PHYSIOLOGICAL-READOUT
ISSCC2017AdvanceProgram
ISSCC2017AdvanceProgram
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
SESSION 11<br />
Tuesday February 7 th , 8:30 AM<br />
Nonvolatile Memory Solutions<br />
Session Chair: Takashi Kono, Renesas Electronics, Tokyo, Japan<br />
Associate Chair: Ki-Tae Park, Samsung Electronics, Hwasung, Korea<br />
8:30 AM<br />
11.1 A 512Gb 3b/Cell Flash Memory on 64-Word-Line-Layer BiCS Technology<br />
R. Yamashita 1 , S. Magia 1 , T. Higuchi 2 , K. Yoneya 2 , T. Yamamura 2 , H. Mizukoshi 1 ,<br />
S. Zaitsu 1 , M. Yamashita 1 , S. Toyama 1 , N. Kamae 1 , J. Lee 1 , S. Chen 1 , J. Tao 1 , W. Mak 1 ,<br />
X. Zhang 1 , Y. Yu 1 , Y. Utsunomiya 2 , Y. Kato 1 , M. Sakai 1 , M. Matsumoto 1 ,<br />
H. Chibvongodze 1 , N. Ookuma 1 , H. Yabe 1 , S. Taigor 1 , R. Samineni 1 , T. Kodama 2 ,<br />
Y. Kamata 2 , Y. Namai 2 , J. Huynh 1 , S-E. Wang 1 , Y. He 1 , T. Pham 1 , V. Saraf 1 , A. Petkar 1 ,<br />
M. Watanabe 1 , K. Hayashi 1 , P. Swarnkar 1 , H. Miwa 1 , A. Pradhan 1 , S. Dey 1 , D. Dwibedy 1 ,<br />
T. Xavier 1 , M. Balaga 1 , S. Agarwal 1 , S. Kulkarni 1 , Z. Papasaheb 1 , S. Deora 1 , P. Hong 1 ,<br />
M. Wei 1 , G. Balakrishnan 1 , T. Ariki 1 , K. Verma 1 , C. Siau 1 , Y. Dong 1 , C-H. Lu 1 , T. Miwa 1 ,<br />
F. Moogat 1<br />
1<br />
Western Digital, Milpitas, CA<br />
2<br />
Toshiba, Yokohama, Japan<br />
9:00 AM<br />
11.2 A 1Mb Embedded NOR Flash Memory with 39μW Program Power for<br />
mm-Scale High-Temperature Sensor Nodes<br />
Q. Dong 1 , Y. Kim 1 , I. Lee 1 , M. Choi 1 , Z. Li 1 , J. Wang 1 , K. Yang 1 , Y-P. Chen 1 , J. Dong 1 , M.<br />
Cho 1 , G. Kim 1 , W-K. Chang 2 , Y-S. Chen 2 , Y-D. Chih 2 , D. Blaauw 1 , D. Sylvester 1<br />
1<br />
University of Michigan, Ann Arbor, MI<br />
2<br />
TSMC, Hsinchu, Taiwan<br />
9:15 AM<br />
11.3 A 10nm 32Kb Low-Voltage Logic-Compatible Anti-Fuse One-Time-<br />
Programmable Memory with Anti-Tampering Sensing Scheme<br />
S-Y. Chou, Y-S. Chen, J-H. Chang, Y-D. Chih, T-Y. J. Chang<br />
TSMC Design Technology, Hsinchu, Taiwan<br />
9:30 AM<br />
11.4 A 512Gb 3b/cell 64-Stacked WL 3D V-NAND Flash Memory<br />
C. Kim, J-H. Cho, W. Jeong, I-H. Park, H-W. Park, D-H. Kim, D. Kang, S. Lee, J-S. Lee,<br />
W. Kim, J. Park, Y-L. Ahn, J. Lee, J-H. Lee, S. Kim, H-J. Yoon, J. Yu, N. Choi, Y. Kwon,<br />
N. Kim, H. Jang, J. Park, S. Song, Y. Park, J. Bang, S. Hong, B. Jeong, H-J. Kim,<br />
C. Lee, Y-S. Min, I. Lee, I-M. Kim, S-H. Kim, D. Yoon, K-S. Kim, Y. Choi, M. Kim,<br />
H. Kim, P. Kwak, J-D. Ihm, D-S. Byeon, J-Y. Lee, K-T. Park, K-H. Kyung<br />
Samsung Electronics, Hwasung, Korea<br />
Break 10:00 AM<br />
25