3M & SUSS announce agreement on temporary wafer ... - I-Micronews

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Thin Wafer Processing for 3D TSV Applications Workshop Latest Thin Wafer Support Systems & Backside Processing <strong>SUSS</strong> MicroTec invites you to join us as industry leading experts explore the challenging process of temporary bonding and debonding for 3D integration schemes. Materials companies and industry manufacturers will address the following topics: + Multiple temporary bond materials and processes + Advances in processing on thin wafers on carriers + Universal bonder platforms Free workshop during SEMICON West Wednesday, July 15-09 St. Regis Hotel, San Francisco, California 2pm – 5pm Workshop 5pm – 6pm Reception Click here to register for this FREE workshop www.suss.com E-Mail: info@suss.com
J U L Y 2 0 0 9 i s s u e n ° 1 1 N e w s l e t t e r o n 3 D I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s C O M P A N Y P R O F I L E IPD – 2009 Report - Technologies, Applications, Markets & Players The first complete study on Thin Film Integrated Passive & Active Devices Market trends From a commodity technology initially developed to replace bulky discrete passive components, thinfilm Integrated Passive Devices (IPD’s) are now a growing industry trend. They compete with discrete passive components on the one hand, and with organic or ceramic-based thick-film integrated passive devices on the other. They can be used as wafer-level packaged single chip solutions for interface conditioning, or they can be assembled with active IC’s in Systems-in-a- Package (SiP), or they can be used as package substrates or as system sub mounts. Based on IC and MEMS manufacturing technology, IPD’s offer designers miniature integration while maintaining high performance levels. Wireless SiP Module Technology Trend Logic eFlash eDRAM Analog RF + I/Os Interposer Whether it is to reduce space on the application board, to enhance performance or to reduce cost at the system level, IPD’s are spreading to most electronic sectors, from low volume to mass market businesses in aerospace, military, medical, industrial, lighting, communications, and PC applications. Over just a few years, IPD’s have become an essential enabler of System-in-Package (SiP) and heterogeneous integration in general. They greatly contribute to bridging the increasing gap between the ever-shrinking geometries of CMOS IC’s and the lagging packaging technologies, while allowing the integration of such diverse electronic functions as sensors, MEMS, RF receivers, transmitters, power amplifiers, power management units and digital Courtesy of ASE Wireless SiP Module Technology Trend processors together into increasingly complete and autonomous systems. More than just a new packaging technique, and quite different from regular Integrated Circuit technologies, thin-film IPD’s truly import packaging into the clean room and are about to extend the use of Wafer-Level Packaging (WLP) not only to most IC package platforms but to the industry of discrete passive components as well. As a bridging technology, IPD’s involve the complete semiconductor value chain: from equipment and material suppliers to fabless IDMs to foundries to substrate suppliers to OSATs and OEMs. Yole estimates the total IPD market to represent more than $600M this year and we expect it to reach $1B by 2013. In this report, you will find comprehensive links between the technologies and their applications, as well as the market sizes by application and the market share and strategies of the major players. The technology trends and the challenges to be addressed are detailed, and market segment forecasts up to 2015 are given. Applications / Market windows for IPDs Network & Server Equipments Next Gen. Gaming Devices / Stations LED lighting Set-Top Box Industrial & Home Automotive Networking Car Electronic > 10M units HDTV Lower Volumes Medical Electronic MOTIVATIONS: • Smaller Size & Lighter Weight • Innovative Function & Flexible Design • Integrated System • High Electrical Performance • Low Cost & Time to Market > 100M units DSC > 1M units Netbook & MID Mil & Aerospace > 1B units High Volume PMP Mobile phones This report not only describes the market and the associated technologies deep inside the applications, but it also provides a broad overview of the thin-film IPD market and forthcoming growth opportunities. Who should buy this report? IPD manufacturers Foundries - Integrated semiconductor Device Manufacturers Assembly and Test Service companies Electronic module makers and Original Equipment Makers Equipment and Material manufacturers PCB manufacturers Discrete component makers Financial and strategic investors For more information, please contact Davi Jourdan at jourdan@yole.fr Printed on recycled paper Applications / Market windows for IPDs 11
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3M & SUSS announce agreement on temporary wafer ... - I-Micronews

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