IntelliSuite 8 - Europractice

Package and board level analysesIntelliSuite simplifies the packaging ofMEMS devices, reducing the cost of packagingdevelopment. The tools you needto perform die level and board levelpackaging analyses come standard withIntelliSuite.Packaging related stresses, CTE mismatches,shock effects, effects of packagingpressure on device damping, parasiticeffects and high frequency electromagneticeffects can all be modeled withease.IntelliSuite solves most complex packagingproblems involving linear and nonlinear,static, frequency, and dynamic behavior.Stress, strain and warpage calculations,thermal-electrical (joule heating),vibrational analysis including shock testing,damping analysis can all be performedwith easeThis allows you to perform JEDEC, MILSTD, or Belcore tests on packaged devicesbefore costly device fabrication.