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Xilinx 4000-series FPGAs

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Any XC<strong>4000</strong> Series 5-Volt device with its outputs configuredin TTL mode can drive the inputs of any typical 3.3-Volt device. (For a detailed discussion of how to interfacebetween 5 V and 3.3 V devices, see the 3V Products sectionof The Programmable Logic Data Book.)Supported destinations for XC<strong>4000</strong> Series device outputsare shown in Table 13.An output can be configured as open-drain (open-collector)by placing an OBUFT symbol in a schematic or HDL code,then tying the 3-state pin (T) to the output signal, and theinput pin (I) to Ground. (See Figure 19.)Table 13: Supported Destinations for XC<strong>4000</strong> SeriesOutputsDestinationAny typical device, Vcc = 3.3 V,CMOS-threshold inputsAny device, Vcc = 5 V,TTL-threshold inputsAny device, Vcc = 5 V,CMOS-threshold inputsXC<strong>4000</strong> SeriesOutputs3.3 V,CMOS5 V,TTL5 V,CMOS√ √ some 11. Only if destination device has 5-V tolerant inputsOBUFTFigure 19: Open-Drain Output√ √ √UnreliableDataOPADX6702Output Slew RateThe slew rate of each output buffer is, by default, reduced,to minimize power bus transients when switching non-criticalsignals. For critical signals, attach a FAST attribute orproperty to the output buffer or flip-flop.For XC<strong>4000</strong>E devices, maximum total capacitive load forsimultaneous fast mode switching in the same direction is200 pF for all package pins between each Power/Ground√pin pair. For XC<strong>4000</strong>X devices, additional internal Power/Ground pin pairs are connected to special Power andGround planes within the packages, to reduce groundbounce. Therefore, the maximum total capacitive load is300 pF between each external Power/Ground pin pair.Maximum loading may vary for the low-voltage devices.For slew-rate limited outputs this total is two times larger foreach device type: 400 pF for XC<strong>4000</strong>E devices and 600 pFfor XC<strong>4000</strong>X devices. This maximum capacitive loadshould not be exceeded, as it can result in ground bounceof greater than 1.5 V amplitude and more than 5 ns duration.This level of ground bounce may cause undesiredtransient behavior on an output, or in the internal logic. Thisrestriction is common to all high-speed digital ICs, and isnot particular to <strong>Xilinx</strong> or the XC<strong>4000</strong> Series.XC<strong>4000</strong> Series devices have a feature called “Soft Startup,”designed to reduce ground bounce when all outputsare turned on simultaneously at the end of configuration.When the configuration process is finished and the devicestarts up, the first activation of the outputs is automaticallyslew-rate limited. Immediately following the initial activationof the I/O, the slew rate of the individual outputs is determinedby the individual configuration option for each IOB.Global Three-StateA separate Global 3-State line (not shown in Figure 16 orFigure 17) forces all FPGA outputs to the high-impedancestate, unless boundary scan is enabled and is executing anEXTEST instruction. This global net (GTS) does not competewith other routing resources; it uses a dedicated distributionnetwork.GTS can be driven from any user-programmable pin as aglobal 3-state input. To use this global net, place an inputpad and input buffer in the schematic or HDL code, drivingthe GTS pin of the STARTUP symbol. A specific pin locationcan be assigned to this input using a LOC attribute orproperty, just as with any other user-programmable pad. Aninverter can optionally be inserted after the input buffer toinvert the sense of the Global 3-State signal. Using GTS issimilar to GSR. See Figure 3 on page 4-11 for details.Alternatively, GTS can be driven from any internal node.November 10, 1997 (Version 1.4) 4-25

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