IntelliSuite 8 - Europractice

IntelliSuite 8A living design environment

IntelliSuite, IntelliFAB, IntelliMask,MEMaterial, AnisE, RECIPE, SYNPLE,MEMS SoC, Total MEMS solutions,CAD for MEMS and Solutions for theMEMS professional are trademarks ofIntelliSense Software Corporation.Errors and Omissions Excepted. Thisdocument is subject to frequentchanges. IntelliSense Software doesnot accept liabilities due to errors oromissions in this document. © IntelliSenseSoftware, 2005

Break open new possibilities in MEMS

A living design environmentUsed by MEMS professionals worldwide for design, development and manufacturing of MEMS,IntelliSuite has firmly established itself as industry’s standard tool.! As such, IntelliSense providesMEMS companies and individual users with a complete living design environment tomanage their MEMS product through its life cycle.IntelliSuite is a tightly integrated design environment that will link your entire MEMS organization together.Built to scale from a point tool to an organization-wide tool, IntelliSuite unifies various engineeringand manufacturing tasks into a single living design environment.

System ArchitectDevice EngineerProgram ManagerProcess EngineerIntra Organizational ToolsManufacturing EngineerElectrical EngineerTest EngineerPackaging Engineer

What’s in it for me?

ProgramManagerSystem overview Metrics Yield prediction Cost modeling360° overviewAs an engineering manager, IntelliSense provides you all the tools you need to monitor everyaspect of the MEMS development. You can explore MEMS development at different granularity —from high-level cost estimates and yield projections to mid-level design analysis studies, low-levelprocess flow or metrology data. Intended for use company-wide, IntelliSuite supplies an effectivemechanism to consolidate your broad organizational MEMS knowledge in one repository.

SystemArchitectSystem Model ExtractionCreate accuratesystem modelsSYNPLEMulti-domain systemsimulation and synthesisMEMS-SoC Constructor KitVerilog-A MEMS LibrariesSystem design — made simpleIntelliSense enables electrical and system engineers to create and simulate complex MEMSmodels with exceptional ease. Thanks to SYNPLE, MEMS system design is as fundamental as draggingand dropping, and wiring the schematic. In addition, MEMS-SoC gives you Verilog-A MEMSmodels for use in a simulator of your choice. How’s that for simple system design?

Parametric Layout Virtual Prototyping Advanced meshingDeviceDesignerFEA/BEA analysis BioMEMS/RFMEMS tools System Model ExtractionBy designWith IntelliSuite, we furnish device designers like you with the comprehensive design explorationtools necessary to follow your unlimited creativity. That’s why IntelliSuite includes SYNPLE and afull suite of FEM/BEM analysis tools that will allow you to design such diverse MEMS as sensors andactuators, RF and optical MEMS, and micro-fluidic devices and biosystems.

Traveller 3D visualizationFoundry templatesSix SigmaYield predictionMaterial databasesProcess optimizationProcessEngineerParmetric teststructuresWet Etch SimulationDry Etch (RIE/Bosch) SimulationYield a productive cropIf you’re a process/manufacturing engineer, our design for manufacturing (DFM) tools grant youthe capability to implement your first-time right designs. The across-the-board selection of IntelliSenseprocess tools include virtual prototyping and 3D traveler visualization, thin film materialcharacterization and optimization tools and databases, wet and dry-etch simulators, and MonteCarlo tools for yield predication. So, whatever your process engineering goals, our process-specifictools will help you achieve them.

Package creation toolsScripting toolsPackage analysis toolsPackageEngineerPackage modeling High frequency modeling Board level modelingWrap it up!As a packaging engineer, IntelliSense affords you tools for thermal, mechanical and highfrequencymodeling of your devices. Parametric scripting capabilities allow you to effortlessly createa range of packages, such as SOICs, DIPs, QFPs etc. What’s more, wafer-level encapsulation andrelated stress analyses may be performed with ease. As a result, you can wrap projects up quicklyand efficiently!

TestEngineerParametric test structuresTest libraryJEDEC/Telcordia/MIL-STD 750/883Test standard supportRapid test simulationsSoftware validationAce the testWorking together, IntelliSuite and SYNPLE give test engineers a straightforward, multi-tool devicefor creating parametric test structures and design of experiments (DoE) during the layout process.What’s more, our analysis and system simulation tools allow you to perform a vast subset of MIL-STD (750/883), JEDEC (JESD22) and Telcordia (Belcore) tests in software before the actual fabrication.For success in your next test, turn to IntelliSuite!

Process modeling

MEMaterialThin film knowledge base and processoptimization toolMEMaterial is the most comprehensivethin film database available today.Featuring over 70+ processes,MEMaterial links the material propertiesof thin films to the machine parameters.Use MEMaterial to• Obtain accurate material properties• Optimize your processes• Perform NxN dimensional multivariateanalyses• Create an organization wide processknowledge repository• Datamining of process data into information

32411. Capture. Create proprietarydatabases of material information(or use material informationfrom 70+ thin filmprocesses).2. Analyze. MEMaterial automaticallycreates informationfrom data using NxN dimensionmulti-variate estimationroutines.3. Explore. MEMaterial letsyou explore material propertiesas a function of machinesettings.Thin film properties of Si3N4 (PECVD, using Argon as a carriergas). The material properties (Stress, Density, CTE, Youngs modulus,Poisson’s ratio and Refractive Index) are shown as a functionof machine parameter (Temparature, pressure, total flow rate, RFpower, partial pressure of gases).4. Visualize. Advanced visualizationroutines allow you toquickly visualize any materialproperty as a function of machinesettings.

IntelliFABProcess traveller based virtual prototypingIntelliFAB allows you to create and debugyour process flow and your maskset before you enter the clean room. Itallows you to make virtual prototypesto save costly fabrication mistakes.Use IntelliFAB to• Debug your process traveller• Visualize your process flow• Create accurate device models• Automatically mesh your devices• Share process flows across the organization• Capture process knowledge• Create devices based on foundry templates

Process traveller in IntelliFABis linked to actual machinesettings (above). IntelliFABautomatically generates 3Dviews of the device at anyprocess step allowing you todebug your mask and processdesign.

AnisEAnisE is the industry standard for simulatingwet anisotropic silicon etching.AnisE makes it extremely easy to accuratelysimulate etch behavior. Importyour etch and doping masks, chooseyour wafer orientation and your processparameters, et voila, watch the etch progresson your screen.Use AnisE to• Simulate KOH/TMAH/Dry etching of and wafers• Perform corner compensation and processdeviation studies• Simulate multi-dope, multi-etch processes• Test your designs before entering the fab

Above: Corner compensation study. Evolution ofthree different corner compensation shapes in100 SiliconBelow: Bulk micromachined accelerometer. Doublesided etching of silicon with multiple dopingsteps.

RECIPERECIPE is industry’s first tool for RIE/ICP and Bosch process simulationWith RECIPE you can layout your microstructureand automatically simulateisotropic, RIE, ICP (Bosch process)etching or any combination of thethree processes.Use RECIPE to• Predict sidewall scalloping, roughness,periodicity and sidewall angle• Predict final dimensions and shape• Predict DRIE artifacts such as etchlag, etch termination (pinch-off)• Predict plate release• Custom tailor etch features such asbowl and stem etches to improvesidewall coverage• Perform multi-etch simulation suchas an isotropic etch followed by DRIEfollowed by RIE.

Progression of an etch featuring three processes: 1. Isotropic RIE to createa wine bowl 2. Bosch etch (DRIE) to create the wine stem and 3 IsotropicRIE to smooth the scalloping and improve sidewall coverage. Inset showsthe detail of the sidewall scalloping.Experimental verification. ARECIPE etch profile (right) iscompared with an SEM. A5µm trench was sequentiallyetched using a etch/polymerization configurationof 7s/7s, 9s/7s and 5s/7s,each for 5 minutes

MEMS Cost ModelThe MEMS Cost Model enables you tounderstand the impact of process andfoundry choices on the final cost ofyour product.The MEMS Cost Model is designed toserve the needs of anyone interestedin understanding the manufacturingcosts of MEMS devices.Do you• Develop MEMS devices and want toknow what it will cost to make the device?• Buy MEMS devices and want to understandthe manufacturing costs• Invest in MEMS and want to understandstart-up and production costs?• Work at a MEMS fabrication facilityand want to benchmark what you aredoing?If you have answered yes to any of thequestions above, then this product isfor you.

Physical modeling

IntelliMaskIntelliMask is a powerful, yet easy touse mask editor developed specificallyfor the MEMS community.IntelliMask offers MEMS specific featuresnot found in standard electronicsor mechanical layout tools. Take designsfrom process definition throughmask layout to device and systemanalysis within a single unified designenvironment.Use IntelliSuite to• Create complex MEMS curvilinear andnon-Manhattan masks with ease• Geometric boolean operations• Create masks with cell based hierarchy• Import/Export GDS/DXF files• Automate mask creation throughscripting or use the parametric elementlibrary to quickly create typicalstructures• Direct link to process modeling

Built in scripting support allows youto automate the creation of complexgeometries without breaking a sweat.Built in support for arcs, ellipses, donutsand freeform splines makes iteasy to create curvilinear structurescommon in MEMS.

IntelliMask ProIntelliMask Pro is a production readymask making environment.IntelliMask Pro is available as a paidupgrade to existing IntelliMask/IntelliSuite users. IntelliMask pro givesyou additional production ready capabilitiessuch asPRO• Import and export of additional formats(CIF, Gerber, RS 274, Electromask,PostScript)• Ability to perform complex Booleanoperations between entire layers orcells• Expanded text support, use anyTrueType font in your masks. Expandedlanguage support, insert Chinese,Japanese, Greek or Indic charactersinto your masks• Full layer transparency support• Workgroup features such as hierarchicalshared libraries

Combined IC and MEMS layout inone package. Support for layertransparency so that you can seethrough layers.Fast hierarchical support for deeplynested cells. Handle large maskswithout any performance penalties!

3D Builder3D Builder is a powerful tool to createand refine structured or unstructuredgrids.IntelliSuite gives you as much controlover the device meshing process asyou need. On one hand, automaticmeshing tools can generate nearoptimalmeshes while, on the other,interactive tools allow you to furtherrefine the meshes to your hearts' content.Think of it as the Tiptronic ofmeshing tools — enabling you toswitch from automatic to manualgears.With 3D Builder you can:• Import/Export grids in a variety offormats (ABAQUS, ANSYS, PATRAN etc)• Work with Polar or rectilinear grids• Use popular refinement techniquessuch as spider webs, corner framemeshes or zippered meshes• Use GDS/DXF mask layouts as meshcues.

3D Builder allows you toimport solid models or workfrom GDS/DXF data to create3D structured grids foranalysis.3D Builder allows you to work in polaror rectilinear co-ordinates to helpyou quickly generate 3d meshes.Show here is a corrugated disk.

Scripting and parametric elementlibraryIntelliSuite 8 introduces a powerfulscripting based technology to automatelayout and to quickly createparametric device models.In addition, IntelliSuite 8 ships with awide range of parametric elementsranging from active elements (such aslinear and rotary comb drives, actuators),passive elements (shuttle masses,serpentines, crab leg springs etc), teststructures (electrical and mechanicaltests), stress test structures (bentbeams, vernier frames), and packagingelements (DIP, SOIC, SIP, QFP).

Analysis tools

Fully coupled ThermoElectroMechanicalanalysisThe Thermo-Electro-Mechanical (TEM) analysismodule allows you to perform fully coupledthermal, electrical and electrostatic and mechanicalanalysis.TEM allows you to perform fully coupled static,dynamic, harmonic, transient, contact and postcontactanalyses on linear or non-linear systems.Use TEM for analyzing a wide range ofdevices based on electrostatic, thermal or electrothermalprinciples.Based on a custom version of the leading nonlinearFEM solver from ABAQUS, TEM allows youto tackle large highly non-linear problems. TEMincorporates many custom MEMS algorithmsthat are unmatched by other tools.• Full dynamics capability (all other tools are limitedto quasi-static approximations)• Exposed Face Mesh algorithms: No need tomesh the air gaps. Decouple mechanical andelectrical meshes to solve large problems• Optimized Squeeze Film Damping module forfluid structure interaction (15X faster than typicalNavier-Stokes based solvers).

Rotary ring gyroRate/Coriolis analysisDraper vibratory gyroElectrostatic driveLockheed inertial deviceSqueeze film analysisRaytheon/TI RF switchNon-linear contact analysisHitachiRF Tunable FilterNASAAdaptive opticsCorning3D Optical cross connectNASARadiation detectors

Package and board level analysesIntelliSuite simplifies the packaging ofMEMS devices, reducing the cost of packagingdevelopment. The tools you needto perform die level and board levelpackaging analyses come standard withIntelliSuite.Packaging related stresses, CTE mismatches,shock effects, effects of packagingpressure on device damping, parasiticeffects and high frequency electromagneticeffects can all be modeled withease.IntelliSuite solves most complex packagingproblems involving linear and nonlinear,static, frequency, and dynamic behavior.Stress, strain and warpage calculations,thermal-electrical (joule heating),vibrational analysis including shock testing,damping analysis can all be performedwith easeThis allows you to perform JEDEC, MILSTD, or Belcore tests on packaged devicesbefore costly device fabrication.

Client Corning IncApplication Fiber optic switchingAnalysis Full board level packaging analysis256x256micro-mirror arrayClient Agilent IncApplication Detector chipAnalysis Package Thermo-mechanical analysisFiber block integrationWarpage due to packagingBoard deformationDeflection of the mirrorsFinal Boards with warpagereduction mechanismTemperature distributionStress contoursFinal device

Piezoelectric and piezoresistiveanalysisIntelliSuite ships with the most sophisticatedpiezoelectric and piezoresistivemodeling capabilities in the industry.Our PiezoMEMS module represents acomplete solution for MEMS designersconsidering piezo-sensing or piezoactuationmechanisms.If you are designing piezo-based sensorsand transducers, or investigating piezoacousticcoupling, you will find our designtools invaluable and unsurpassed.Considering piezo actuation for yourMEMS device?IntelliSuite can handle your needs suchas time varying loading, floating conductors,full thermo-electromechanicalmodeling and high frequency analysis.Our advanced coupling algorithms allowyou to go well beyond other FE tools toinvestigate second order coupling suchas temperature dependent piezo properties,hysteresis modeling and piezoresistivejoule heating.

IntelliSuite allows you to model piezoresistive sensors andheating elements with ease. Our specialized tools go beyondother FEM tools on the market allowing you to accuratelydetermine second order effects such as temperaturecoefficients, hysteresis, temperature dependentpiezo properties.Piezoelectric devices such as sensors, resonators andactuators are quickly maturing. IntelliSuite allows youto model a wide range of piezoelectric devices rangingfrom inertial sensors to piezo-acoustic coupleddevices such as BAW/FBAR/SMR devices.Piezoresistive sensors • Piezoelectric sensors and actuators •!Piezoresistivetrimming • High frequency Piezo devices • Piezoacoustic coupling • Bulk AcousticWave devices • Field Bulk Acoustic Resonators • Energy Scavenging

Microfluidics and BioMEMS analysisWe created a full 3D Navier-Stokes solveroptimized for microfluidic applicationsfrom the ground up. Simultaneously, wewent way beyond the existing codebases by adding support for electrokineticphenomena, Red-Ox reactions, acids,bases, ampholytes and fluid structureinteraction.We then added advanced visualizationalgorithms to look at cross-sectionalprofiles, velocity vectors, streamlines andtransient results.Our code base is not only faster at solvingmicrofludics problems but is the onlyMEMS tool for problems from rangingfrom high frequency dielectrophoresisto isoelectric focusing to electroosmoticallyenhanced flow.Discover why top BioMEMS companiesare choosing the IntelliSense solution.

InletMembraneMicro-mixing in a valveConcentration gradient evolutionFlow mixingY combinerFluid Structure InteractionInlet flow - membrane interactionFlow separation deviceMicrofluidics• Electrokinetics • Transport stochiometry • Heat transfer • Free SurfaceFlow • Fluid Structure Interaction • Electrochemistry • Micro-mixing • Electrophoresis• Dielectrophoresis • Capillary flow and electro-separation • Electroosmosis• Electro-hydrodynamics • Flow cyclometry • Micro-pumps and valvesElectrokineticsMultiplex focusingElectro-osmotic driven flowElectrohydrodynamics for coolingElectrophoresis/DielectrophoresisHigh Frequency Waste separationFree surface flowSlide coater

High frequency electromagneticanalysisThe IntelliSuite electromagnetic analysismodule is specifically designed to addressthe needs of researchers in RFMEMS, microwave, and Optical MEMS byproviding fast, accurate, cost-effectivesolutions for high frequency electromagneticphenomena.The Electromagnetics module is the onlyfully integrated high frequency solveravailable for MEMS simulation. Traditionalhigh frequency tools are designed forplanar or quasi-planar structures, not forthe high aspect ratio structures of MEMS.These tools also fail badly when it comesto highly resonant mechanical structures.Additionally, we removed more limitationsfound in most other high frequencytools by adding support for lossy conductorsand dielectric discontinuities. Best ofall, it tightly integrates with the IntelliSuiteenvironment, providing youwith all the tools for your MEMS needs!

Parametric optimization.Here a filter is parametrizedas strip widths,lenghts and gap widths. Theparameters can be controlledby high performanceinternal optimizers for fullwaveoptimization.Create and model complexgeometries such as vias andthrough feeds with ease.

System simulation andsynthesis tools

System model extractor (SME)IntelliSense introduces SME for dramaticallyreducing the computational timeto perform accurate dynamic analysis ofMEMS. Based upon sub-space modelreduction and energy based algorithms,very large non-linear thermoelectromechanicalFEM models can bereduced into computationally efficientbehavioral models.These behavioral models fully capturethe complex non-linear dynamics inherentin MEMS due to electrostatic forces,residual stresses, squeeze film damping,and multiple mechanical degrees offreedom.IntelliSuite is the only toolthat gives you the freedomto create arbitrarydegree of freedom compactmodels. These n-DOF3D models fully capture all of theharmonic modes of the MEMS enablingyou to quickly develop readout or controlelectronics.

SME allows you to createN-DOF system modelsthat accurately capturethe dynamic response ofMEMS 100-1000x fasterthan equivalent FEAsimulations. The responseof a clamped beamdriven at 50 kHz (above)and at 3 MHz (left) accuratelycaptures thebeam motion.

SYNPLE — system simulationDeveloped by IntelliSense to answer theunique needs of the microsystem andnanosystem community, SYNPLE is asystem-level simulator for multi-scale(macro, micro, nano) phenomenon simulations.As a MEMS design professional, youalways seek new ways to realize your designsand, ultimately, bring them to market.With SYNPLE, you can. This revolutionarytool will enable you to work in multipledomains — simply and without limits.While SYNPLE’s range is wide enough tocreate complex simulations, its user interfaceis exactly what the name implies —simple!To further your capabilities, IntelliSenseships SYNPLE with an extensive line ofcomprehensive element libraries for youruse. These include analog, digital, mixedsignal,micromechanics, semi-conductor,MEMS and biological modules. And if thesearen’t enough, SYNPLE’s expandable architecturewill enable you to expand the librariesby creating customized elements ofyour own.

SYNPLE ships with many real worldMEMS compound elements that enableyou to quickly test your concepts. Onesuch element is a 6 DOF inertial device,ideal for modeling accelerometers andgyros. Shown here is the classic startupresponse of a vibratory gyro.AC analysis of a MEMS tunablebandpass filter assembled frombasic elements such as beams,anchors, plates and comb drives.The phase and magnitude plotsare shown.

MEMS-SoC Constructor KitThe MEMS-SoC Constructor Kit is a set ofoptimized Verilog-A libraries for the designof MEMS-based systems on a chip. MEMS-SoC directly fits into popular EDA workflows,allowing you to integrate MEMS andCMOS on the same chip.Complex MEMS structures can be builtfrom atomic elements, such as linear andnon-linear beams, rigid and elastic plates,and electrostatic gaps. For instance, multiplebeams and electrostatic gaps can becombined to form comb drives, while multiplebeams can be joined to form complexserpentine springs.The MEMS-SoC library allows you to performa comprehensive selection of analyseson your MEMS devices — from DC, AC,transient, steady-state, sensitivity, parametricand Monte Carlo analyses.

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