Department of Information Technology ... - DOITC Rajasthan
Department of Information Technology ... - DOITC Rajasthan
Department of Information Technology ... - DOITC Rajasthan
- No tags were found...
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
DoIT&C, GoR: RFP Template (eProc)<br />
24) Rejection 56<br />
25) Delivery period & Extent <strong>of</strong> Quantity – Repeat Orders 56<br />
26) Freight 57<br />
27) Payments 57<br />
28) Liquidated Damages (LD) 57<br />
34) Patent Indemnity 59<br />
35) Limitation <strong>of</strong> Liability 60<br />
36) Change in Laws & Regulations Error! Bookmark not defined.<br />
37) Force Majeure 61<br />
38) Change Orders and Contract Amendments 61<br />
39) Termination 62<br />
40) Exit Management 63<br />
7. SPECIAL TERMS AND CONDITIONS OF TENDER & CONTRACT ........................................................................ 68<br />
1) Payment Terms and Schedule 68<br />
2) Service Level Standards/ Requirements/ Agreement 69<br />
3) Change Requests/ Management 69<br />
ANNEXURE-1: BILL OF MATERIAL (BOM) ................................................................................................................. 71<br />
ANNEXURE-2: TECHNICAL SPECIFICATIONS ............................................................................................................ 72<br />
ANNEXURE-3: PRE-BID QUERIES FORMAT {TO BE FILLED BY THE BIDDER} ...................................................................... 73<br />
ANNEXURE-4: BIDDER’S AUTHORIZATION CERTIFICATE {TO BE FILLED BY THE BIDDER}................................................. 74<br />
ANNEXURE-5: SELF-DECLARATION {TO BE FILLED BY THE BIDDER} ................................................................................. 75<br />
ANNEXURE-6: CERTIFICATE OF CONFORMITY/ NO DEVIATION {TO BE FILLED BY THE BIDDER} ...................................... 76<br />
ANNEXURE-7: DECLARATION BY BIDDER {TO SIGNED BY SELECTED BIDDER} ................................................................... 77<br />
ANNEXURE-8: MANUFACTURER’S AUTHORIZATION FORM (MAF) {TO BE FILLED BY THE OEMS} ................................... 78<br />
ANNEXURE-9: UNDERTAKING ON AUTHENTICITY OF COMPUTER EQUIPMENTS ...................................................... 79<br />
{TO BE FILLED BY THE BIDDER (ON RS. 100/- NON-JUDICIAL STAMP PAPER)}........................................................................... 79<br />
ANNEXURE-10: COMPONENTS OFFERED – BOM {TO BE FILLED BY THE BIDDER}............................................................. 80<br />
ANNEXURE-11: FINANCIAL BID COVER LETTER & FORMAT..................................................................................... 81<br />
COVER LETTER {TO BE SUBMITTED BY THE BIDDER ON HIS LETTER HEAD} ............................................................................. 81<br />
ANNEXURE-12: BANK GUARANTEE FORMAT {TO BE SUBMITTED BY THE BIDDER’S BANK} ................................................ 85<br />
ANNEXURE-13: DRAFT AGREEMENT FORMAT {TO BE MUTUALLY SIGNED BY SELECTED BIDDER AND PROCURING ENTITY}....... 90<br />
ANNEXURE-14: FORMAT FOR SUBMISSION OF PROJECT REFERENCES FOR PRE-QUALIFICATION EXPERIENCE...... 93<br />
ANNEXURE-15: FORMAT FOR CONSORTIUM AGREEMENT..................................................................................... 94<br />
ANNEXURE-16: MEMORANDUM OF APPEAL UNDER THE RTPP ACT, 2012 ............................................................. 97<br />
Page 6 <strong>of</strong> 97