Deserts, in low-humidity weather Electrostatic damageLow atmosphericCorona discharge, low heat dissipation,High altitude, mountainous areas, aircraftAtmospheric pressurecharacteristic faultpressureCorona discharge, low heat dissipation,Vacuum pressure Spacecharacteristic faultSalinity Coastal areas, on the sea, ships, marine facilities Rusting, improper contact, damaged leadVibrationDuring product transportation, vehicle-mounted Bonding wire open (hermetic seal), damagedequipment, machine tools, aircraft equipment lead (board mounted), package crackImpact, droppingDuring product transportation, vehicle-mountedequipment, machine tools, aircraft equipmentPackage crack, deformed leadAccelerationAircraft equipment, rockets, other specialpurposeequipmentpackageBonding wire open (hermetic seal), damagedHeating During assembly process (e.g. soldering) Characteristic fault, deformed package shapeElectrical overstress, surgeDuring On/Off operation of switches and relays,capacitive loads, motorsCharacteristic fault, shortNoise Motors, when used with improper contacts Characteristic fault, shortElectrostatic dischargeWhen handling in low humidity, near strong fieldgenerating equipment, during transportationCharacteristic fault, shortStrong electromagnetic field Near a transmitter or signal generator Characteristic faultUltrasonic waveWhen cleaning circuit boards after solderingOpen bonding wire (hermetic seal), erasedmarkingRadiation Nuclear power-related facilities, space (satellite) Characteristic fault, destruction, soft errorErroneousoperationOvervoltage When used with invalid operating supply voltageDestruction, degraded breakdown voltage,shortOverload When used with invalid drive capacity Destruction, shortOthers When used at invalid operating timings etc. Characteristic fault, latch-upTable 2.4 Environments with excessive vibrationEnvironmentShockLand TransportationRoad 1 Hz∼3 Hz at up to 29.4 m/s 2 15 Hz∼40 Hz at 9.81 m/s 2Rail 14.7 m/s 2 2 Hz∼100 Hz with amplitude ± 0.05 mmSea Frequency 1 Hz∼50 Hz Amplitude 2.5 mm∼0.075 mmAir Frequency 3 Hz∼500 Hz Amplitude 3 mm∼0.025 mmTable 2.5 Environments with excessive shockEnvironmentShockLand TransportationRoad 58.9 m/s 2 peak Shock width 5 mm/s∼40 mm/sRail When coupling and decoupling rolling stock 196 m/s 2 Speed change: 5.4 m/sSea⎯⎯Air Shock on arrival and departure of up to 36 m/s 22-12
[2] Designing for ReliabilityTable 2.6 Manufacturing process FMEA example (resin molding)Process Stage Failure Mode Effect of Failure Cause of Failure(1-10)Al metallization(1-11)Passivation(1-12)Visualinspection2 Assemblyprocess(2-1)Improper thickness, voidsin metal, metal openLack of passivation film,non-uniform film,thicknessScratch, die crack,contamination, residualphotoresistDie crackDie preparation(2-2)Die crack, die floatingDie bonding(2-3)Wire bonding(2-4)Resin molding(2-5)Lead finish(plating)(2-6)Lead forming(2-7)MarkingBonding open, improperbonding position, shortedbonding wireBonding wire open,shorted bonding wire,package crack, corrosionInsufficient thickness ofmetal plating, dirtAbnormal shape, brokenleadMarking error, illegiblemarkingElectromigration,open circuitIncreased leakagecurrent,characteristic faultOpen circuit,increased junctionleakage currentIncreased junctionleakage current,characteristic faultOperator mishandling,foreign particles, pooradjustment of equipmentForeign particles,operator mishandlingMishandling of wafer,erroneous wafer cleaningPoor adjustment ofequipment, operatormishandlingOpen circuit, Operator mishandling,increased junction temperature decreaseleakage current,characteristic faultOpen, shortOpen, short,defectiveappearancePoor soldering,improper contactSoldering fault,characteristic faultBreakagePoor bonding strength,operator mishandling,poor adjustment ofequipment, abnormalloop shapePoor adjustment ofequipment, insufficientcuringOperator mishandling,poor adjustment ofequipment, insufficientcleaningOperator mishandling,poor adjustment ofequipmentOperator mishandling,insufficient curingFailureIndexFrequencyEffectDetectabilityIndexCountermeasures2 9 2 36 Improvement and adjustmentof work procedures, dustcontrol, in-process inspection(SEM)2 2 4 16 Dust control, improvementand adjustment of workprocedures2 2 2 8 Improvement and adjustmentof work procedures1 3 2 6 Operator training,improvement and adjustmentof work procedures1 9 2 18 Operator training,improvement and adjustmentof work procedures, visualinspection2 10 1 20 Operator training,improvement and adjustmentof work procedures, visualinspection2 10 2 40 Operator training,improvement and adjustmentof work procedures, visualinspection1 2 3 6 Improvement and adjustmentof work procedures, operatortraining1 2 1 2 Improvement and adjustmentof work procedures, operatortraining1 1 1 1 Improvement and adjustmentof work procedures2-13
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1. Basic Concepts in Reliability Design - nl3prc

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