March CS 1701 RIE Operations and Maintenance Manual

EQUIPMENT ORIENTATIONThis section includes a general description of the overall plasma system as well as amore detailed description of the controls and indicators on the RF Generator and MainSystem.GENERAL EQUIPMENT DESCRIPTIONThe CS-1701 Reactive Ion Etcher consists of two modules: a ReactionChamber/Process Controller and a solid state RF Power Generator.Designed for maximum performance and flexibility, March Instrument's CS-1701Reactive Ion Etching systems are tabletop etchers used primarily in decapsulating,resist stripping, etching, and cleaning applications.PROCESS CONTROLLERThe Process Controller monitors andregulates the variable parameters ofthe plasma process, includingchamber pressure, RF power level,process duration, and gas flow rates.The Process Controller can house sixMass Flow Controllers (MFCs); twoare standard, four additional MFCsare available as an option. Thesystem is equipped with a Baratron pressure gauge (capacitance manometer) formaximum accuracy.The unit can be operated in either an automatic or manual mode. In automatic modebuilt-in sequencing will:21