Maintenance & Inspection Guide Leaded ROL™200 ... - Johnstech

Cleaning & Maintenance FrequencyDetermining Maintenance FrequencyDue to a wide range of variables (like those listed below),each Test Floor must determine their optimal cleaning andmaintenance intervals through effective use of statisticalprocess control. By carefully monitoring and recording yieldrates and following good test floor troubleshooting procedures,you will be able to clearly differentiate between interfacevs. maintenance problems and an effective maintenancecleaning cycle can be established to match the needs of eachTest Floor. Contact your Johnstech representative or FieldService for further information or help.Leaded ROL200 Series Product Life SpecificationsGold-Plated Contact (on Matte Tin) 500,000 insertions*Eco-1 Contact (on NiPdAu)300,000 insertions*Eco-1 Contact (on Matte Tin)500,000 insertions*Elastomers300,000 insertions*Housing2,000,000 insertions** Life specifications can vary based on any number of variables.Leaded ROL200SeriesHandler Design and SetupHandlers have a variety of test plane configurations, devicetransportation methods, plunge mechanisms and accessories.Each Handler has its own unique attributes. Handler set-upsthat are not optimized can increase the required maintenancefrequency by contributing to premature Contactor and Elastomerwear and Oxide Build-up on the Contacts. By workingwith Johnstech and your Handler supplier, you can optimizeHandler performance to minimize downtime.Correct Plunge DepthIncorrect plunge depth reduces the effectiveness of the Contact’sself-cleaning wipe and may cause increased Oxide Buildup.It may also adversely affect Elastomer life by creatingtears, cuts or Compression Set (permanent deformation). Seeexamples on Page 10. The plunge depth for each Contactor isspecified on its Design Data Sheet (example on Page 7).Package and Device Plating VariationsVariations in packages can affect your maintenance schedule.Different package vendors, or even different device lots, mayhave varying amounts of Mold Flash that can increase wear onthe Contactor and alter device placement. Also, the methodused for plating the device can vary the rate of debris buildup,and therefore varying the maintenance interval.ContaminantsAccumulation of contaminants (such as Oxides and Mold Flash)will contribute to continuity failures during the test process.General Test Floor Maintenance ActivitiesThe frequency of Handler maintenance procedures also affectsContactor cleaning. For example, how often the Handler andhandler test areas are blown free of debris impacts the effectivenessof the Contactor. Contactors exposed to increasedlevels of foreign debris are likely to require more frequentmaintenance and cleaning.9www.johnstech.com©2010 Johnstech International CorporationAll rights reserved.