PHYSIOLOGICAL-READOUT

SESSION 12
Tuesday February 7 th , 10:15 AM
SRAM
Session Chair: Fatih Hamzaoglu, Intel, Hillsboro, OR
Associate Chair: Chun Shiah, Etron, Hsinchu, Taiwan
10:15 AM
12.1 A 7nm 256Mb SRAM in High-K Metal-Gate FinFET Technology with
Write-Assist Circuitry for Low-V MIN Applications
J. Chang 1 , Y-H. Chen 1 , W-M. Chan 1 , S. P. Singh 1 , H. Cheng 1 , H. Fujiwara 1 , J-Y. Lin 1 ,
K-C. Lin 1 , J. Hung 1 , R. Lee 1 , H-J. Liao 1 , J-J. Liaw 2 , Q. Li 2 , C-Y. Lin 2 , M-C. Chiang 2 ,
S-Y. Wu 2
1
TSMC Design Technology, Hsinchu, Taiwan
2
TSMC, Hsinchu, Taiwan
10:45 AM
12.2 A 7nm FinFET SRAM Macro Using EUV Lithography for Peripheral Repair
Analysis
T. Song, H. Kim, W. Rim, Y. Kim, S. Park, C. Park, M. Hong, G. Yang, J. Do, J. Lim,
S. Lee, I. Kim, S. Baek, J. Jung, D. Ha, H. Jang, T. Lee, C-H. Park, B. Kwon, H. Jung,
S. Cho, Y. Choo, J. Choi
Samsung Electronics, Hwasung, Korea
11:15 AM
12.3 A Low-Power and High-Performance 10nm SRAM Architecture for
Mobile Applications
M. Clinton 1 , H. Cheng 2 , H. Liao 2 , R. Lee 2 , C-W. Wu 2 , J. Yang 2 , H-T. Hsieh 2 , F. Wu 2 ,
J-P. Yang 2 , A. Katoch 3 , A. Achyuthan 3 , D. Mikan 1 , B. Sheffield 1 , J. Chang 2
1
TSMC Design Technology, Austin, TX
2
TSMC Design Technology, Hsinchu, Taiwan
3
TSMC Design Technology, Ottawa, Canada
11:45 AM
12.4 1.4Gsearch/s 2Mb/mm 2 TCAM Using Two-Phase-Precharge ML Sensing
and Power-Grid Pre-Conditioning to Reduce Ldi/dt Power-Supply Noise
by 50%
I. Arsovski 1 , M. Fragano 1 , R. M. Houle 1 , A. Patil 1 , V. Butler 1,2 , R. Kim 3 , R. Rodriguez 1 ,
T. Maffitt 4 , J. J. Oler 1 , J. Goss 1 , C. Parkinson 5,6 , M. A. Ziegerhofer 1 , S. Burns 1
1
Globalfoundries, Essex Junction, VT
2
Green Mountain Semiconductor, Burlington, VT
3
Globalfoundries, Endicott, NY
4
IBM Research, Essex Junction, VT
5
Globalfoundries, Raleigh, NC
6
ASIC North, Raleigh, NC
Conclusion 12:15 PM
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